JPS5391574A - Bonding method - Google Patents

Bonding method

Info

Publication number
JPS5391574A
JPS5391574A JP11159477A JP11159477A JPS5391574A JP S5391574 A JPS5391574 A JP S5391574A JP 11159477 A JP11159477 A JP 11159477A JP 11159477 A JP11159477 A JP 11159477A JP S5391574 A JPS5391574 A JP S5391574A
Authority
JP
Japan
Prior art keywords
bonding
bonding method
insulating film
integrated circuit
circuit device
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP11159477A
Other languages
English (en)
Japanese (ja)
Other versions
JPS5729847B2 (enExample
Inventor
Shigeo Sasaki
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Toshiba Corp
Original Assignee
Toshiba Corp
Tokyo Shibaura Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Toshiba Corp, Tokyo Shibaura Electric Co Ltd filed Critical Toshiba Corp
Priority to JP11159477A priority Critical patent/JPS5391574A/ja
Publication of JPS5391574A publication Critical patent/JPS5391574A/ja
Publication of JPS5729847B2 publication Critical patent/JPS5729847B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H10W72/50—
    • H10W72/07551—
    • H10W72/07553—
    • H10W72/531—
    • H10W72/5363—
    • H10W72/5366—
    • H10W72/932—

Landscapes

  • Wire Bonding (AREA)
JP11159477A 1977-09-19 1977-09-19 Bonding method Granted JPS5391574A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP11159477A JPS5391574A (en) 1977-09-19 1977-09-19 Bonding method

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP11159477A JPS5391574A (en) 1977-09-19 1977-09-19 Bonding method

Related Parent Applications (1)

Application Number Title Priority Date Filing Date
JP47047679A Division JPS5147570B2 (enExample) 1972-05-16 1972-05-16

Publications (2)

Publication Number Publication Date
JPS5391574A true JPS5391574A (en) 1978-08-11
JPS5729847B2 JPS5729847B2 (enExample) 1982-06-25

Family

ID=14565309

Family Applications (1)

Application Number Title Priority Date Filing Date
JP11159477A Granted JPS5391574A (en) 1977-09-19 1977-09-19 Bonding method

Country Status (1)

Country Link
JP (1) JPS5391574A (enExample)

Non-Patent Citations (1)

* Cited by examiner, † Cited by third party
Title
IEEE INTERNATIONAL CONVENTION RECORD PART6=1967 *

Also Published As

Publication number Publication date
JPS5729847B2 (enExample) 1982-06-25

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