JPS6481183A - Connection structure of superconducting wire - Google Patents
Connection structure of superconducting wireInfo
- Publication number
- JPS6481183A JPS6481183A JP23802187A JP23802187A JPS6481183A JP S6481183 A JPS6481183 A JP S6481183A JP 23802187 A JP23802187 A JP 23802187A JP 23802187 A JP23802187 A JP 23802187A JP S6481183 A JPS6481183 A JP S6481183A
- Authority
- JP
- Japan
- Prior art keywords
- layer
- superconducting
- alloy
- soldered
- plating
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Landscapes
- Manufacturing Of Electrical Connectors (AREA)
Abstract
PURPOSE:To minimize resistance occurring at a soldered layer by composing the layer of a soldering alloy of a specified composition and a superconducting material of a specified composition, and plating the surface of the superconducting material with the alloy and Cu good in wettability. CONSTITUTION:A soldered layer 4 is composed of such as an alloy of Pb and Sn an alloy mainly made of In and Ag, material such as NbTi, Nb3Sn, V3Ga, Nb3Ga, Nb3Ge, Nb3Al, and one which increases superconductivity under conditions where a superconducting wire connected is used. This layer is plated at the surface, with a process of electrolytic plating, chemical plating, CVD, or spattering for the purpose to improve the wettability with a soldering alloy. This layer is formed in the form of a powder and a short filament and dispersed almost uniformly in the soldering alloy. Through this layer, superconducting core wires 3, 3' are buried within stabilizer 2, 2' in first and second superconducting wires 1, 1'. It is thus possible to reduce generation of heat while minimizing resistance occurs at the layer 4 soldered when first and second superconducting wires 1, 1' are connected each other.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP23802187A JPS6481183A (en) | 1987-09-21 | 1987-09-21 | Connection structure of superconducting wire |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP23802187A JPS6481183A (en) | 1987-09-21 | 1987-09-21 | Connection structure of superconducting wire |
Publications (1)
Publication Number | Publication Date |
---|---|
JPS6481183A true JPS6481183A (en) | 1989-03-27 |
Family
ID=17023981
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP23802187A Pending JPS6481183A (en) | 1987-09-21 | 1987-09-21 | Connection structure of superconducting wire |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS6481183A (en) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH02217157A (en) * | 1989-02-17 | 1990-08-29 | Ishikawajima Harima Heavy Ind Co Ltd | Soldering method for superconducting wire |
-
1987
- 1987-09-21 JP JP23802187A patent/JPS6481183A/en active Pending
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH02217157A (en) * | 1989-02-17 | 1990-08-29 | Ishikawajima Harima Heavy Ind Co Ltd | Soldering method for superconducting wire |
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