JPS53119693A - Semiconductor pressure transducer - Google Patents
Semiconductor pressure transducerInfo
- Publication number
- JPS53119693A JPS53119693A JP3482877A JP3482877A JPS53119693A JP S53119693 A JPS53119693 A JP S53119693A JP 3482877 A JP3482877 A JP 3482877A JP 3482877 A JP3482877 A JP 3482877A JP S53119693 A JPS53119693 A JP S53119693A
- Authority
- JP
- Japan
- Prior art keywords
- pressure transducer
- semiconductor pressure
- bonding
- encircle
- diaphragm
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Landscapes
- Measuring Fluid Pressure (AREA)
- Pressure Sensors (AREA)
Abstract
PURPOSE: To make a device of firm bonding to a fixing base and less temperature hysteresis by bonding, for example, SiO2 film on the bonding end face of a pressure transducing substrate in the state of leaving part thereof so as to encircle a diaphragm.
COPYRIGHT: (C)1978,JPO&Japio
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP3482877A JPS53119693A (en) | 1977-03-29 | 1977-03-29 | Semiconductor pressure transducer |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP3482877A JPS53119693A (en) | 1977-03-29 | 1977-03-29 | Semiconductor pressure transducer |
Publications (1)
Publication Number | Publication Date |
---|---|
JPS53119693A true JPS53119693A (en) | 1978-10-19 |
Family
ID=12425050
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP3482877A Pending JPS53119693A (en) | 1977-03-29 | 1977-03-29 | Semiconductor pressure transducer |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS53119693A (en) |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4929999A (en) * | 1988-04-08 | 1990-05-29 | U.S. Philips Corporation | Combination of a support and a semiconductor body and method of manufacturing such a combination |
US5721446A (en) * | 1995-01-19 | 1998-02-24 | Mitsubishi Denki Kabushiki Kaisha | Semiconductor pressure sensor with spacing member disposed between sensor and substrate |
-
1977
- 1977-03-29 JP JP3482877A patent/JPS53119693A/en active Pending
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4929999A (en) * | 1988-04-08 | 1990-05-29 | U.S. Philips Corporation | Combination of a support and a semiconductor body and method of manufacturing such a combination |
US5721446A (en) * | 1995-01-19 | 1998-02-24 | Mitsubishi Denki Kabushiki Kaisha | Semiconductor pressure sensor with spacing member disposed between sensor and substrate |
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