JPS63260037A - Semiconductor substrate automatic chemical treatment apparatus - Google Patents

Abstract

PURPOSE:To prevent chemicals from undergoing waste and deterioration by causing a carrier and a substrate which are withdrawn from a treatment vessel in the preceding stage to stop driving only for a time which is necessary for removing drippings of chemicals attached to the above component parts and by carrying the component parts to the treatment vessel in the latter stage after the above time elapsed. CONSTITUTION:After a carrier 3 and a wafer 5 are taken out of a treatment vessel 2 by having the above component parts caught by an arm 1a of a carrying equipment 1, this apparatus allows the carrying equipment 1 to stop driving for a fixed time on its vessel 2 so as to remove drippings of chemicals attached to the component parts 3 and 5 and after the above time elapsed, the component parts 3 and 5 are carried by the equipment 1 to another treatment vessel 4 in the latter stage and then the treatment of the wafer 5 in the vessel 4 is performed once more. In this way, attachment of the chemicals to the carrier and the wafer is so limited at a minimum that this approach may avoid some of demerits: waste of the chemicals because of carrying away from the vessel during treatment, development of poor conditions due to fluctuations in the chemicals temperature, and deterioration of treatment liquid due to bringing of the chemicals into another vessel in the latter stage.

Description

DETAILED DESCRIPTION OF THE INVENTION [Industrial Application Field] The present invention relates to a processing apparatus that performs chemical treatment on a semiconductor substrate (hereinafter referred to as a wafer) housed in a carrier in a semiconductor integrated circuit manufacturing process.

[Conventional technology]

Conventionally, this type of chemical processing equipment has a plurality of processing tanks arranged in front and back, and a wafer is accommodated in a carrier, and the wafer is processed in the first processing tank, and then transferred to the second processing tank. I'm changing it and processing it further.

[Problem that the invention seeks to solve]

By the way, in conventional equipment, the carriers and wafers taken out of the processing tank in the previous stage are transferred to the processing tank in the latter stage without removing the chemical solution attached to the wafers, etc., so that the carriers and wafers taken out from the processing tank are A large amount of adhering chemical solution is carried out to the next tank, leading to disadvantages such as wasteful use of chemical solution due to decrease in chemical solution in the pre-treatment tank, and occurrence of defects due to change in solution temperature due to replenishment of new solution. There were disadvantages such as deterioration of the processing liquid due to

An object of the present invention is to provide a processing device that prevents wastage and deterioration of chemical solutions.

[Means for solving problems]

The present invention arranges a plurality of processing tanks in front and behind each other, stores a semiconductor substrate in a carrier, and processes the substrate in the preceding processing tank,
In an automatic chemical processing device for semiconductor substrates, which transfers this to a subsequent processing tank for further processing, the drive is stopped only for the time necessary to drop and remove the chemical solution adhering to the carrier and substrate that are pulled up from the previous processing tank. This is an automatic semiconductor substrate chemical processing apparatus characterized in that it is equipped with a transport machine that transports the carrier and the substrate to a subsequent processing tank after the lapse of time.

゛ [Example] Hereinafter, one embodiment of the present invention will be described with reference to the drawings.

In FIG. 1, the processing apparatus according to the present invention has a plurality of processing tanks 2 and 3 arranged in front and rear, and further includes a processing tank 2 in the previous stage.
A transport machine 1 that stops driving the carrier 3 and wafer 5 that are pulled up from the carrier for the time necessary to drop and remove the chemical solution adhering thereto, and transports the carrier 3 and wafer 5 to the subsequent processing tank 4 after that time has elapsed. Processing tanks 2 in the front and rear stages
, was installed between 4 and 4.

In the embodiment, the transport machine 1 takes out the recarrier 3 and wafers 5 from the processing tank 2 in the previous stage by hooking them on arms la, la, and then stops the carriers 3 and wafers 5 on the processing tank 2 for a certain period of time. After the time has elapsed, the carrier 1 transfers the carrier 3 to the downstream processing tank 4.
and Ueno X-5 are carried in, and the wafers 5 are further processed in the processing tank 4.

〔Effect of the invention〕

As explained above, the present invention makes it possible to minimize the amount of chemical solution adhering to the carrier and wafer by stopping the carrier on the tank for a certain period of time when taking the carrier out of the processing tank, thereby preventing wasteful use of the chemical solution due to removal of the chemical solution. This has the effect of preventing the occurrence of defects due to changes in liquid temperature and deterioration of the processing liquid due to carryover of chemical liquid to the next tank.

[Brief explanation of drawings]

FIG. 1 is a schematic diagram showing an embodiment of the present invention. 1...Transporter 2...Previous processing tank 3
...Carrier 4...Late stage processing tank 5.
・Wafer

Claims (1)

[Claims] (1) A semiconductor device in which multiple processing tanks are arranged in front and behind each other, a semiconductor substrate is housed in a carrier, the substrate is processed in the first processing tank, and then transferred to a subsequent processing tank for further processing. In an automatic substrate chemical processing device, the drive is stopped for the time necessary to drop and remove the chemical solution adhering to the carriers and substrates that are lifted up from the processing tank in the previous stage, and after that time has elapsed, the carriers and substrates are transferred to the processing tank in the latter stage. An automatic chemical processing device for semiconductor substrates, characterized in that it is equipped with a transporter for transporting semiconductor substrates.