JPS5391574A - Bonding method - Google Patents

Bonding method

Info

Publication number
JPS5391574A
JPS5391574A JP11159477A JP11159477A JPS5391574A JP S5391574 A JPS5391574 A JP S5391574A JP 11159477 A JP11159477 A JP 11159477A JP 11159477 A JP11159477 A JP 11159477A JP S5391574 A JPS5391574 A JP S5391574A
Authority
JP
Japan
Prior art keywords
bonding
bonding method
insulating film
integrated circuit
circuit device
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP11159477A
Other languages
English (en)
Japanese (ja)
Other versions
JPS5729847B2 (enExample
Inventor
Shigeo Sasaki
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Toshiba Corp
Original Assignee
Toshiba Corp
Tokyo Shibaura Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Toshiba Corp, Tokyo Shibaura Electric Co Ltd filed Critical Toshiba Corp
Priority to JP11159477A priority Critical patent/JPS5391574A/ja
Publication of JPS5391574A publication Critical patent/JPS5391574A/ja
Publication of JPS5729847B2 publication Critical patent/JPS5729847B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/075—Connecting or disconnecting of bond wires
    • H10W72/07551—Connecting or disconnecting of bond wires characterised by changes in properties of the bond wires during the connecting
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/075—Connecting or disconnecting of bond wires
    • H10W72/07551—Connecting or disconnecting of bond wires characterised by changes in properties of the bond wires during the connecting
    • H10W72/07553—Connecting or disconnecting of bond wires characterised by changes in properties of the bond wires during the connecting changes in shapes
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/531—Shapes of wire connectors
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/531—Shapes of wire connectors
    • H10W72/5363—Shapes of wire connectors the connected ends being wedge-shaped
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/531—Shapes of wire connectors
    • H10W72/5366—Shapes of wire connectors the bond wires having kinks
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/90—Bond pads, in general
    • H10W72/931—Shapes of bond pads
    • H10W72/932—Plan-view shape, i.e. in top view

Landscapes

  • Wire Bonding (AREA)
JP11159477A 1977-09-19 1977-09-19 Bonding method Granted JPS5391574A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP11159477A JPS5391574A (en) 1977-09-19 1977-09-19 Bonding method

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP11159477A JPS5391574A (en) 1977-09-19 1977-09-19 Bonding method

Related Parent Applications (1)

Application Number Title Priority Date Filing Date
JP47047679A Division JPS5147570B2 (enExample) 1972-05-16 1972-05-16

Publications (2)

Publication Number Publication Date
JPS5391574A true JPS5391574A (en) 1978-08-11
JPS5729847B2 JPS5729847B2 (enExample) 1982-06-25

Family

ID=14565309

Family Applications (1)

Application Number Title Priority Date Filing Date
JP11159477A Granted JPS5391574A (en) 1977-09-19 1977-09-19 Bonding method

Country Status (1)

Country Link
JP (1) JPS5391574A (enExample)

Non-Patent Citations (1)

* Cited by examiner, † Cited by third party
Title
IEEE INTERNATIONAL CONVENTION RECORD PART6=1967 *

Also Published As

Publication number Publication date
JPS5729847B2 (enExample) 1982-06-25

Similar Documents

Publication Publication Date Title
JPS528785A (en) Semiconductor device electrode structure
JPS5391680A (en) Semiconductor device
JPS5389688A (en) Semiconductor device
JPS5345971A (en) Semiconductor device
JPS5729847B2 (enExample)
JPS5363974A (en) Electronic parts
JPS53141574A (en) Manufacture of semiconductor device
JPS5386177A (en) Production of semiconductor device
JPS52153383A (en) Preparation of semiconductor device
JPS5315759A (en) Electronic parts
JPS53116073A (en) Semiconductor device
JPS5391591A (en) Semiconductor device
JPS52143186A (en) Taping device
JPS542664A (en) Semiconductor device
JPS53123661A (en) Manufacture of semiconductor device
JPS547866A (en) Manufacture for semiconductor device
JPS52151572A (en) Insulated gate semiconductor device and its production
JPS52144276A (en) Semiconductor device
JPS5411672A (en) Manufacture for semiconductor device
JPS5339868A (en) Packaging method of semiconductor device
JPS5361968A (en) Production of semiconductor device
JPS5387678A (en) Integrated semicondu ctor circuit device having transistors
JPS5245882A (en) Gunn effect semiconductor device
JPS51134073A (en) Method to manufacture the semiconductor unit
JPS53117375A (en) Semiconductor device