JPS6258546B2 - - Google Patents
Info
- Publication number
- JPS6258546B2 JPS6258546B2 JP6660781A JP6660781A JPS6258546B2 JP S6258546 B2 JPS6258546 B2 JP S6258546B2 JP 6660781 A JP6660781 A JP 6660781A JP 6660781 A JP6660781 A JP 6660781A JP S6258546 B2 JPS6258546 B2 JP S6258546B2
- Authority
- JP
- Japan
- Prior art keywords
- lead frame
- shaped molded
- molded product
- resin plate
- mold parts
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the groups H01L21/18 - H01L21/326 or H10D48/04 - H10D48/07 e.g. sealing of a cap to a base of a container
- H01L21/56—Encapsulations, e.g. encapsulation layers, coatings
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Casting Or Compression Moulding Of Plastics Or The Like (AREA)
- Moulds For Moulding Plastics Or The Like (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP6660781A JPS57181129A (en) | 1981-04-30 | 1981-04-30 | Forming device molding package of semiconductors |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP6660781A JPS57181129A (en) | 1981-04-30 | 1981-04-30 | Forming device molding package of semiconductors |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS57181129A JPS57181129A (en) | 1982-11-08 |
| JPS6258546B2 true JPS6258546B2 (enrdf_load_stackoverflow) | 1987-12-07 |
Family
ID=13320751
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP6660781A Granted JPS57181129A (en) | 1981-04-30 | 1981-04-30 | Forming device molding package of semiconductors |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS57181129A (enrdf_load_stackoverflow) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS62122151A (ja) * | 1985-08-01 | 1987-06-03 | Hitachi Chem Co Ltd | 半導体類のパツケ−ジ封止方法およびその装置 |
-
1981
- 1981-04-30 JP JP6660781A patent/JPS57181129A/ja active Granted
Also Published As
| Publication number | Publication date |
|---|---|
| JPS57181129A (en) | 1982-11-08 |
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