JPS57201028A - Wafer conveying device - Google Patents

Wafer conveying device

Info

Publication number
JPS57201028A
JPS57201028A JP8557581A JP8557581A JPS57201028A JP S57201028 A JPS57201028 A JP S57201028A JP 8557581 A JP8557581 A JP 8557581A JP 8557581 A JP8557581 A JP 8557581A JP S57201028 A JPS57201028 A JP S57201028A
Authority
JP
Japan
Prior art keywords
chains
wafer conveying
rotor
arm
conveying device
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP8557581A
Other languages
English (en)
Japanese (ja)
Other versions
JPS64810B2 (enExample
Inventor
Masaaki Minami
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Toshiba Corp
Original Assignee
Toshiba Corp
Tokyo Shibaura Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Toshiba Corp, Tokyo Shibaura Electric Co Ltd filed Critical Toshiba Corp
Priority to JP8557581A priority Critical patent/JPS57201028A/ja
Publication of JPS57201028A publication Critical patent/JPS57201028A/ja
Publication of JPS64810B2 publication Critical patent/JPS64810B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67763—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading
    • H01L21/67778—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading involving loading and unloading of wafers
    • H01L21/67781—Batch transfer of wafers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
    • H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
    • H01L21/306—Chemical or electrical treatment, e.g. electrolytic etching
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67763—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading
    • H01L21/67766—Mechanical parts of transfer devices

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Robotics (AREA)
  • Weting (AREA)
  • Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
  • Cleaning Or Drying Semiconductors (AREA)
JP8557581A 1981-06-05 1981-06-05 Wafer conveying device Granted JPS57201028A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP8557581A JPS57201028A (en) 1981-06-05 1981-06-05 Wafer conveying device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP8557581A JPS57201028A (en) 1981-06-05 1981-06-05 Wafer conveying device

Publications (2)

Publication Number Publication Date
JPS57201028A true JPS57201028A (en) 1982-12-09
JPS64810B2 JPS64810B2 (enExample) 1989-01-09

Family

ID=13862607

Family Applications (1)

Application Number Title Priority Date Filing Date
JP8557581A Granted JPS57201028A (en) 1981-06-05 1981-06-05 Wafer conveying device

Country Status (1)

Country Link
JP (1) JPS57201028A (enExample)

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS59127838A (ja) * 1983-01-11 1984-07-23 Sumitomo Electric Ind Ltd ミラ−ウエハの連続エツチング装置
JPS61153340U (enExample) * 1985-03-13 1986-09-22
JPS63260037A (ja) * 1987-04-16 1988-10-27 Nec Kyushu Ltd 半導体基板自動薬液処理装置
JPH022112A (ja) * 1987-12-17 1990-01-08 Texas Instr Inc <Ti> 半導体ウェファの処理方法と装置

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS59127838A (ja) * 1983-01-11 1984-07-23 Sumitomo Electric Ind Ltd ミラ−ウエハの連続エツチング装置
JPS61153340U (enExample) * 1985-03-13 1986-09-22
JPS63260037A (ja) * 1987-04-16 1988-10-27 Nec Kyushu Ltd 半導体基板自動薬液処理装置
JPH022112A (ja) * 1987-12-17 1990-01-08 Texas Instr Inc <Ti> 半導体ウェファの処理方法と装置

Also Published As

Publication number Publication date
JPS64810B2 (enExample) 1989-01-09

Similar Documents

Publication Publication Date Title
KR840003979A (ko) 로보트의 관절장치
ES540896A0 (es) Reductor mecanico
CN209618159U (zh) 一种板链线上下料传送装置
JPS57201028A (en) Wafer conveying device
ATE3705T1 (de) Antrieb des foerderers einer glasbearbeitungsanlage.
ATE70894T1 (de) Druckwellenlader.
JPS56143363A (en) Wave energy converter
CN217122569U (zh) 一种精密机械传送用传动结构
KR890002397B1 (ko) 맨컨베이어의 구동장치
JPS55111308A (en) Device to stop conveyed material at prescribed position
CN209452356U (zh) 一种矽晶片防尘装置
IT1286226B1 (it) Gruppo di riduzione per uso ascensoristico
JPS6429673A (en) Wave power generating device
SU1073090A1 (ru) Манипул тор
JPS56126144A (en) Three-dimentional transfer feeder
CN216376195U (zh) 一种新型动力前置式高速装板机
SU727924A1 (ru) Устройство дл реверсивного движени ведомого звена
JPS57129958A (en) Power transmitting device for generating irregular driven force from regular drive force
SU827354A1 (ru) Привод элеватора с ленточнымТ гОВыМ ОРгАНОМ
JPS56103003A (en) Driving device for stationary conveyor
CN207242954U (zh) 一种玻璃生产线的升降传输装置
SU1579860A1 (ru) Стенд дл испытани скребковых конвейеров
GB917295A (en) Improvements in or relating to portable power-driven coating machines
JPS56134138A (en) Working unit
JPS57184014A (en) Short material aligning apparatus