JPS5737235A - Semiconductor pressure-sensitive device - Google Patents
Semiconductor pressure-sensitive deviceInfo
- Publication number
- JPS5737235A JPS5737235A JP11379080A JP11379080A JPS5737235A JP S5737235 A JPS5737235 A JP S5737235A JP 11379080 A JP11379080 A JP 11379080A JP 11379080 A JP11379080 A JP 11379080A JP S5737235 A JPS5737235 A JP S5737235A
- Authority
- JP
- Japan
- Prior art keywords
- diaphragm
- thermal strain
- thin
- thin film
- thermal
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01L—MEASURING FORCE, STRESS, TORQUE, WORK, MECHANICAL POWER, MECHANICAL EFFICIENCY, OR FLUID PRESSURE
- G01L9/00—Measuring steady of quasi-steady pressure of fluid or fluent solid material by electric or magnetic pressure-sensitive elements; Transmitting or indicating the displacement of mechanical pressure-sensitive elements, used to measure the steady or quasi-steady pressure of a fluid or fluent solid material, by electric or magnetic means
- G01L9/0041—Transmitting or indicating the displacement of flexible diaphragms
- G01L9/0051—Transmitting or indicating the displacement of flexible diaphragms using variations in ohmic resistance
- G01L9/0052—Transmitting or indicating the displacement of flexible diaphragms using variations in ohmic resistance of piezoresistive elements
- G01L9/0054—Transmitting or indicating the displacement of flexible diaphragms using variations in ohmic resistance of piezoresistive elements integral with a semiconducting diaphragm
Landscapes
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Measuring Fluid Pressure (AREA)
Abstract
PURPOSE:To keep a changed mechanically by making partially a semiconductor substrate thin to constitute the thin wall part as a diaphragm having a thermal strain and by deforming the diaphragm in a concave shape or a convex shape by the thermal strain. CONSTITUTION:A silicon semiconductor substrate 10 is made patially thin by a concave part 11, and the thin wall part is made to be a diaphragm 12. And on the diaphragm 12, a thin film 16, e.g., silicon oxide, different in the thermal expansion coefficient from silicon being the raw material of said diaphragm 12 is formed. Said thin film 16 is quenched in a thermal oxidation process, accordingly, a large thermal strain is generated along the interface between the thin film 16 and the diaphragm 12, and by said thermal strain, the diaphragm 12 is deformed in a concave shape. In said instance, the diaphragm 12 can hold the deformed state mechanically by said thermal strain when the external pressure is applied from the deformed side.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP11379080A JPS5737235A (en) | 1980-08-19 | 1980-08-19 | Semiconductor pressure-sensitive device |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP11379080A JPS5737235A (en) | 1980-08-19 | 1980-08-19 | Semiconductor pressure-sensitive device |
Publications (1)
Publication Number | Publication Date |
---|---|
JPS5737235A true JPS5737235A (en) | 1982-03-01 |
Family
ID=14621148
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP11379080A Pending JPS5737235A (en) | 1980-08-19 | 1980-08-19 | Semiconductor pressure-sensitive device |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS5737235A (en) |
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS60201228A (en) * | 1984-03-27 | 1985-10-11 | Yokogawa Hokushin Electric Corp | Pressure sensor |
JPS60201229A (en) * | 1984-03-27 | 1985-10-11 | Yokogawa Hokushin Electric Corp | Pressure sensor |
JP2014507666A (en) * | 2011-03-09 | 2014-03-27 | オプセンス インコーポレイテッド | Compact high-sensitivity pressure sensor |
-
1980
- 1980-08-19 JP JP11379080A patent/JPS5737235A/en active Pending
Cited By (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS60201228A (en) * | 1984-03-27 | 1985-10-11 | Yokogawa Hokushin Electric Corp | Pressure sensor |
JPS60201229A (en) * | 1984-03-27 | 1985-10-11 | Yokogawa Hokushin Electric Corp | Pressure sensor |
JPH0542609B2 (en) * | 1984-03-27 | 1993-06-29 | Yokogawa Electric Corp | |
JPH0542610B2 (en) * | 1984-03-27 | 1993-06-29 | Yokogawa Electric Corp | |
JP2014507666A (en) * | 2011-03-09 | 2014-03-27 | オプセンス インコーポレイテッド | Compact high-sensitivity pressure sensor |
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