JPS5729847B2 - - Google Patents

Info

Publication number
JPS5729847B2
JPS5729847B2 JP11159477A JP11159477A JPS5729847B2 JP S5729847 B2 JPS5729847 B2 JP S5729847B2 JP 11159477 A JP11159477 A JP 11159477A JP 11159477 A JP11159477 A JP 11159477A JP S5729847 B2 JPS5729847 B2 JP S5729847B2
Authority
JP
Japan
Prior art keywords
bonding
insulating film
integrated circuit
circuit device
reduce
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
JP11159477A
Other languages
English (en)
Japanese (ja)
Other versions
JPS5391574A (en
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP11159477A priority Critical patent/JPS5391574A/ja
Publication of JPS5391574A publication Critical patent/JPS5391574A/ja
Publication of JPS5729847B2 publication Critical patent/JPS5729847B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/075—Connecting or disconnecting of bond wires
    • H10W72/07551—Connecting or disconnecting of bond wires characterised by changes in properties of the bond wires during the connecting
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/075—Connecting or disconnecting of bond wires
    • H10W72/07551—Connecting or disconnecting of bond wires characterised by changes in properties of the bond wires during the connecting
    • H10W72/07553—Connecting or disconnecting of bond wires characterised by changes in properties of the bond wires during the connecting changes in shapes
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/531—Shapes of wire connectors
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/531—Shapes of wire connectors
    • H10W72/5363—Shapes of wire connectors the connected ends being wedge-shaped
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/531—Shapes of wire connectors
    • H10W72/5366—Shapes of wire connectors the bond wires having kinks
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/90—Bond pads, in general
    • H10W72/931—Shapes of bond pads
    • H10W72/932—Plan-view shape, i.e. in top view

Landscapes

  • Wire Bonding (AREA)
JP11159477A 1977-09-19 1977-09-19 Bonding method Granted JPS5391574A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP11159477A JPS5391574A (en) 1977-09-19 1977-09-19 Bonding method

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP11159477A JPS5391574A (en) 1977-09-19 1977-09-19 Bonding method

Related Parent Applications (1)

Application Number Title Priority Date Filing Date
JP47047679A Division JPS5147570B2 (enExample) 1972-05-16 1972-05-16

Publications (2)

Publication Number Publication Date
JPS5391574A JPS5391574A (en) 1978-08-11
JPS5729847B2 true JPS5729847B2 (enExample) 1982-06-25

Family

ID=14565309

Family Applications (1)

Application Number Title Priority Date Filing Date
JP11159477A Granted JPS5391574A (en) 1977-09-19 1977-09-19 Bonding method

Country Status (1)

Country Link
JP (1) JPS5391574A (enExample)

Non-Patent Citations (1)

* Cited by examiner, † Cited by third party
Title
IEEE INTERNATIONAL CONVENTION RECORD PART6=1967 *

Also Published As

Publication number Publication date
JPS5391574A (en) 1978-08-11

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