JPS57167645A - Wire bonding method - Google Patents

Wire bonding method

Info

Publication number
JPS57167645A
JPS57167645A JP5280281A JP5280281A JPS57167645A JP S57167645 A JPS57167645 A JP S57167645A JP 5280281 A JP5280281 A JP 5280281A JP 5280281 A JP5280281 A JP 5280281A JP S57167645 A JPS57167645 A JP S57167645A
Authority
JP
Japan
Prior art keywords
die
displacement
wire
order
wire connection
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP5280281A
Other languages
English (en)
Japanese (ja)
Other versions
JPS6227737B2 (enExample
Inventor
Takashi Endo
Takeshi Hasegawa
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Shinkawa Ltd
Original Assignee
Shinkawa Ltd
Shinkawa Seisakusho Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Shinkawa Ltd, Shinkawa Seisakusho Co Ltd filed Critical Shinkawa Ltd
Priority to JP5280281A priority Critical patent/JPS57167645A/ja
Publication of JPS57167645A publication Critical patent/JPS57167645A/ja
Publication of JPS6227737B2 publication Critical patent/JPS6227737B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H10W72/0711
    • H10W72/075
    • H10W72/07521
    • H10W72/50
    • H10W72/536
    • H10W72/5363
    • H10W72/5449
    • H10W72/932
    • H10W90/756

Landscapes

  • Wire Bonding (AREA)
JP5280281A 1981-04-08 1981-04-08 Wire bonding method Granted JPS57167645A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP5280281A JPS57167645A (en) 1981-04-08 1981-04-08 Wire bonding method

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP5280281A JPS57167645A (en) 1981-04-08 1981-04-08 Wire bonding method

Publications (2)

Publication Number Publication Date
JPS57167645A true JPS57167645A (en) 1982-10-15
JPS6227737B2 JPS6227737B2 (enExample) 1987-06-16

Family

ID=12924969

Family Applications (1)

Application Number Title Priority Date Filing Date
JP5280281A Granted JPS57167645A (en) 1981-04-08 1981-04-08 Wire bonding method

Country Status (1)

Country Link
JP (1) JPS57167645A (enExample)

Also Published As

Publication number Publication date
JPS6227737B2 (enExample) 1987-06-16

Similar Documents

Publication Publication Date Title
JPS5435679A (en) Semiconductor connection method
JPS57167645A (en) Wire bonding method
JPS5326667A (en) Clamp chip of wire bonder
JPS5378768A (en) Wire bonding method of semiconductor element
JPS5449066A (en) Semiconductor device
JPS5348463A (en) Semiconductor integrated circuit support
JPS5348671A (en) Electrode structure of semiconductor element
JPS5348461A (en) Wire bonder
JPS5366172A (en) Resin mold element
JPS5223273A (en) Method of manufacturing semiconductor element
JPS5375859A (en) Glass sealing semiconductor
JPS5425489A (en) Wire connecting terminal
JPS5772337A (en) Semiconductor device
JPS52103958A (en) Automatic wire bonding device
JPS5465441A (en) Magnetic bubble memory package
JPS5385160A (en) Production of semiconductor device
JPS5396670A (en) Pellet bonding method
JPS5240974A (en) Package for semiconductor chips
JPS5360576A (en) Flip chip bonding device
JPS54152469A (en) Manufacturing device for semiconductor device
JPS5580327A (en) Wirebonding
JPS5315070A (en) Semiconductor device
JPS534468A (en) Formation of bonding pads
JPS5310271A (en) Packaging of ic units
JPS53145570A (en) Die bonding method of semiconductor device