JPS5748241A - Bonding method for chip - Google Patents

Bonding method for chip

Info

Publication number
JPS5748241A
JPS5748241A JP55124182A JP12418280A JPS5748241A JP S5748241 A JPS5748241 A JP S5748241A JP 55124182 A JP55124182 A JP 55124182A JP 12418280 A JP12418280 A JP 12418280A JP S5748241 A JPS5748241 A JP S5748241A
Authority
JP
Japan
Prior art keywords
chip
collet
band
package
band surface
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP55124182A
Other languages
English (en)
Japanese (ja)
Other versions
JPS636141B2 (cg-RX-API-DMAC10.html
Inventor
Tsuyoshi Aoki
Junichi Yano
Takehisa Sugawara
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Fujitsu Ltd
Original Assignee
Fujitsu Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Fujitsu Ltd filed Critical Fujitsu Ltd
Priority to JP55124182A priority Critical patent/JPS5748241A/ja
Publication of JPS5748241A publication Critical patent/JPS5748241A/ja
Publication of JPS636141B2 publication Critical patent/JPS636141B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H10P72/0446—
    • H10P72/50—
    • H10W72/0711—
    • H10W72/073—
    • H10W72/07352—
    • H10W72/321—
    • H10W90/734—

Landscapes

  • Die Bonding (AREA)
JP55124182A 1980-09-08 1980-09-08 Bonding method for chip Granted JPS5748241A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP55124182A JPS5748241A (en) 1980-09-08 1980-09-08 Bonding method for chip

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP55124182A JPS5748241A (en) 1980-09-08 1980-09-08 Bonding method for chip

Publications (2)

Publication Number Publication Date
JPS5748241A true JPS5748241A (en) 1982-03-19
JPS636141B2 JPS636141B2 (cg-RX-API-DMAC10.html) 1988-02-08

Family

ID=14879001

Family Applications (1)

Application Number Title Priority Date Filing Date
JP55124182A Granted JPS5748241A (en) 1980-09-08 1980-09-08 Bonding method for chip

Country Status (1)

Country Link
JP (1) JPS5748241A (cg-RX-API-DMAC10.html)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2000294573A (ja) * 1999-04-07 2000-10-20 Casio Comput Co Ltd ボンディング装置
US6750431B2 (en) * 2002-07-24 2004-06-15 Hakko Corporation Electric component removing device

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2000294573A (ja) * 1999-04-07 2000-10-20 Casio Comput Co Ltd ボンディング装置
US6750431B2 (en) * 2002-07-24 2004-06-15 Hakko Corporation Electric component removing device

Also Published As

Publication number Publication date
JPS636141B2 (cg-RX-API-DMAC10.html) 1988-02-08

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