JPS57201028A - Wafer conveying device - Google Patents
Wafer conveying deviceInfo
- Publication number
- JPS57201028A JPS57201028A JP8557581A JP8557581A JPS57201028A JP S57201028 A JPS57201028 A JP S57201028A JP 8557581 A JP8557581 A JP 8557581A JP 8557581 A JP8557581 A JP 8557581A JP S57201028 A JPS57201028 A JP S57201028A
- Authority
- JP
- Japan
- Prior art keywords
- chains
- wafer conveying
- rotor
- arm
- conveying device
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67763—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading
- H01L21/67778—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading involving loading and unloading of wafers
- H01L21/67781—Batch transfer of wafers
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic System or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
- H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
- H01L21/306—Chemical or electrical treatment, e.g. electrolytic etching
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67763—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading
- H01L21/67766—Mechanical parts of transfer devices
Abstract
PURPOSE:To improve the treating efficiency of a wafer conveying device by providing a wafer conveying mechanism of a simple structre using a single power source, thereby facilitating check and maintenance and stabilizing the operation. CONSTITUTION:This device has chains 3, 4 extended in parallel with each other, an electromagnetic clutch 9 interposed between the drive shafts of the chains, a motor 10 connected to the chains, a slide member 12 supported by a guide shaft 11, and a treating tank 2 provided in the chain direction. A rotor 16 is provided at one end of the member 12. Means 17 for converting the rotating motion of the rotor 16 to elevational motions and an arm 18 for holding wafers are provided at the member 12, the arm 18 is elevationally moved by the motion conversion, thereby facilitating the treatment with a simple conveying mechanism.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP8557581A JPS57201028A (en) | 1981-06-05 | 1981-06-05 | Wafer conveying device |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP8557581A JPS57201028A (en) | 1981-06-05 | 1981-06-05 | Wafer conveying device |
Publications (2)
Publication Number | Publication Date |
---|---|
JPS57201028A true JPS57201028A (en) | 1982-12-09 |
JPS64810B2 JPS64810B2 (en) | 1989-01-09 |
Family
ID=13862607
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP8557581A Granted JPS57201028A (en) | 1981-06-05 | 1981-06-05 | Wafer conveying device |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS57201028A (en) |
Cited By (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS59127838A (en) * | 1983-01-11 | 1984-07-23 | Sumitomo Electric Ind Ltd | Continuous etching device for mirror wafer |
JPS61153340U (en) * | 1985-03-13 | 1986-09-22 | ||
JPS63260037A (en) * | 1987-04-16 | 1988-10-27 | Nec Kyushu Ltd | Semiconductor substrate automatic chemical treatment apparatus |
JPH022112A (en) * | 1987-12-17 | 1990-01-08 | Texas Instr Inc <Ti> | Method and apparatus of treatment of semiconductor wafer |
-
1981
- 1981-06-05 JP JP8557581A patent/JPS57201028A/en active Granted
Cited By (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS59127838A (en) * | 1983-01-11 | 1984-07-23 | Sumitomo Electric Ind Ltd | Continuous etching device for mirror wafer |
JPH0148651B2 (en) * | 1983-01-11 | 1989-10-20 | Sumitomo Electric Industries | |
JPS61153340U (en) * | 1985-03-13 | 1986-09-22 | ||
JPH058675Y2 (en) * | 1985-03-13 | 1993-03-04 | ||
JPS63260037A (en) * | 1987-04-16 | 1988-10-27 | Nec Kyushu Ltd | Semiconductor substrate automatic chemical treatment apparatus |
JPH022112A (en) * | 1987-12-17 | 1990-01-08 | Texas Instr Inc <Ti> | Method and apparatus of treatment of semiconductor wafer |
Also Published As
Publication number | Publication date |
---|---|
JPS64810B2 (en) | 1989-01-09 |
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