JPS6481183A - Connection structure of superconducting wire - Google Patents

Connection structure of superconducting wire

Info

Publication number
JPS6481183A
JPS6481183A JP23802187A JP23802187A JPS6481183A JP S6481183 A JPS6481183 A JP S6481183A JP 23802187 A JP23802187 A JP 23802187A JP 23802187 A JP23802187 A JP 23802187A JP S6481183 A JPS6481183 A JP S6481183A
Authority
JP
Japan
Prior art keywords
layer
superconducting
alloy
soldered
plating
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP23802187A
Other languages
Japanese (ja)
Inventor
Mamoru Hamada
Yoshiyuki Monju
Takeshi Kawai
Kenichi Inoue
Akio Suzuki
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Kobe Steel Ltd
Original Assignee
Kobe Steel Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Kobe Steel Ltd filed Critical Kobe Steel Ltd
Priority to JP23802187A priority Critical patent/JPS6481183A/en
Publication of JPS6481183A publication Critical patent/JPS6481183A/en
Pending legal-status Critical Current

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  • Manufacturing Of Electrical Connectors (AREA)

Abstract

PURPOSE:To minimize resistance occurring at a soldered layer by composing the layer of a soldering alloy of a specified composition and a superconducting material of a specified composition, and plating the surface of the superconducting material with the alloy and Cu good in wettability. CONSTITUTION:A soldered layer 4 is composed of such as an alloy of Pb and Sn an alloy mainly made of In and Ag, material such as NbTi, Nb3Sn, V3Ga, Nb3Ga, Nb3Ge, Nb3Al, and one which increases superconductivity under conditions where a superconducting wire connected is used. This layer is plated at the surface, with a process of electrolytic plating, chemical plating, CVD, or spattering for the purpose to improve the wettability with a soldering alloy. This layer is formed in the form of a powder and a short filament and dispersed almost uniformly in the soldering alloy. Through this layer, superconducting core wires 3, 3' are buried within stabilizer 2, 2' in first and second superconducting wires 1, 1'. It is thus possible to reduce generation of heat while minimizing resistance occurs at the layer 4 soldered when first and second superconducting wires 1, 1' are connected each other.
JP23802187A 1987-09-21 1987-09-21 Connection structure of superconducting wire Pending JPS6481183A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP23802187A JPS6481183A (en) 1987-09-21 1987-09-21 Connection structure of superconducting wire

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP23802187A JPS6481183A (en) 1987-09-21 1987-09-21 Connection structure of superconducting wire

Publications (1)

Publication Number Publication Date
JPS6481183A true JPS6481183A (en) 1989-03-27

Family

ID=17023981

Family Applications (1)

Application Number Title Priority Date Filing Date
JP23802187A Pending JPS6481183A (en) 1987-09-21 1987-09-21 Connection structure of superconducting wire

Country Status (1)

Country Link
JP (1) JPS6481183A (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH02217157A (en) * 1989-02-17 1990-08-29 Ishikawajima Harima Heavy Ind Co Ltd Soldering method for superconducting wire

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH02217157A (en) * 1989-02-17 1990-08-29 Ishikawajima Harima Heavy Ind Co Ltd Soldering method for superconducting wire

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