JPS5745262A - Sealing and fitting structure of semiconductor device - Google Patents

Sealing and fitting structure of semiconductor device

Info

Publication number
JPS5745262A
JPS5745262A JP55119843A JP11984380A JPS5745262A JP S5745262 A JPS5745262 A JP S5745262A JP 55119843 A JP55119843 A JP 55119843A JP 11984380 A JP11984380 A JP 11984380A JP S5745262 A JPS5745262 A JP S5745262A
Authority
JP
Japan
Prior art keywords
cap
sealing
ceramic
melting point
semiconductor element
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP55119843A
Other languages
English (en)
Japanese (ja)
Other versions
JPS634350B2 (enExample
Inventor
Toshio Hamano
Hidehiko Akasaki
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Fujitsu Ltd
Original Assignee
Fujitsu Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Fujitsu Ltd filed Critical Fujitsu Ltd
Priority to JP55119843A priority Critical patent/JPS5745262A/ja
Publication of JPS5745262A publication Critical patent/JPS5745262A/ja
Publication of JPS634350B2 publication Critical patent/JPS634350B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H10W76/60—
    • H10W72/5522—
    • H10W90/754—

Landscapes

  • Lead Frames For Integrated Circuits (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
JP55119843A 1980-09-01 1980-09-01 Sealing and fitting structure of semiconductor device Granted JPS5745262A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP55119843A JPS5745262A (en) 1980-09-01 1980-09-01 Sealing and fitting structure of semiconductor device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP55119843A JPS5745262A (en) 1980-09-01 1980-09-01 Sealing and fitting structure of semiconductor device

Publications (2)

Publication Number Publication Date
JPS5745262A true JPS5745262A (en) 1982-03-15
JPS634350B2 JPS634350B2 (enExample) 1988-01-28

Family

ID=14771630

Family Applications (1)

Application Number Title Priority Date Filing Date
JP55119843A Granted JPS5745262A (en) 1980-09-01 1980-09-01 Sealing and fitting structure of semiconductor device

Country Status (1)

Country Link
JP (1) JPS5745262A (enExample)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6027433U (ja) * 1983-07-29 1985-02-25 松下電工株式会社 電子部品の実装構造
EP0098176A3 (en) * 1982-06-30 1985-09-25 Fujitsu Limited The packaging of semiconductor chips
US6630727B1 (en) * 1998-03-03 2003-10-07 Infineon Technologies Ag Modularly expandable multi-layered semiconductor component

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS53130974U (enExample) * 1977-03-23 1978-10-17
JPS5559746A (en) * 1978-10-27 1980-05-06 Hitachi Ltd Semiconductor device and its mounting circuit device

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS53130974U (enExample) * 1977-03-23 1978-10-17
JPS5559746A (en) * 1978-10-27 1980-05-06 Hitachi Ltd Semiconductor device and its mounting circuit device

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0098176A3 (en) * 1982-06-30 1985-09-25 Fujitsu Limited The packaging of semiconductor chips
JPS6027433U (ja) * 1983-07-29 1985-02-25 松下電工株式会社 電子部品の実装構造
US6630727B1 (en) * 1998-03-03 2003-10-07 Infineon Technologies Ag Modularly expandable multi-layered semiconductor component

Also Published As

Publication number Publication date
JPS634350B2 (enExample) 1988-01-28

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