JPS574122A - Formation of contact hole - Google Patents
Formation of contact holeInfo
- Publication number
- JPS574122A JPS574122A JP7806180A JP7806180A JPS574122A JP S574122 A JPS574122 A JP S574122A JP 7806180 A JP7806180 A JP 7806180A JP 7806180 A JP7806180 A JP 7806180A JP S574122 A JPS574122 A JP S574122A
- Authority
- JP
- Japan
- Prior art keywords
- film
- contact hole
- hole
- exposed
- si3n4
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 230000015572 biosynthetic process Effects 0.000 title 1
- 239000010408 film Substances 0.000 abstract 12
- 229910052581 Si3N4 Inorganic materials 0.000 abstract 4
- 239000000758 substrate Substances 0.000 abstract 3
- 238000005530 etching Methods 0.000 abstract 2
- 238000000034 method Methods 0.000 abstract 2
- 238000007665 sagging Methods 0.000 abstract 2
- 239000004065 semiconductor Substances 0.000 abstract 2
- 229910019142 PO4 Inorganic materials 0.000 abstract 1
- 239000011248 coating agent Substances 0.000 abstract 1
- 238000000576 coating method Methods 0.000 abstract 1
- NBIIXXVUZAFLBC-UHFFFAOYSA-K phosphate Chemical compound [O-]P([O-])([O-])=O NBIIXXVUZAFLBC-UHFFFAOYSA-K 0.000 abstract 1
- 239000010452 phosphate Substances 0.000 abstract 1
- 239000010409 thin film Substances 0.000 abstract 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/28—Manufacture of electrodes on semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/268
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Electrodes Of Semiconductors (AREA)
- Internal Circuitry In Semiconductor Integrated Circuit Devices (AREA)
- Weting (AREA)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP7806180A JPS574122A (en) | 1980-06-09 | 1980-06-09 | Formation of contact hole |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP7806180A JPS574122A (en) | 1980-06-09 | 1980-06-09 | Formation of contact hole |
Publications (1)
Publication Number | Publication Date |
---|---|
JPS574122A true JPS574122A (en) | 1982-01-09 |
Family
ID=13651334
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP7806180A Pending JPS574122A (en) | 1980-06-09 | 1980-06-09 | Formation of contact hole |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS574122A (ja) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH02142122A (ja) * | 1988-11-22 | 1990-05-31 | Hitachi Ltd | 半導体装置の製造方法 |
-
1980
- 1980-06-09 JP JP7806180A patent/JPS574122A/ja active Pending
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH02142122A (ja) * | 1988-11-22 | 1990-05-31 | Hitachi Ltd | 半導体装置の製造方法 |
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