JPS5795640A - Mounting structure of semiconductor - Google Patents

Mounting structure of semiconductor

Info

Publication number
JPS5795640A
JPS5795640A JP17101580A JP17101580A JPS5795640A JP S5795640 A JPS5795640 A JP S5795640A JP 17101580 A JP17101580 A JP 17101580A JP 17101580 A JP17101580 A JP 17101580A JP S5795640 A JPS5795640 A JP S5795640A
Authority
JP
Japan
Prior art keywords
film
bumps
photosensitive
reliability
circuit substrate
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP17101580A
Other languages
Japanese (ja)
Inventor
Tetsuo Sato
Katsuji Komatsu
Kazuo Inoue
Makoto Koshikawa
Noriyuki Kasama
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Citizen Holdings Co Ltd
Citizen Watch Co Ltd
Original Assignee
Citizen Holdings Co Ltd
Citizen Watch Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Citizen Holdings Co Ltd, Citizen Watch Co Ltd filed Critical Citizen Holdings Co Ltd
Priority to JP17101580A priority Critical patent/JPS5795640A/en
Publication of JPS5795640A publication Critical patent/JPS5795640A/en
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L24/81—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a bump connector
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/10—Bump connectors; Manufacturing methods related thereto
    • H01L2224/15—Structure, shape, material or disposition of the bump connectors after the connecting process
    • H01L2224/16—Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
    • H01L2224/161—Disposition
    • H01L2224/16151—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/16221—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/16225—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
    • H01L2224/16237—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation the bump connector connecting to a bonding area disposed in a recess of the surface of the item
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L2224/81—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a bump connector
    • H01L2224/818—Bonding techniques
    • H01L2224/81801—Soldering or alloying
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/013—Alloys
    • H01L2924/014—Solder alloys
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/341—Surface mounted components
    • H05K3/3431—Leadless components
    • H05K3/3436—Leadless components having an array of bottom contacts, e.g. pad grid array or ball grid array components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/3452—Solder masks

Abstract

PURPOSE:To improve the reliability of mounting according to a face-down system, and to enable automation by fastening a photosensitive heatproof film, to a bonding section thereof a small hole is formed, onto a circuit substrate and positioning a bump electrode of an element at the small hole and joining the electrode. CONSTITUTION:A connection pattern 5 is shaped to the circuit substrate 4, the photosensitive heatproof film 3 is laminated and exposed and developed, and the small holes 3a are formed where corresponding to the solder bumps 1a of an IC 1. The film 3 is cured in order to improve adhesive property between the substrate 4 and the film 3, the bumps 1a are positioned into the small holes 3a and the IC1 is loaded, and the bumps 1a and the pattern 5 are connected electrically through soldering by means of a reflow oven. Since the film 3 is formed in this manner, the flow of solder can be prevented, and mounting can be miniaturized and its reliability can be improved while the IC is easily positioned. Accordingly, automation is enabled.
JP17101580A 1980-12-05 1980-12-05 Mounting structure of semiconductor Pending JPS5795640A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP17101580A JPS5795640A (en) 1980-12-05 1980-12-05 Mounting structure of semiconductor

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP17101580A JPS5795640A (en) 1980-12-05 1980-12-05 Mounting structure of semiconductor

Publications (1)

Publication Number Publication Date
JPS5795640A true JPS5795640A (en) 1982-06-14

Family

ID=15915511

Family Applications (1)

Application Number Title Priority Date Filing Date
JP17101580A Pending JPS5795640A (en) 1980-12-05 1980-12-05 Mounting structure of semiconductor

Country Status (1)

Country Link
JP (1) JPS5795640A (en)

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4963002A (en) * 1988-03-07 1990-10-16 Sharp Kabushiki Kaisha Connection construction and method of manufacturing the same
US5114878A (en) * 1989-09-11 1992-05-19 Nippon Steel Corporation Method of bonding bumps to leads of tab tape and an apparatus for arranging bumps used for the same
JPH05275492A (en) * 1991-06-26 1993-10-22 Hughes Aircraft Co Integrated socket type package for flip-chip semiconductor device and circuit
JP2006093406A (en) * 2004-09-24 2006-04-06 Fujikura Ltd Electronic component and electronic device

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4963002A (en) * 1988-03-07 1990-10-16 Sharp Kabushiki Kaisha Connection construction and method of manufacturing the same
US5114878A (en) * 1989-09-11 1992-05-19 Nippon Steel Corporation Method of bonding bumps to leads of tab tape and an apparatus for arranging bumps used for the same
JPH05275492A (en) * 1991-06-26 1993-10-22 Hughes Aircraft Co Integrated socket type package for flip-chip semiconductor device and circuit
JP2006093406A (en) * 2004-09-24 2006-04-06 Fujikura Ltd Electronic component and electronic device
JP4628731B2 (en) * 2004-09-24 2011-02-09 株式会社フジクラ Electronic component and electronic device

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