JPS64810B2 - - Google Patents
Info
- Publication number
- JPS64810B2 JPS64810B2 JP8557581A JP8557581A JPS64810B2 JP S64810 B2 JPS64810 B2 JP S64810B2 JP 8557581 A JP8557581 A JP 8557581A JP 8557581 A JP8557581 A JP 8557581A JP S64810 B2 JPS64810 B2 JP S64810B2
- Authority
- JP
- Japan
- Prior art keywords
- endless
- wafer
- stretched
- arm
- liquid tank
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- 239000007788 liquid Substances 0.000 claims description 10
- 239000004065 semiconductor Substances 0.000 claims description 5
- 238000006243 chemical reaction Methods 0.000 claims 1
- 235000012431 wafers Nutrition 0.000 description 18
- 230000007723 transport mechanism Effects 0.000 description 8
- 230000003028 elevating effect Effects 0.000 description 4
- 238000005530 etching Methods 0.000 description 3
- 238000004519 manufacturing process Methods 0.000 description 3
- 230000007246 mechanism Effects 0.000 description 3
- 238000000034 method Methods 0.000 description 3
- 238000004140 cleaning Methods 0.000 description 2
- 238000007689 inspection Methods 0.000 description 2
- 238000012423 maintenance Methods 0.000 description 2
- 239000002253 acid Substances 0.000 description 1
- 239000000428 dust Substances 0.000 description 1
- 229920002120 photoresistant polymer Polymers 0.000 description 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67763—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading
- H01L21/67778—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading involving loading and unloading of wafers
- H01L21/67781—Batch transfer of wafers
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic System or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
- H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
- H01L21/306—Chemical or electrical treatment, e.g. electrolytic etching
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67763—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading
- H01L21/67766—Mechanical parts of transfer devices
Description
【発明の詳細な説明】
本発明は、半導体ウエハーに対し現像、エツチ
ング、洗浄などの処理を施すための装置に関す
る。DETAILED DESCRIPTION OF THE INVENTION The present invention relates to an apparatus for performing processing such as developing, etching, and cleaning on semiconductor wafers.
半導体ウエハーの製造工程中には、ホトレジス
トマスクを形成したウエハーをエツチング液中に
浸して所望部分をエツチングする処理、および該
処理ののちウエハー表面を純水、酸などで洗浄す
る処理などが含まれている。 The manufacturing process of semiconductor wafers includes a process in which the wafer on which a photoresist mask has been formed is immersed in an etching solution to etch desired areas, and after this process, the wafer surface is cleaned with pure water, acid, etc. ing.
そこで従来、かかる処理を行なうウエハー処理
装置が種々提案されているが、いずれもウエハー
搬送機構の構成が複雑であるため製造コストが高
くかつ保守点検に手間を要した。また上記搬送機
構に用いられるチエーンやベルトおよびその周辺
可動部を多数個の動力源でもつて駆動させるよう
にしているので、これらの動力源とそれらによつ
て駆動される機械要素との動作タイミングを良好
にとることが困難であり、そのため動作の安定性
に欠け故障も多かつた。 Various wafer processing apparatuses that perform such processing have heretofore been proposed, but all of them have complicated wafer transport mechanisms, resulting in high manufacturing costs and time-consuming maintenance and inspection. In addition, since the chains and belts used in the above-mentioned conveyance mechanism and their surrounding movable parts are driven by multiple power sources, the operation timing of these power sources and the mechanical elements driven by them is controlled. It was difficult to maintain good performance, and as a result, the operation was unstable and there were many failures.
本発明はかかる従来装置の欠点に鑑み、単一の
動力源を用いた簡易な構成のウエハー搬送機構に
よつて半導体に対する前記したような処理を能率
よく実施することができる半導体ウエハーの処理
装置を提供することを目的とする。 In view of the drawbacks of the conventional devices, the present invention provides a semiconductor wafer processing device that can efficiently perform the above-described processing on semiconductors using a simple wafer transport mechanism using a single power source. The purpose is to provide.
以下、図面に示す実施例を参照して本発明を詳
細に説明する。 Hereinafter, the present invention will be explained in detail with reference to embodiments shown in the drawings.
本発明に係るウエハー処理装置は、第１図およ
び第２図にその一実施例を概念的に示すように、
ウエハー搬送機構１と、後記するチエーン３，４
に沿う態様で該機構１の側方に配設した多数槽構
造の液槽２とからなつている。 The wafer processing apparatus according to the present invention, as one embodiment thereof is conceptually shown in FIGS. 1 and 2,
Wafer transport mechanism 1 and chains 3 and 4 to be described later
It consists of a liquid tank 2 with a multi-tank structure arranged on the side of the mechanism 1 in a manner along the lines.
上記ウエハー搬送機構１は、互いに平行する態
様で装置の長手方向に沿つて張設した第１および
第２の無端体、たとえばチエーン３および４と、
これらのチエーンをそれぞれ巻掛けたスプロケツ
ト５，５′および６，６′と、スプロケツト５，６
の各駆動軸７，８間に介在させたクラツチ手段た
とえば電磁クラツチ９と、上記駆動軸７に連結し
た直流電動機１０と、上記チエーン３，４の張設
方向に沿つて移動しうるように２本のガイドシヤ
フト１１によつて支承させたスライド部材１２と
からなつている。なお、上記スプロケツト５′，
６′は各別な軸７′，８′により支承させてある。 The wafer transport mechanism 1 includes first and second endless bodies, for example chains 3 and 4, which are stretched along the longitudinal direction of the apparatus in parallel to each other;
Sprockets 5, 5' and 6, 6' around which these chains are wound, respectively, and sprockets 5, 6
A clutch means, for example, an electromagnetic clutch 9, interposed between each of the drive shafts 7, 8; a DC motor 10 connected to the drive shaft 7; It consists of a slide member 12 supported by a book guide shaft 11. In addition, the above sprocket 5',
6' are supported by separate shafts 7', 8'.
上記スライド部材１２は、上記チエーン３，４
に直方する態様で位置させてある。そしてその左
下側部にスプロケツト１３を設けてこれを上記チ
エーン３に係合させるとともに、右端下部を他方
のチエーン４に連結させ、さらにその左端部にス
クリユーロツド１４を垂直にかつ回転可能に挿着
し、該ロツド１４の下端に付設した傘歯車１５を
上記スプロケツト１３の軸に付設した傘歯車１６
に噛合させてある。しかして上記スクリユーロツ
ド１４の上方部分に昇降部材１７の一端を螺合貫
通させるとともに、該部材１７の他端側面より前
記槽２の上方に向つてアーム１８を突設し、この
アーム１８にハンガー１９を釣り下げてある。な
お、上記ハンガー１９は処理すべきウエハー（図
示せず）を収納させたキヤリヤ２０を設置するた
めのものである。また上記スライド部材１２の上
部より上方に突出させたシヤフト２１は、上記昇
降部材１７を上下方向に案内するものである。 The slide member 12 is connected to the chains 3 and 4.
It is located in a manner perpendicular to. A sprocket 13 is provided on the lower left side and engaged with the chain 3, and the lower right end is connected to the other chain 4, and a screw rod 14 is vertically and rotatably inserted into the left end. The bevel gear 15 attached to the lower end of the rod 14 is connected to the bevel gear 16 attached to the shaft of the sprocket 13.
It is meshed with. One end of the elevating member 17 is screwed through the upper part of the screw rod 14, and an arm 18 is provided projecting upward from the side surface of the other end of the member 17 toward the upper part of the tank 2. Hanger 19 is hung. The hanger 19 is used to install a carrier 20 containing wafers (not shown) to be processed. Further, a shaft 21 projecting upward from the upper part of the slide member 12 guides the elevating member 17 in the vertical direction.
上記搬送機構１において、前記駆動軸７に付設
したスリツト付円板２２と、該円板の縁部に配し
たフオトセンサ２３は、上記スライドブロツク１
２の移動位置および上記昇降部材１７の昇降位置
つまり上記キヤリヤ２０の高さ位置を上記電動機
１０の回転数から検出するべく設けたものであ
り、フオトセンサ２３の出力信号は上記電動機１
０を制御するためのデータとして図示していない
電動機制御回路に入力される。 In the transport mechanism 1, a disc 22 with a slit attached to the drive shaft 7 and a photo sensor 23 arranged on the edge of the disc are connected to the slide block 1.
The photo sensor 23 is provided to detect the movement position of the motor 2 and the vertical position of the elevating member 17, that is, the height position of the carrier 20, from the rotational speed of the electric motor 10.
This data is inputted to a motor control circuit (not shown) as data for controlling 0.
いま上記クラツチ９によつて前記駆動軸７，８
を連結させた状態で上記電動機１０を回転させる
と、上記チエーン４の走行に伴つて上記スライド
部材１２が移動されるが、そのさい該部材１２に
付設されている前記スプロケツト１３は回転しな
い。なぜなら上記スライド部材１２が移動する速
度と同じ速度で他方のチエーン３が走行するから
である。 The drive shafts 7, 8 are now connected by the clutch 9.
When the electric motor 10 is rotated with the chain 4 connected, the slide member 12 is moved as the chain 4 runs, but the sprocket 13 attached to the member 12 does not rotate at this time. This is because the other chain 3 travels at the same speed as the slide member 12 moves.
そこで前記アーム１８から釣り下げたハンガー
１９が、上記液槽２の第１分割槽２ａの上方に位
置するように上記スライド部材１２を移動させ、
しかるのち上記クラツチ９を切ると、一方のチエ
ーン３のみが走行状態を継続し他方のチエーン４
は停止するので上記スライド部材１２がチエーン
４によつてロツクされ、同時にチエーン３によつ
て上記スプロケツト１３が回転される。しかし
て、このスプロケツト１３の回転に伴つて上記ス
クリユーロツド１４が回転し、それによつて上記
昇降部材１２およびアーム１８が下降を開始する
ので、所定時間ののち上記電動機１０を停止させ
れば、上記キヤリヤ２０が第２図に示す態様で上
記槽２ａ内の処理液中に没せられる。なおこのと
き、上記電動機１０を交互に正逆回転させて上記
キヤリヤ２０を処理液中で所定ストローク上下動
させれば、処理液が撹拌されるのでより確実にエ
ツチングあるいは洗浄処理を施すことができる。 Then, the slide member 12 is moved so that the hanger 19 suspended from the arm 18 is positioned above the first divided tank 2a of the liquid tank 2,
Then, when the clutch 9 is released, only one chain 3 continues to run while the other chain 4
Since this stops, the slide member 12 is locked by the chain 4, and at the same time the sprocket 13 is rotated by the chain 3. As the sprocket 13 rotates, the screw rod 14 rotates, and the elevating member 12 and the arm 18 begin to descend. Therefore, if the electric motor 10 is stopped after a predetermined period of time, The carrier 20 is immersed in the processing liquid in the tank 2a in the manner shown in FIG. At this time, if the electric motor 10 is alternately rotated in forward and reverse directions to move the carrier 20 up and down by a predetermined stroke in the processing liquid, the processing liquid will be stirred, so that the etching or cleaning process can be carried out more reliably. .
所定時間後、上記電動機１０を所定回転数だけ
逆転させると、上記とは逆の態様でアーム１８が
元の位置まで上昇する。かくして上記と同様の動
作をくり返して行なわせることにより、上記キヤ
リヤ２０を第２、第３、……の各分割槽２ｂ，２
ｃ，……内に順次挿入してウエハーをエツチング
処理および洗浄処理しうる。 After a predetermined period of time, when the electric motor 10 is reversed by a predetermined number of rotations, the arm 18 rises to its original position in a manner opposite to that described above. By repeating the same operation as described above, the carrier 20 is transferred to each of the second, third, . . . divided tanks 2b, 2.
The wafer can be etched and cleaned by being sequentially inserted into the wafers c, .
なお、上記スライド部材１２の移動位置および
上記アーム１８つまり昇降部材１７の移動位置
は、上記フオトセンサ２３の出力信号を計数手段
に入力することによつて容易に得ることができ、
前記電動機１０に対する正、逆転および停止制御
は上記計数手段の計数内容にもとづき行なわれ
る。 The moving position of the slide member 12 and the moving position of the arm 18, that is, the lifting member 17 can be easily obtained by inputting the output signal of the photo sensor 23 to the counting means.
Forward, reverse, and stop control of the electric motor 10 is performed based on the count contents of the counting means.
本発明に係るウエハー処理装置は少なくとも次
に列挙するような利点をもつ。 The wafer processing apparatus according to the present invention has at least the following advantages.
従来装置に比してきわめて構成が簡単であ
り、したがつて製造コストが安く、保守点検も
容易である。 The structure is extremely simple compared to conventional devices, and therefore manufacturing costs are low and maintenance and inspection are easy.
動力源が１つであるので電気的な制御が容易
であり、また電気系と機械系の動作タイミング
を容易に一致させることができるので、信頼性
の高い動作を行いかつ故障も少ない。 Since there is only one power source, electrical control is easy, and since the operating timings of the electrical system and mechanical system can be easily matched, highly reliable operation is achieved and there are few failures.
搬送機構の構成からして、実施例に示したよ
うに該機構の側方に液槽を配置することがで
き、かくすることによつて搬送機構の動作時に
液槽内にゴミ、ホコリなどが落下してウエハー
および処理液が汚染されるなどの不都合を防止
しうる。 Considering the configuration of the transport mechanism, the liquid tank can be placed on the side of the mechanism as shown in the example, thereby preventing dirt, dust, etc. from entering the liquid tank during operation of the transport mechanism. This can prevent inconveniences such as dropping and contaminating the wafer and processing solution.
第１図は本発明によるウエハー搬送装置の一実
施例を概念的に示した斜視図、第２図は第１図の
Ａ−Ａ線による断面図である。
１……ウエハー搬送機構、２……処理液槽、
３，４……チエーン、５，５′，６，６′，１３…
…スプロケツト、７，８……駆動軸、９……電磁
クラツチ、１０……電動機、１１……ガイドシヤ
フト、１２……スライド部材、１４……スクリユ
ーロツド、１５，１６……傘歯車、１７……昇降
部材、１８……アーム、１９……ハンガー、２０
……キヤリヤ、２１……ガイドシヤフト、２２…
…円板、２３……フオトセンサ。
FIG. 1 is a perspective view conceptually showing an embodiment of a wafer transfer apparatus according to the present invention, and FIG. 2 is a sectional view taken along line A--A in FIG. 1. 1... Wafer transport mechanism, 2... Processing liquid tank,
3, 4...Chain, 5, 5', 6, 6', 13...
... Sprocket, 7, 8 ... Drive shaft, 9 ... Electromagnetic clutch, 10 ... Electric motor, 11 ... Guide shaft, 12 ... Slide member, 14 ... Screw rod, 15, 16 ... Bevel gear, 17 ... Lifting member, 18 ... Arm, 19 ... Hanger, 20
...Carrier, 21...Guide shaft, 22...
...Disk, 23...Photo sensor.
Claims (1)
端体と、これらの無端体の駆動軸間に介在させた
クラツチ手段と、上記第１の無端体の駆動軸に連
結した回転動力源と、上記無端体の張設方向に沿
つて移動しうるようガイドシヤフトによつて支承
させたスライド部材と、上記無端体の張設方向に
沿つて配設した処理液槽とを備え、上記スライド
部材の一端に上記第１の無端体に接して回動力を
受ける回転体を設けるとともに該部材の他端を上
記第２の無端体に連結させ、さらに上記スライド
部材に上記回転体の回転運動を上下運動に変換す
る手段および上記処理液槽上において処理すべき
半導体ウエハーを保持させるためのアームを設
け、該アームを上記運動変換によつて上昇、下降
させるように構成したことを特徴とするウエハー
搬送装置。1 first and second endless bodies stretched in parallel with each other, a clutch means interposed between the drive shafts of these endless bodies, and a rotary power source connected to the drive shaft of the first endless body; , a slide member supported by a guide shaft so as to be movable along the direction in which the endless body is stretched, and a processing liquid tank disposed along the direction in which the endless body is stretched; A rotating body that contacts the first endless body and receives rotational force is provided at one end, and the other end of the member is connected to the second endless body, and the sliding member controls the rotational movement of the rotating body up and down. A wafer conveyor comprising means for converting the movement into motion and an arm for holding the semiconductor wafer to be processed above the processing liquid tank, and the arm is configured to be raised and lowered by the movement conversion. Device.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP8557581A JPS57201028A (en) | 1981-06-05 | 1981-06-05 | Wafer conveying device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP8557581A JPS57201028A (en) | 1981-06-05 | 1981-06-05 | Wafer conveying device |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS57201028A JPS57201028A (en) | 1982-12-09 |
| JPS64810B2 true JPS64810B2 (en) | 1989-01-09 |
Family
ID=13862607
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP8557581A Granted JPS57201028A (en) | 1981-06-05 | 1981-06-05 | Wafer conveying device |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS57201028A (en) |
Families Citing this family (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS59127838A (en) * | 1983-01-11 | 1984-07-23 | Sumitomo Electric Ind Ltd | Continuous etching device for mirror wafer |
| JPH058675Y2 (en) * | 1985-03-13 | 1993-03-04 | ||
| JPS63260037A (en) * | 1987-04-16 | 1988-10-27 | Nec Kyushu Ltd | Semiconductor substrate automatic chemical treatment apparatus |
| US4902608A (en) * | 1987-12-17 | 1990-02-20 | Texas Instruments Incorporated | Immersion development and rinse machine and process |
-
1981
- 1981-06-05 JP JP8557581A patent/JPS57201028A/en active Granted
Also Published As
| Publication number | Publication date |
|---|---|
| JPS57201028A (en) | 1982-12-09 |
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