JPS57190341A - Circuit borad composition - Google Patents

Circuit borad composition

Info

Publication number
JPS57190341A
JPS57190341A JP7425581A JP7425581A JPS57190341A JP S57190341 A JPS57190341 A JP S57190341A JP 7425581 A JP7425581 A JP 7425581A JP 7425581 A JP7425581 A JP 7425581A JP S57190341 A JPS57190341 A JP S57190341A
Authority
JP
Japan
Prior art keywords
gold
tin alloy
electrodes
plating
constitution
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP7425581A
Other languages
English (en)
Japanese (ja)
Other versions
JPS6342852B2 (ko
Inventor
Yoshihiro Shimada
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Citizen Holdings Co Ltd
Citizen Watch Co Ltd
Original Assignee
Citizen Holdings Co Ltd
Citizen Watch Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Citizen Holdings Co Ltd, Citizen Watch Co Ltd filed Critical Citizen Holdings Co Ltd
Priority to JP7425581A priority Critical patent/JPS57190341A/ja
Publication of JPS57190341A publication Critical patent/JPS57190341A/ja
Publication of JPS6342852B2 publication Critical patent/JPS6342852B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
    • H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
    • H01L23/498—Leads, i.e. metallisations or lead-frames on insulating substrates, e.g. chip carriers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Landscapes

  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)
  • Manufacturing Of Printed Wiring (AREA)
  • Wire Bonding (AREA)
JP7425581A 1981-05-19 1981-05-19 Circuit borad composition Granted JPS57190341A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP7425581A JPS57190341A (en) 1981-05-19 1981-05-19 Circuit borad composition

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP7425581A JPS57190341A (en) 1981-05-19 1981-05-19 Circuit borad composition

Publications (2)

Publication Number Publication Date
JPS57190341A true JPS57190341A (en) 1982-11-22
JPS6342852B2 JPS6342852B2 (ko) 1988-08-25

Family

ID=13541854

Family Applications (1)

Application Number Title Priority Date Filing Date
JP7425581A Granted JPS57190341A (en) 1981-05-19 1981-05-19 Circuit borad composition

Country Status (1)

Country Link
JP (1) JPS57190341A (ko)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0441164A2 (en) * 1990-02-09 1991-08-14 International Business Machines Corporation Composition and coating to prevent current induced electro-chemical dendrite formation between conductors on dielectric substrate
US5208186A (en) * 1989-02-09 1993-05-04 National Semiconductor Corporation Process for reflow bonding of bumps in IC devices
US6333554B1 (en) 1997-09-08 2001-12-25 Fujitsu Limited Semiconductor device with gold bumps, and method and apparatus of producing the same

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2015001446A1 (en) * 2013-07-03 2015-01-08 Koninklijke Philips N.V. Led with stress-buffer layer under metallization layer

Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5208186A (en) * 1989-02-09 1993-05-04 National Semiconductor Corporation Process for reflow bonding of bumps in IC devices
EP0441164A2 (en) * 1990-02-09 1991-08-14 International Business Machines Corporation Composition and coating to prevent current induced electro-chemical dendrite formation between conductors on dielectric substrate
US6333554B1 (en) 1997-09-08 2001-12-25 Fujitsu Limited Semiconductor device with gold bumps, and method and apparatus of producing the same
US6344690B1 (en) 1997-09-08 2002-02-05 Fujitsu Limited Semiconductor device with gold bumps, and method and apparatus of producing the same
US6495441B2 (en) 1997-09-08 2002-12-17 Fujitsu Limited Semiconductor device with gold bumps, and method and apparatus of producing the same
US6786385B1 (en) 1997-09-08 2004-09-07 Fujitsu Limited Semiconductor device with gold bumps, and method and apparatus of producing the same

Also Published As

Publication number Publication date
JPS6342852B2 (ko) 1988-08-25

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