JPH05206092A - Method of automatically washing semiconductor wafer - Google Patents
Method of automatically washing semiconductor waferInfo
- Publication number
- JPH05206092A JPH05206092A JP1093792A JP1093792A JPH05206092A JP H05206092 A JPH05206092 A JP H05206092A JP 1093792 A JP1093792 A JP 1093792A JP 1093792 A JP1093792 A JP 1093792A JP H05206092 A JPH05206092 A JP H05206092A
- Authority
- JP
- Japan
- Prior art keywords
- cleaning
- semiconductor wafer
- treating tub
- tank
- processing
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Landscapes
- Cleaning Or Drying Semiconductors (AREA)
Abstract
Description
【0001】[0001]
【産業上の利用分野】本発明は、いずれかの洗浄槽がト
ラブルで使用できない場合でも装置全体を停止させるこ
となく洗浄可能な半導体ウェーハの自動洗浄方法に関す
る。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an automatic cleaning method for semiconductor wafers which can be cleaned without stopping the entire apparatus even when any cleaning tank cannot be used due to a trouble.
【0002】[0002]
【従来の技術】従来、半導体ウェーハの製造時には不純
物が付着しているので、これを薬液槽に浸漬して除去す
る洗浄がおこなわれる。半導体ウェーハを自動的に洗浄
する場合には、図5〜図8に示すように、通常タクト式
と呼ばれる搬送方式により行われている。図5〜図8は
半導体ウェーハの自動洗浄装置1を示しており、図中、
2は半導体ウェーハを供給するローダー、3、4、5、
6は洗浄処理槽、7、8、9、10はリンス槽、11は
乾燥部、12は半導体ウェーハを回収するアンローダー
を示す。尚、上記処理槽3〜6は同じ洗浄を行う洗浄処
理槽であり、図5〜図8の自動洗浄装置では、ローダー
から各槽、アンローダーまでの一連の槽配列が二列配配
設された構成となっている。また、一連の槽配列の方向
に沿って移動できる搬送ロボット13と14とが設けら
れている。一方の搬送ロボット13はローダー2から乾
燥部11まで、他方の搬送ロボット14は乾燥部からア
ンローダー12まで、それぞれ半導体ウェーハが収納さ
れたウェーハキャリヤK1〜4をチャッキングして上
下、左右に移動できる機能を備えている。2. Description of the Related Art Conventionally, since impurities have adhered during the manufacture of semiconductor wafers, cleaning is performed by immersing them in a chemical bath and removing them. In the case of automatically cleaning a semiconductor wafer, as shown in FIGS. 5 to 8, it is usually carried out by a transfer system called a tact system. 5 to 8 show an automatic cleaning apparatus 1 for semiconductor wafers.
2 is a loader for supplying semiconductor wafers, 3, 4, 5,
Reference numeral 6 is a cleaning treatment tank, 7, 8, 9, and 10 are rinse tanks, 11 is a drying section, and 12 is an unloader for collecting semiconductor wafers. The processing tanks 3 to 6 are cleaning processing tanks that perform the same cleaning. In the automatic cleaning apparatus of FIGS. 5 to 8, a series of tank arrays from the loader to each tank and the unloader are arranged in two rows. It has been configured. Further, transfer robots 13 and 14 which can move along the direction of a series of tank arrangements are provided. One of the transfer robots 13 chucks the wafer carriers K1 to K4 containing semiconductor wafers from the loader 2 to the drying section 11 and the other transfer robot 14 from the drying section to the unloader 12 to move them vertically and horizontally. It has a function that can.
【0003】そして、半導体ウェーハを自動洗浄するに
は、洗浄処理槽3が洗浄可能となった場合には、搬送ロ
ボット13により、まず、ローダー2にセットされたウ
ェーハキャリヤK1が図6に示すように洗浄処理槽3に
投入される。洗浄処理槽3での処理時間が終了すると、
次の洗浄処理槽4に搬送ロボット13により搬送投入さ
れる。また、空いた洗浄処理槽3にはローダー2にセッ
トされた次のウェーハキャリヤK2が図7に示すように
搬送投入される。同様に、洗浄処理槽4での処理時間が
終了すると、次の洗浄処理槽5に搬送投入され、空いた
洗浄処理槽4には洗浄処理槽3のウェーハキャリヤK2
が図8に示すように搬送投入される。このように、タク
ト方式による搬送方法では、ウェーハキャリヤK1〜4
を順番に全ての槽に投入して洗浄が行われる。In order to automatically clean semiconductor wafers, when the cleaning tank 3 can be cleaned, the transfer robot 13 first sets the wafer carrier K1 set in the loader 2 as shown in FIG. Then, the cleaning treatment tank 3 is charged. When the processing time in the cleaning processing tank 3 ends,
The transfer robot 13 transfers and loads the cleaning processing tank 4 into the next cleaning processing tank 4. Further, the next wafer carrier K2 set in the loader 2 is transferred into the empty cleaning processing tank 3 as shown in FIG. Similarly, when the processing time in the cleaning processing tank 4 ends, the wafer carrier K2 of the cleaning processing tank 3 is transferred to the next cleaning processing tank 5 and is loaded into the empty cleaning processing tank 4.
Are carried in as shown in FIG. As described above, in the tact type transfer method, the wafer carriers K1 to K4 are used.
Are sequentially charged into all the tanks for cleaning.
【0004】また、図5〜図8では、洗浄処理槽を4
槽、リンス槽を4槽、ウェーハキャリヤの搬送方向に配
置しているが、これは、搬送ロボットの遊ぶ時間ができ
ないように、各槽の処理時間との関連により、同種の槽
を複数配置したものである。In addition, in FIGS.
Four tanks and rinse tanks are arranged in the wafer carrier transfer direction. This is because a plurality of tanks of the same type are arranged in relation to the processing time of each tank so that the transfer robot cannot play. It is a thing.
【0005】[0005]
【発明が解決しようとする課題】ところが、上記従来の
洗浄方法によれば、各ウェーハキャリヤを順番に全ての
槽に搬送投入していく必要があるので、例えば、一の処
理槽の温度上昇手段が故障して洗浄条件が成り立たなく
なった場合には、前の処理槽での処理時間が終了しても
次の処理槽に搬送投入できず、最終的に装置全体が停止
してしまうことになり、トラブルが発生した処理槽の復
旧をしない限り生産がストップしてしまうという欠点を
有していた。However, according to the above-mentioned conventional cleaning method, it is necessary to sequentially transfer and introduce each wafer carrier into all the baths. Therefore, for example, the temperature raising means for one processing bath is used. If the cleaning condition fails and the cleaning conditions are no longer satisfied, it cannot be transferred to the next processing tank even after the processing time in the previous processing tank ends, and eventually the entire system will stop. However, it had the drawback that production would stop unless the processing tank in which the trouble occurred was restored.
【0006】そこで、本発明は、いずれかの処理槽でト
ラブルが発生した場合でも、装置全体を停止させること
なく洗浄が可能な半導体ウェーハの自動洗浄方法を提供
することを目的とする。Therefore, an object of the present invention is to provide an automatic cleaning method for a semiconductor wafer which can be cleaned without stopping the entire apparatus even when a trouble occurs in any of the processing tanks.
【0007】[0007]
【課題を解決するための手段】本発明の半導体ウェーハ
の自動洗浄方法は、半導体ウェーハの不純物を処理槽に
浸漬して除去する半導体ウェーハの自動洗浄方法であっ
て、洗浄処理槽とリンス処理槽などからなる一式の洗浄
工程を半導体ウェーハ搬送方向に複数式配設し、半導体
ウェーハを前記洗浄工程の処理槽に搬送投入する搬送投
入手段とこの搬送投入手段を駆動制御する制御手段とを
設け、半導体ウェーハを前記制御手段により搬送投入手
段を介して前記複数式の洗浄工程の処理槽のうち任意の
洗浄工程の処理槽に搬送投入する構成とされている。ま
た、半導体ウェーハを処理槽に搬送投入する際に、前記
複数式の洗浄工程のうち任意な洗浄工程をパスし、他の
洗浄工程の処理槽に搬送投入する構成とされている。An automatic cleaning method for semiconductor wafers according to the present invention is an automatic cleaning method for semiconductor wafers in which impurities in the semiconductor wafer are removed by immersing them in a processing tank. A plurality of sets of a cleaning process consisting of, etc. are arranged in the semiconductor wafer transfer direction, and a transfer charging means for transferring and charging semiconductor wafers into the processing bath of the cleaning step and a control means for driving and controlling this transfer charging means are provided, The semiconductor wafer is transferred by the control means to the processing tank of an arbitrary cleaning step among the processing tanks of the plurality of cleaning steps via the transfer inputting means. Further, when the semiconductor wafer is transferred into the processing tank, it is configured to pass an arbitrary cleaning step among the plurality of cleaning steps and to transfer it into the processing tank of another cleaning step.
【0008】[0008]
【作用】半導体ウェーハを処理槽に搬送投入する際に
は、、制御手段により、複数式の洗浄工程の処理槽のう
ち任意な洗浄工程の処理槽に搬送投入したり、複数式の
洗浄工程の処理槽のうち任意な洗浄工程の処理槽をパス
し、他の洗浄工程の処理槽に搬送投入されるので、いず
れかの洗浄工程の処理槽でトラブルが発生しても他の洗
浄工程の処理槽により処理が行われるので、装置全体を
停止させることなく洗浄処理が可能となる。When the semiconductor wafer is transferred into the processing tank, the control means transfers the semiconductor wafer to a processing tank of an arbitrary cleaning step among the processing tanks of the multiple cleaning steps, Of the processing tanks, it passes the processing tank of any cleaning process and is transferred to the processing tank of the other cleaning process, so even if a trouble occurs in the processing tank of one of the cleaning processes, the processing of the other cleaning process is performed. Since the treatment is performed in the bath, the washing treatment can be performed without stopping the entire apparatus.
【0009】[0009]
【実施例】以下に本発明の一実施例を図面に基づき説明
する。尚、本実施例では従来と同一部分には同一番号を
付して説明する。図1〜図4は本実施例に係る半導体ウ
ェーハの自動洗浄装置20を示しており、図中、2は半
導体ウェーハを供給するローダー、3、4、5、6は同
じ洗浄処理を行う洗浄処理槽、7、8、9、10は同じ
リンス処理を行うリンス処理槽、11は乾燥部、12は
半導体ウェーハを回収するアンローダーを示し、上記処
理槽3〜10は一連の槽配列が二列配配設された構成と
なっている。また、本実施例では、洗浄処理槽3とリン
ス処理槽7を一式の洗浄工程S1、洗浄処理槽3とリン
ス処理槽7を一式の洗浄工程S2、洗浄処理槽4とリン
ス処理槽8を一式の洗浄工程S3、洗浄処理槽5とリン
ス処理槽9を一式の洗浄工程S4とし、各洗浄工程S1
〜S4が搬送方向に順次配設され、各洗浄工程S1〜S
4は、全て、各々の洗浄処理槽で洗浄した後、各々のリ
ンス処理槽でリンス処理が行われる。更に、各槽の配列
方向に沿って移動できる搬送ロボット(搬送投入手段)
13と14と、この搬送ロボット13と14を自動的に
駆動制御する制御手段(図示省略)と、さらに各処理槽
のトラブルを検知するトラブル検知手段(図示省略)と
が設けられている。一方の搬送ロボット13はローダー
2から乾燥部11まで、他方の搬送ロボット14は乾燥
部からアンローダー12まで、それぞれ半導体ウェーハ
が収納されたウェーハキャリヤK1〜4をチャッキング
して上下、左右に移動できる機能を備えている。DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS An embodiment of the present invention will be described below with reference to the drawings. In the present embodiment, the same parts as those of the related art will be described with the same numbers. 1 to 4 show an automatic cleaning apparatus 20 for semiconductor wafers according to the present embodiment, in which 2 is a loader for supplying a semiconductor wafer, 3, 4, 5, and 6 are cleaning processes for performing the same cleaning process. Tanks 7, 8, 9, 10 are rinse treatment tanks for performing the same rinse treatment, 11 is a drying unit, 12 is an unloader for collecting semiconductor wafers, and the treatment tanks 3 to 10 have a series of two tank arrays. It is arranged in a distributed manner. Further, in this embodiment, the cleaning treatment tank 3 and the rinse treatment tank 7 are a set of the cleaning step S1, the cleaning treatment tank 3 and the rinse treatment tank 7 are a set of the cleaning step S2, and the cleaning treatment tank 4 and the rinse treatment tank 8 are a set. Cleaning step S3, cleaning processing tank 5 and rinse processing tank 9 as one set of cleaning step S4, and each cleaning step S1
To S4 are sequentially arranged in the carrying direction, and each cleaning process S1 to S4 is performed.
In No. 4, after washing in each washing treatment tank, rinsing treatment is performed in each rinsing treatment tank. Furthermore, a transfer robot (transfer means) that can move along the arrangement direction of each tank
13 and 14, a control means (not shown) for automatically driving and controlling the transfer robots 13 and 14, and a trouble detection means (not shown) for detecting a trouble in each processing tank are provided. One transfer robot 13 chucks the wafer carriers K1 to K4 in which semiconductor wafers are stored from the loader 2 to the drying unit 11 and the other transfer robot 14 moves from the drying unit to the unloader 12 vertically and horizontally. It has a function that can.
【0010】このような自動洗浄装置20により半導体
ウェーハを自動洗浄するには、洗浄工程S1〜S4の内
のいずれかの洗浄処理槽へウェーハキャリヤの投入が可
能となると、搬送ロボット13により、ローダー2にセ
ットされたウェーハキャリヤK1が投入可能な洗浄工程
の処理槽に搬送され投入される。In order to automatically clean a semiconductor wafer by such an automatic cleaning device 20, when the wafer carrier can be loaded into any one of the cleaning processing tanks of the cleaning steps S1 to S4, the transfer robot 13 causes the loader to load. The wafer carrier K1 set to 2 is transported and loaded into the processing bath of the cleaning process in which it can be loaded.
【0011】例えば、洗浄工程S4が投入可能となった
場合には、ローダー2にセットされたウェーハキャリヤ
K1が、搬送ロボット13により、図2に示すように、
洗浄処理槽6に投入される。またに、洗浄工程S2が投
入可能となった場合には、ローダー2にセットされたウ
ェーハキャリヤK2が、図3に示すように、洗浄処理槽
4に投入される。次に、洗浄工程S4の洗浄処理槽6の
ウェーハキャリヤK1の洗浄が完了し、また、洗浄工程
S1が投入可能となると、図4に示すように、洗浄処理
槽6のウェーハキャリヤK1が同じ洗浄工程S4のリン
ス処理槽10に搬送投入され、ローダー2にセットされ
たウェーハキャリヤK3が洗浄工程S1の洗浄処理槽3
に搬送投入される。その後、洗浄工程S4のリンス処理
槽10でリンス処理が完了したウェーハキャリヤK1
は、搬送ロボット13により乾燥部11に搬送されて乾
燥処理が行なわれる。乾燥処理が終了すると、搬送ロボ
ット14により取り出されてアンローダー12に搬送さ
れ、洗浄処理が終了する。他のウェーハキャリヤK2〜
K4も同様にして洗浄処理が行われる。For example, when the cleaning step S4 becomes possible, the wafer carrier K1 set in the loader 2 is moved by the transfer robot 13 as shown in FIG.
It is put into the cleaning treatment tank 6. Further, when the cleaning step S2 becomes possible, the wafer carrier K2 set in the loader 2 is charged into the cleaning processing tank 4 as shown in FIG. Next, when the cleaning of the wafer carrier K1 in the cleaning processing tank 6 in the cleaning step S4 is completed and the cleaning step S1 can be put in, as shown in FIG. 4, the same cleaning of the wafer carrier K1 in the cleaning processing tank 6 is performed. The wafer carrier K3 set in the loader 2 is transferred to the rinsing tank 10 in the step S4, and the wafer carrier K3 set in the loader 2 is the cleaning tank 3 in the cleaning step S1.
It is transported to and fed into. Then, the wafer carrier K1 which has been rinsed in the rinse tank 10 in the cleaning step S4.
Is transported to the drying unit 11 by the transport robot 13 and subjected to a drying process. When the drying process is completed, it is taken out by the transfer robot 14 and transferred to the unloader 12, and the cleaning process is completed. Other wafer carriers K2
The cleaning process is similarly performed on K4.
【0012】また、このような洗浄処理において、例え
ば、トラブル検知手段により洗浄工程S3が何らかのト
ラブルが発生し使用できないことが検知された場合に
は、制御手段により洗浄工程S3をパスし、残りの洗浄
工程S1、2、4を使用する制御が行われる。したがっ
て、いずれかの洗浄工程の処理槽でトラブルが発生して
も他の洗浄工程の処理槽により処理が行われるので、装
置全体を停止させることなく洗浄処理が可能となり、半
導体ウェーハの生産低下を防止できる。Further, in such a cleaning process, for example, when the trouble detecting means detects that the cleaning step S3 cannot be used due to some trouble, the control means passes the cleaning step S3 and the remaining steps are performed. Control using the cleaning steps S1, 2, 4 is performed. Therefore, even if a trouble occurs in the processing tank of any of the cleaning steps, the processing is performed in the processing tanks of the other cleaning steps, so that the cleaning processing can be performed without stopping the entire apparatus, which reduces the production of semiconductor wafers. It can be prevented.
【0013】尚、本実施例では洗浄工程S1〜S4の4
式としたが、これに限らず何式でもかまわない。また、
各洗浄工程の槽数を洗浄処理槽とリンス処理槽との2槽
で構成したが、それぞれ何槽としてもよい。In this embodiment, four cleaning steps S1 to S4 are performed.
Although the formula is used, the formula is not limited to this and may be any formula. Also,
Although the number of tanks in each cleaning step is two tanks including the cleaning tank and the rinse tank, any number of tanks may be used.
【0014】[0014]
【発明の効果】以上説明したように本発明によれば、複
数式の洗浄工程の処理槽のうち任意な洗浄工程の処理槽
に搬送投入したり、複数式の洗浄工程の処理槽のうち任
意な洗浄工程の処理槽をパスし、他の洗浄工程の処理槽
に搬送投入されるので、いずれかの洗浄工程の処理槽で
トラブルが発生しても他の洗浄工程の処理槽により各処
理が行われるので、装置全体を停止させることなく洗浄
処理が可能となり、半導体ウェーハの生産低下を防止す
ることができる。As described above, according to the present invention, it can be transferred to and charged into a treatment tank of an arbitrary cleaning step among a plurality of treatment tanks of a cleaning step, or an arbitrary treatment tank of a plurality of cleaning steps. Since it passes through the processing tanks of different cleaning processes and is transferred to the processing tanks of other cleaning processes, even if a problem occurs in the processing tank of one of the cleaning processes, each processing can be performed by the processing tanks of the other cleaning process. Since the cleaning process is performed, the cleaning process can be performed without stopping the entire apparatus, and the reduction in the production of semiconductor wafers can be prevented.
【図1】本発明の一実施例に係り、半導体ウェーハの自
動洗浄装置を示す概略平面図。FIG. 1 is a schematic plan view showing an automatic cleaning apparatus for semiconductor wafers according to an embodiment of the present invention.
【図2】半導体ウェーハの自動洗浄装置を示す概略平面
図。FIG. 2 is a schematic plan view showing an automatic cleaning apparatus for semiconductor wafers.
【図3】半導体ウェーハの自動洗浄装置を示す概略平面
図。FIG. 3 is a schematic plan view showing an automatic cleaning apparatus for semiconductor wafers.
【図4】半導体ウェーハの自動洗浄装置を示す概略平面
図。FIG. 4 is a schematic plan view showing an automatic cleaning apparatus for semiconductor wafers.
【図5】従来例に係り、半導体ウェーハの自動洗浄装置
を示す概略平面図。FIG. 5 is a schematic plan view showing an automatic cleaning apparatus for semiconductor wafers according to a conventional example.
【図6】半導体ウェーハの自動洗浄装置を示す概略平面
図。FIG. 6 is a schematic plan view showing an automatic cleaning apparatus for semiconductor wafers.
【図7】半導体ウェーハの自動洗浄装置を示す概略平面
図。FIG. 7 is a schematic plan view showing an automatic cleaning apparatus for semiconductor wafers.
【図8】半導体ウェーハの自動洗浄装置を示す概略平面
図。FIG. 8 is a schematic plan view showing an automatic cleaning apparatus for semiconductor wafers.
3、4、5、6 洗浄処理槽 7、8、9、10 リンス処理槽 13、14 搬送投入手段 K1〜K4 ウェーハキャリヤ S1〜S4 洗浄工程 3, 4, 5, 6 Cleaning treatment tank 7, 8, 9, 10 Rinsing treatment tank 13, 14 Transfer charging means K1 to K4 Wafer carrier S1 to S4 Cleaning process
Claims (2)
して除去する半導体ウェーハの自動洗浄方法において、 洗浄処理槽とリンス処理槽などからなる一式の洗浄工程
を半導体ウェーハ搬送方向に複数式配設し、半導体ウェ
ーハを前記洗浄工程の処理槽に搬送投入する搬送投入手
段とこの搬送投入手段を駆動制御する制御手段とを設
け、半導体ウェーハを前記制御手段により搬送投入手段
を介して前記複数式の洗浄工程の処理槽のうち任意の洗
浄工程の処理槽に搬送投入することを特徴とする半導体
ウェーハの自動洗浄方法。1. An automatic cleaning method for a semiconductor wafer, which comprises removing impurities from a semiconductor wafer by immersing the semiconductor wafer in a processing tank, wherein a plurality of cleaning steps including a cleaning processing tank and a rinse processing tank are provided in a semiconductor wafer transfer direction. Then, a transfer charging means for transferring and charging the semiconductor wafer into the processing tank of the cleaning step and a control means for driving and controlling this transfer charging means are provided, and the semiconductor wafer is transferred by the control means through the transfer charging means to the above-mentioned plural types. An automatic cleaning method for a semiconductor wafer, which is characterized in that the semiconductor wafer is transferred into a processing tank of an arbitrary cleaning step among the processing tanks of the cleaning step.
する際に、前記複数式の洗浄工程のうち任意な洗浄工程
をパスし、他の洗浄工程の処理槽に搬送投入する請求項
1記載の半導体ウェーハの自動洗浄方法。2. The method according to claim 1, wherein when the semiconductor wafer is transferred into the processing tank, it passes through any cleaning step of the plurality of cleaning steps and is transferred into the processing tank of another cleaning step. Automatic cleaning method for semiconductor wafers.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP1093792A JPH05206092A (en) | 1992-01-24 | 1992-01-24 | Method of automatically washing semiconductor wafer |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP1093792A JPH05206092A (en) | 1992-01-24 | 1992-01-24 | Method of automatically washing semiconductor wafer |
Publications (1)
Publication Number | Publication Date |
---|---|
JPH05206092A true JPH05206092A (en) | 1993-08-13 |
Family
ID=11764137
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP1093792A Pending JPH05206092A (en) | 1992-01-24 | 1992-01-24 | Method of automatically washing semiconductor wafer |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPH05206092A (en) |
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2001223199A (en) * | 2000-02-10 | 2001-08-17 | Dainippon Screen Mfg Co Ltd | Substrate treating device |
US6336463B1 (en) | 1998-03-31 | 2002-01-08 | Nec Corporation | Cleaning/drying station and production line for semiconductor devices |
JP2007266050A (en) * | 2006-03-27 | 2007-10-11 | Dainippon Screen Mfg Co Ltd | Method of executing schedule of substrate processing apparatus and program thereof |
-
1992
- 1992-01-24 JP JP1093792A patent/JPH05206092A/en active Pending
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US6336463B1 (en) | 1998-03-31 | 2002-01-08 | Nec Corporation | Cleaning/drying station and production line for semiconductor devices |
JP2001223199A (en) * | 2000-02-10 | 2001-08-17 | Dainippon Screen Mfg Co Ltd | Substrate treating device |
JP2007266050A (en) * | 2006-03-27 | 2007-10-11 | Dainippon Screen Mfg Co Ltd | Method of executing schedule of substrate processing apparatus and program thereof |
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