JPS53131300A - Production of silicon oxide film - Google Patents
Production of silicon oxide filmInfo
- Publication number
- JPS53131300A JPS53131300A JP11880077A JP11880077A JPS53131300A JP S53131300 A JPS53131300 A JP S53131300A JP 11880077 A JP11880077 A JP 11880077A JP 11880077 A JP11880077 A JP 11880077A JP S53131300 A JPS53131300 A JP S53131300A
- Authority
- JP
- Japan
- Prior art keywords
- oxide film
- silicon oxide
- production
- gas
- spraying
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Classifications
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C16/00—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
- C23C16/22—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the deposition of inorganic material, other than metallic material
- C23C16/30—Deposition of compounds, mixtures or solid solutions, e.g. borides, carbides, nitrides
- C23C16/40—Oxides
- C23C16/401—Oxides containing silicon
- C23C16/402—Silicon dioxide
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C16/00—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
- C23C16/44—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating
- C23C16/455—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating characterised by the method used for introducing gases into reaction chamber or for modifying gas flows in reaction chamber
Landscapes
- Chemical & Material Sciences (AREA)
- General Chemical & Material Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Engineering & Computer Science (AREA)
- Materials Engineering (AREA)
- Mechanical Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Inorganic Chemistry (AREA)
- Crystals, And After-Treatments Of Crystals (AREA)
- Chemical Vapour Deposition (AREA)
Abstract
PURPOSE:To economically produce a uniform silicon oxide film in a high yield by spraying an oxide gas and a silicide gas upon a substrate set opposite to the gas streams in a reactor under reduced press. or a vacuum.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP52118800A JPS5824374B2 (en) | 1977-10-03 | 1977-10-03 | Silicon oxide film production method |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP52118800A JPS5824374B2 (en) | 1977-10-03 | 1977-10-03 | Silicon oxide film production method |
Related Parent Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP4149371A Division JPS5652877B1 (en) | 1971-06-10 | 1971-06-10 |
Publications (2)
Publication Number | Publication Date |
---|---|
JPS53131300A true JPS53131300A (en) | 1978-11-15 |
JPS5824374B2 JPS5824374B2 (en) | 1983-05-20 |
Family
ID=14745417
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP52118800A Expired JPS5824374B2 (en) | 1977-10-03 | 1977-10-03 | Silicon oxide film production method |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS5824374B2 (en) |
Cited By (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH02194177A (en) * | 1989-01-23 | 1990-07-31 | Anelva Corp | Apparatus and method for producing thin film |
USRE36623E (en) * | 1986-12-19 | 2000-03-21 | Applied Materials, Inc. | Process for PECVD of silicon oxide using TEOS decomposition |
US6167834B1 (en) | 1986-12-19 | 2001-01-02 | Applied Materials, Inc. | Thermal CVD/PECVD reactor and use for thermal chemical vapor deposition of silicon dioxide and in-situ multi-step planarized process |
JP2006199570A (en) * | 2004-12-24 | 2006-08-03 | Humo Laboratory Ltd | Manufacturing apparatus of quartz crystal thin film |
JP2006206422A (en) * | 2004-12-27 | 2006-08-10 | Humo Laboratory Ltd | Apparatus for manufacturing quartz crystal thin film |
Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS4515151Y1 (en) * | 1967-04-03 | 1970-06-25 | ||
JPS5132597A (en) * | 1974-09-11 | 1976-03-19 | Kanebo Ltd | Pirido * 2 33d * pirimijinjudotai no seizoho |
-
1977
- 1977-10-03 JP JP52118800A patent/JPS5824374B2/en not_active Expired
Patent Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS4515151Y1 (en) * | 1967-04-03 | 1970-06-25 | ||
JPS5132597A (en) * | 1974-09-11 | 1976-03-19 | Kanebo Ltd | Pirido * 2 33d * pirimijinjudotai no seizoho |
Cited By (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
USRE36623E (en) * | 1986-12-19 | 2000-03-21 | Applied Materials, Inc. | Process for PECVD of silicon oxide using TEOS decomposition |
US6167834B1 (en) | 1986-12-19 | 2001-01-02 | Applied Materials, Inc. | Thermal CVD/PECVD reactor and use for thermal chemical vapor deposition of silicon dioxide and in-situ multi-step planarized process |
JPH02194177A (en) * | 1989-01-23 | 1990-07-31 | Anelva Corp | Apparatus and method for producing thin film |
JP2006199570A (en) * | 2004-12-24 | 2006-08-03 | Humo Laboratory Ltd | Manufacturing apparatus of quartz crystal thin film |
JP4682001B2 (en) * | 2004-12-24 | 2011-05-11 | 株式会社ヒューモラボラトリー | Crystal thin film manufacturing equipment |
JP2006206422A (en) * | 2004-12-27 | 2006-08-10 | Humo Laboratory Ltd | Apparatus for manufacturing quartz crystal thin film |
Also Published As
Publication number | Publication date |
---|---|
JPS5824374B2 (en) | 1983-05-20 |
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