JPS57211754A - Package - Google Patents

Package

Info

Publication number
JPS57211754A
JPS57211754A JP9780181A JP9780181A JPS57211754A JP S57211754 A JPS57211754 A JP S57211754A JP 9780181 A JP9780181 A JP 9780181A JP 9780181 A JP9780181 A JP 9780181A JP S57211754 A JPS57211754 A JP S57211754A
Authority
JP
Japan
Prior art keywords
pattern
sealing
sealing pattern
package
electrode
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP9780181A
Other languages
English (en)
Japanese (ja)
Other versions
JPS643060B2 (enrdf_load_stackoverflow
Inventor
Masahiro Sugimoto
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Fujitsu Ltd
Original Assignee
Fujitsu Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Fujitsu Ltd filed Critical Fujitsu Ltd
Priority to JP9780181A priority Critical patent/JPS57211754A/ja
Publication of JPS57211754A publication Critical patent/JPS57211754A/ja
Publication of JPS643060B2 publication Critical patent/JPS643060B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
    • H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
    • H01L23/498—Leads, i.e. metallisations or lead-frames on insulating substrates, e.g. chip carriers
    • H01L23/49827—Via connections through the substrates, e.g. pins going through the substrate, coaxial cables
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/151—Die mounting substrate
    • H01L2924/153—Connection portion
    • H01L2924/1531—Connection portion the connection portion being formed only on the surface of the substrate opposite to the die mounting surface
    • H01L2924/15312—Connection portion the connection portion being formed only on the surface of the substrate opposite to the die mounting surface being a pin array, e.g. PGA
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/151—Die mounting substrate
    • H01L2924/153—Connection portion
    • H01L2924/1532—Connection portion the connection portion being formed on the die mounting surface of the substrate

Landscapes

  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Lead Frames For Integrated Circuits (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
JP9780181A 1981-06-24 1981-06-24 Package Granted JPS57211754A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP9780181A JPS57211754A (en) 1981-06-24 1981-06-24 Package

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP9780181A JPS57211754A (en) 1981-06-24 1981-06-24 Package

Publications (2)

Publication Number Publication Date
JPS57211754A true JPS57211754A (en) 1982-12-25
JPS643060B2 JPS643060B2 (enrdf_load_stackoverflow) 1989-01-19

Family

ID=14201878

Family Applications (1)

Application Number Title Priority Date Filing Date
JP9780181A Granted JPS57211754A (en) 1981-06-24 1981-06-24 Package

Country Status (1)

Country Link
JP (1) JPS57211754A (enrdf_load_stackoverflow)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5910240A (ja) * 1982-07-09 1984-01-19 Nec Corp 半導体装置
JPS5972749A (ja) * 1982-10-19 1984-04-24 Nec Corp 半導体装置

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5336468A (en) * 1976-09-17 1978-04-04 Hitachi Ltd Package for integrated circuit
JPS5487512A (en) * 1977-12-24 1979-07-12 Sony Corp Cassette type vtr

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5336468A (en) * 1976-09-17 1978-04-04 Hitachi Ltd Package for integrated circuit
JPS5487512A (en) * 1977-12-24 1979-07-12 Sony Corp Cassette type vtr

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5910240A (ja) * 1982-07-09 1984-01-19 Nec Corp 半導体装置
JPS5972749A (ja) * 1982-10-19 1984-04-24 Nec Corp 半導体装置

Also Published As

Publication number Publication date
JPS643060B2 (enrdf_load_stackoverflow) 1989-01-19

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