JPS5739190A - Preparation of solder plated or tin plated wire - Google Patents
Preparation of solder plated or tin plated wireInfo
- Publication number
- JPS5739190A JPS5739190A JP15344680A JP15344680A JPS5739190A JP S5739190 A JPS5739190 A JP S5739190A JP 15344680 A JP15344680 A JP 15344680A JP 15344680 A JP15344680 A JP 15344680A JP S5739190 A JPS5739190 A JP S5739190A
- Authority
- JP
- Japan
- Prior art keywords
- plating
- wire
- solder
- plated
- copper
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 229910000679 solder Inorganic materials 0.000 title abstract 5
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 title abstract 3
- 238000007747 plating Methods 0.000 abstract 7
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 abstract 3
- 229910052802 copper Inorganic materials 0.000 abstract 3
- 239000010949 copper Substances 0.000 abstract 3
- 229910000881 Cu alloy Inorganic materials 0.000 abstract 2
- 238000000034 method Methods 0.000 abstract 2
- 238000009713 electroplating Methods 0.000 abstract 1
- WABPQHHGFIMREM-UHFFFAOYSA-N lead(0) Chemical compound [Pb] WABPQHHGFIMREM-UHFFFAOYSA-N 0.000 abstract 1
- 238000002844 melting Methods 0.000 abstract 1
- 230000008018 melting Effects 0.000 abstract 1
- 239000000203 mixture Substances 0.000 abstract 1
- 238000005476 soldering Methods 0.000 abstract 1
Landscapes
- Electroplating Methods And Accessories (AREA)
- Manufacture Of Switches (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP15344680A JPS5739190A (en) | 1980-10-31 | 1980-10-31 | Preparation of solder plated or tin plated wire |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP15344680A JPS5739190A (en) | 1980-10-31 | 1980-10-31 | Preparation of solder plated or tin plated wire |
Related Parent Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP811277A Division JPS5393133A (en) | 1977-01-27 | 1977-01-27 | Preparation of solder plating wire |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS5739190A true JPS5739190A (en) | 1982-03-04 |
| JPS6325078B2 JPS6325078B2 (enrdf_load_stackoverflow) | 1988-05-24 |
Family
ID=15562720
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP15344680A Granted JPS5739190A (en) | 1980-10-31 | 1980-10-31 | Preparation of solder plated or tin plated wire |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS5739190A (enrdf_load_stackoverflow) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5993898A (ja) * | 1982-11-17 | 1984-05-30 | Nippon Mining Co Ltd | 接触子の製造方法 |
Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH04104980U (ja) * | 1991-02-21 | 1992-09-09 | 株式会社イナツクス | 洗面又は流し台 |
| JPH04104979U (ja) * | 1991-02-21 | 1992-09-09 | 株式会社イナツクス | 洗面台 |
-
1980
- 1980-10-31 JP JP15344680A patent/JPS5739190A/ja active Granted
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5993898A (ja) * | 1982-11-17 | 1984-05-30 | Nippon Mining Co Ltd | 接触子の製造方法 |
Also Published As
| Publication number | Publication date |
|---|---|
| JPS6325078B2 (enrdf_load_stackoverflow) | 1988-05-24 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| US4756467A (en) | Solderable elements and method for forming same | |
| JPS54157296A (en) | Electrode structure and the manufacturing method | |
| JPS5739190A (en) | Preparation of solder plated or tin plated wire | |
| JP3303594B2 (ja) | 耐熱銀被覆複合体とその製造方法 | |
| US3639218A (en) | Shelf life improvement of electroplated solder | |
| JP3243195B2 (ja) | リフロー半田めっき材およびその製造方法 | |
| JPS5481777A (en) | Lead frame structure with intermediate layer | |
| JPS5472483A (en) | Manufacture of heat-resistant wiring conductor | |
| JPH02173294A (ja) | 錫または錫合金めっき材のリフロー処理方法 | |
| JPS5468986A (en) | Heat-resisting electric conductor for wiring | |
| JPS56119792A (en) | Electroplating method | |
| JPH0221508A (ja) | 極細巻線用導体 | |
| JPS56136965A (en) | Plating method | |
| JPS6486417A (en) | Contact and manufacture thereof | |
| JPS6220895A (ja) | Ｃｕ又はＣｕ合金母材にＳｎ又はＳｎ合金めつきを施す方法 | |
| JPS5656745A (en) | Composite lead wire and its production | |
| SU1172909A1 (ru) | Состав дл нанесени покрыти на углеродные материалы | |
| JPS59170250A (ja) | 銅被覆鋼線の製造方法 | |
| JPS575854A (en) | Production of tin-plated article | |
| JPS56152992A (en) | Tin-lead alloy plated lead wire | |
| KR800001622B1 (ko) | 리이드 프레임용 금속 스트립 | |
| JPS56142886A (en) | Tin plating method for aluminum alloy | |
| JPH01104796A (ja) | 多元合金被膜の形成方法 | |
| JPS56126094A (en) | Welding wire | |
| JPS6419794A (en) | Method of soldering electronic component |