JPS5735362A - Structure of circuit substrate - Google Patents
Structure of circuit substrateInfo
- Publication number
- JPS5735362A JPS5735362A JP11074980A JP11074980A JPS5735362A JP S5735362 A JPS5735362 A JP S5735362A JP 11074980 A JP11074980 A JP 11074980A JP 11074980 A JP11074980 A JP 11074980A JP S5735362 A JPS5735362 A JP S5735362A
- Authority
- JP
- Japan
- Prior art keywords
- lead
- circuit substrate
- grounding electrode
- long device
- reinforcing
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000000758 substrate Substances 0.000 title abstract 3
- 230000003014 reinforcing effect Effects 0.000 abstract 2
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 abstract 1
- 239000011889 copper foil Substances 0.000 abstract 1
- 239000011347 resin Substances 0.000 abstract 1
- 229920005989 resin Polymers 0.000 abstract 1
- 238000012216 screening Methods 0.000 abstract 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/58—Structural electrical arrangements for semiconductor devices not otherwise provided for, e.g. in combination with batteries
- H01L23/60—Protection against electrostatic charges or discharges, e.g. Faraday shields
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
Landscapes
- Engineering & Computer Science (AREA)
- Power Engineering (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
- Wire Bonding (AREA)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP11074980A JPS5735362A (en) | 1980-08-12 | 1980-08-12 | Structure of circuit substrate |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP11074980A JPS5735362A (en) | 1980-08-12 | 1980-08-12 | Structure of circuit substrate |
Publications (2)
Publication Number | Publication Date |
---|---|
JPS5735362A true JPS5735362A (en) | 1982-02-25 |
JPS6249984B2 JPS6249984B2 (enrdf_load_stackoverflow) | 1987-10-22 |
Family
ID=14543569
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP11074980A Granted JPS5735362A (en) | 1980-08-12 | 1980-08-12 | Structure of circuit substrate |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS5735362A (enrdf_load_stackoverflow) |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS599187A (ja) * | 1982-07-01 | 1984-01-18 | ナシヨナル・セミコンダクタ−・コ−ポレ−シヨン | メツキ装置 |
JPS6359593A (ja) * | 1986-08-30 | 1988-03-15 | 株式会社東芝 | 携帯可能媒体における実装方法 |
Families Citing this family (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH0263686U (enrdf_load_stackoverflow) * | 1988-11-01 | 1990-05-14 |
-
1980
- 1980-08-12 JP JP11074980A patent/JPS5735362A/ja active Granted
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS599187A (ja) * | 1982-07-01 | 1984-01-18 | ナシヨナル・セミコンダクタ−・コ−ポレ−シヨン | メツキ装置 |
JPS6359593A (ja) * | 1986-08-30 | 1988-03-15 | 株式会社東芝 | 携帯可能媒体における実装方法 |
Also Published As
Publication number | Publication date |
---|---|
JPS6249984B2 (enrdf_load_stackoverflow) | 1987-10-22 |
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