JPS57125828A - Semiconductor pressure sensor for car - Google Patents

Semiconductor pressure sensor for car

Info

Publication number
JPS57125828A
JPS57125828A JP1335181A JP1335181A JPS57125828A JP S57125828 A JPS57125828 A JP S57125828A JP 1335181 A JP1335181 A JP 1335181A JP 1335181 A JP1335181 A JP 1335181A JP S57125828 A JPS57125828 A JP S57125828A
Authority
JP
Japan
Prior art keywords
pressure sensor
semiconductor
projecting parts
supporting means
semiconductor pressure
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP1335181A
Other languages
Japanese (ja)
Inventor
Shigeaki Hirano
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Mitsubishi Electric Corp
Original Assignee
Mitsubishi Electric Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Mitsubishi Electric Corp filed Critical Mitsubishi Electric Corp
Priority to JP1335181A priority Critical patent/JPS57125828A/en
Publication of JPS57125828A publication Critical patent/JPS57125828A/en
Pending legal-status Critical Current

Links

Classifications

    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01L—MEASURING FORCE, STRESS, TORQUE, WORK, MECHANICAL POWER, MECHANICAL EFFICIENCY, OR FLUID PRESSURE
    • G01L19/00—Details of, or accessories for, apparatus for measuring steady or quasi-steady pressure of a fluent medium insofar as such details or accessories are not special to particular types of pressure gauges
    • G01L19/0061—Electrical connection means
    • G01L19/0084—Electrical connection means to the outside of the housing
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01L—MEASURING FORCE, STRESS, TORQUE, WORK, MECHANICAL POWER, MECHANICAL EFFICIENCY, OR FLUID PRESSURE
    • G01L19/00—Details of, or accessories for, apparatus for measuring steady or quasi-steady pressure of a fluent medium insofar as such details or accessories are not special to particular types of pressure gauges
    • G01L19/14—Housings
    • G01L19/147—Details about the mounting of the sensor to support or covering means

Landscapes

  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Chemical & Material Sciences (AREA)
  • Analytical Chemistry (AREA)
  • Measuring Fluid Pressure (AREA)

Abstract

PURPOSE:To fit the semiconductor pressure sensor, where two semiconductor chips are joined to form a vacuum space internally, to a pressure sensor case by a supporting means which prevents the strain due to temperature change from being propagated to the semiconductor pressure sensor. CONSTITUTION:A semiconductor pressure sensor consists of semiconductor chips 1 and 3, a diaphragm part 2, a face 4 to be stuck, and a vacuum space 5. A liquid of a flexible structure or a rubber adhesive such as silicone rubber is used as a supporting means 14 of the pressure sensor. The supporting means 14 is provided on a pressure sensor case 9, and point contact projecting parts 9a- 9c are formed in the upper side of the pressure sensor case 9 as one body, and the semiconductor chip 3 is brought into contact with these projecting parts 9a- 9c. A bank 9d higher than projecting parts 9a-9c is formed near the circumferential edge of the pressure sensor case 9. Thus, the semiconductor pressure sensor slides on projecting parts 9a-9c by expansion and contraction, and the strain other than pressure is not applied, and the influence due to temperature is reduced very much.
JP1335181A 1981-01-29 1981-01-29 Semiconductor pressure sensor for car Pending JPS57125828A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1335181A JPS57125828A (en) 1981-01-29 1981-01-29 Semiconductor pressure sensor for car

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1335181A JPS57125828A (en) 1981-01-29 1981-01-29 Semiconductor pressure sensor for car

Publications (1)

Publication Number Publication Date
JPS57125828A true JPS57125828A (en) 1982-08-05

Family

ID=11830678

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1335181A Pending JPS57125828A (en) 1981-01-29 1981-01-29 Semiconductor pressure sensor for car

Country Status (1)

Country Link
JP (1) JPS57125828A (en)

Cited By (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS61112245U (en) * 1984-12-27 1986-07-16
JPH06186104A (en) * 1992-12-22 1994-07-08 Fuji Electric Co Ltd Semiconductor pressure sensor
JPH07294353A (en) * 1994-04-28 1995-11-10 Matsushita Electric Works Ltd Pressure sensor
JPH09264800A (en) * 1996-03-27 1997-10-07 Omron Corp Semiconductor type dynamic amount sensor
JP2008070241A (en) * 2006-09-14 2008-03-27 Epson Toyocom Corp Pressure sensor and its manufacturing method
JP2010181386A (en) * 2009-02-09 2010-08-19 Fujikura Ltd Pressure sensor and method for manufacturing the same, pressure sensor package, pressure sensor module, and electronic component
JP2011107055A (en) * 2009-11-20 2011-06-02 Seiko Epson Corp Pressure sensor and temperature-compensated pressure sensor
JP2014044116A (en) * 2012-08-27 2014-03-13 Denso Corp Physical quantity sensor, and manufacturing method for the same
JP2018155632A (en) * 2017-03-17 2018-10-04 富士電機株式会社 Semiconductor pressure sensor device and method for manufacturing semiconductor pressure sensor device
JP2019191138A (en) * 2017-09-08 2019-10-31 富士電機株式会社 Pressure sensor device
CN113091996A (en) * 2021-04-22 2021-07-09 广东电网有限责任公司 Pressure sensor and preparation method and application thereof
JP2021131297A (en) * 2020-02-19 2021-09-09 アズビル株式会社 Pressure sensor

Cited By (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS61112245U (en) * 1984-12-27 1986-07-16
JPH06186104A (en) * 1992-12-22 1994-07-08 Fuji Electric Co Ltd Semiconductor pressure sensor
JPH07294353A (en) * 1994-04-28 1995-11-10 Matsushita Electric Works Ltd Pressure sensor
JPH09264800A (en) * 1996-03-27 1997-10-07 Omron Corp Semiconductor type dynamic amount sensor
JP2008070241A (en) * 2006-09-14 2008-03-27 Epson Toyocom Corp Pressure sensor and its manufacturing method
JP2010181386A (en) * 2009-02-09 2010-08-19 Fujikura Ltd Pressure sensor and method for manufacturing the same, pressure sensor package, pressure sensor module, and electronic component
JP2011107055A (en) * 2009-11-20 2011-06-02 Seiko Epson Corp Pressure sensor and temperature-compensated pressure sensor
JP2014044116A (en) * 2012-08-27 2014-03-13 Denso Corp Physical quantity sensor, and manufacturing method for the same
JP2018155632A (en) * 2017-03-17 2018-10-04 富士電機株式会社 Semiconductor pressure sensor device and method for manufacturing semiconductor pressure sensor device
JP2019191138A (en) * 2017-09-08 2019-10-31 富士電機株式会社 Pressure sensor device
JP2021131297A (en) * 2020-02-19 2021-09-09 アズビル株式会社 Pressure sensor
CN113091996A (en) * 2021-04-22 2021-07-09 广东电网有限责任公司 Pressure sensor and preparation method and application thereof

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