JPS643060B2 - - Google Patents
Info
- Publication number
- JPS643060B2 JPS643060B2 JP9780181A JP9780181A JPS643060B2 JP S643060 B2 JPS643060 B2 JP S643060B2 JP 9780181 A JP9780181 A JP 9780181A JP 9780181 A JP9780181 A JP 9780181A JP S643060 B2 JPS643060 B2 JP S643060B2
- Authority
- JP
- Japan
- Prior art keywords
- package
- seal pattern
- bonding pad
- pattern
- inner layer
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
- H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
- H01L23/498—Leads, i.e. metallisations or lead-frames on insulating substrates, e.g. chip carriers
- H01L23/49827—Via connections through the substrates, e.g. pins going through the substrate, coaxial cables
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/151—Die mounting substrate
- H01L2924/153—Connection portion
- H01L2924/1531—Connection portion the connection portion being formed only on the surface of the substrate opposite to the die mounting surface
- H01L2924/15312—Connection portion the connection portion being formed only on the surface of the substrate opposite to the die mounting surface being a pin array, e.g. PGA
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/151—Die mounting substrate
- H01L2924/153—Connection portion
- H01L2924/1532—Connection portion the connection portion being formed on the die mounting surface of the substrate
Landscapes
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Lead Frames For Integrated Circuits (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP9780181A JPS57211754A (en) | 1981-06-24 | 1981-06-24 | Package |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP9780181A JPS57211754A (en) | 1981-06-24 | 1981-06-24 | Package |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS57211754A JPS57211754A (en) | 1982-12-25 |
| JPS643060B2 true JPS643060B2 (enrdf_load_stackoverflow) | 1989-01-19 |
Family
ID=14201878
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP9780181A Granted JPS57211754A (en) | 1981-06-24 | 1981-06-24 | Package |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS57211754A (enrdf_load_stackoverflow) |
Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5910240A (ja) * | 1982-07-09 | 1984-01-19 | Nec Corp | 半導体装置 |
| JPS5972749A (ja) * | 1982-10-19 | 1984-04-24 | Nec Corp | 半導体装置 |
Family Cites Families (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5336468A (en) * | 1976-09-17 | 1978-04-04 | Hitachi Ltd | Package for integrated circuit |
| JPS5487512A (en) * | 1977-12-24 | 1979-07-12 | Sony Corp | Cassette type vtr |
-
1981
- 1981-06-24 JP JP9780181A patent/JPS57211754A/ja active Granted
Also Published As
| Publication number | Publication date |
|---|---|
| JPS57211754A (en) | 1982-12-25 |
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