JPS57181129A - Forming device molding package of semiconductors - Google Patents

Forming device molding package of semiconductors

Info

Publication number
JPS57181129A
JPS57181129A JP6660781A JP6660781A JPS57181129A JP S57181129 A JPS57181129 A JP S57181129A JP 6660781 A JP6660781 A JP 6660781A JP 6660781 A JP6660781 A JP 6660781A JP S57181129 A JPS57181129 A JP S57181129A
Authority
JP
Japan
Prior art keywords
lead frame
frame
forming
heated
shapes
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP6660781A
Other languages
English (en)
Japanese (ja)
Other versions
JPS6258546B2 (enrdf_load_stackoverflow
Inventor
Toshiyuki Arai
Keiji Sakota
Shinichi Oota
Kiichi Kanamaru
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Resonac Corp
Original Assignee
Hitachi Chemical Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Chemical Co Ltd filed Critical Hitachi Chemical Co Ltd
Priority to JP6660781A priority Critical patent/JPS57181129A/ja
Publication of JPS57181129A publication Critical patent/JPS57181129A/ja
Publication of JPS6258546B2 publication Critical patent/JPS6258546B2/ja
Granted legal-status Critical Current

Links

Classifications

    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/50Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the groups H01L21/18 - H01L21/326 or H10D48/04 - H10D48/07 e.g. sealing of a cap to a base of a container
    • H01L21/56Encapsulations, e.g. encapsulation layers, coatings
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001Technical content checked by a classifier
    • H01L2924/0002Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Casting Or Compression Moulding Of Plastics Or The Like (AREA)
  • Moulds For Moulding Plastics Or The Like (AREA)
JP6660781A 1981-04-30 1981-04-30 Forming device molding package of semiconductors Granted JPS57181129A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP6660781A JPS57181129A (en) 1981-04-30 1981-04-30 Forming device molding package of semiconductors

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP6660781A JPS57181129A (en) 1981-04-30 1981-04-30 Forming device molding package of semiconductors

Publications (2)

Publication Number Publication Date
JPS57181129A true JPS57181129A (en) 1982-11-08
JPS6258546B2 JPS6258546B2 (enrdf_load_stackoverflow) 1987-12-07

Family

ID=13320751

Family Applications (1)

Application Number Title Priority Date Filing Date
JP6660781A Granted JPS57181129A (en) 1981-04-30 1981-04-30 Forming device molding package of semiconductors

Country Status (1)

Country Link
JP (1) JPS57181129A (enrdf_load_stackoverflow)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4764235A (en) * 1985-08-01 1988-08-16 Hitachi Chemical Company, Ltd. Process and apparatus for sealing semiconductor packages

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4764235A (en) * 1985-08-01 1988-08-16 Hitachi Chemical Company, Ltd. Process and apparatus for sealing semiconductor packages

Also Published As

Publication number Publication date
JPS6258546B2 (enrdf_load_stackoverflow) 1987-12-07

Similar Documents

Publication Publication Date Title
MY100857A (en) Method and apparatus for the manufacture of composite articles, and articles made thereby
JPS62122136A (ja) レジンモールド半導体の製造方法および装置
EP0910121A4 (en) SEMICONDUCTOR DEVICE
JPH04147814A (ja) 樹脂封入成形用金型
JPS57181129A (en) Forming device molding package of semiconductors
JPS5587469A (en) Semiconductor device and its manufacture
JPS6154633A (ja) 半導体樹脂封止用金型
JPS62130531A (ja) 半導体装置の樹脂モ−ルド方法
JPS5513932A (en) Transfer mold for semiconductor device
JPS635226Y2 (enrdf_load_stackoverflow)
JPS6111462B2 (enrdf_load_stackoverflow)
US3454985A (en) Pressure and heat transfer apparatus
JPS5633847A (en) Package molding for semiconductor
JPS59220932A (ja) 半導体素子用モ−ルド樹脂の予熱装置
JPS5720437A (en) Resin sealing metal mold for semiconductor device
JPS6154635A (ja) 半導体樹脂封止用金型
KR0157100B1 (ko) 반도체밀봉금형
GB8920312D0 (en) Phenol resin molding composition,process for producing the same,and semiconductor device sealed with said composition
JPS5754355A (en) Plastic molded type semiconductor device
JPS6464239A (en) Apparatus for manufacturing resin package sealing for semiconductor
KR0139127Y1 (ko) 반도체패키지 제조용 몰딩프레스의 금형 발열장치
JPS5521126A (en) Marking method in resin mold parts
KR0139128Y1 (ko) 반도체패키지 제조용 몰딩프레스의 금형장치
JPS5242372A (en) Process for production of semiconductor device
JPS5711020A (en) Mold for resin sealing