JPS6227737B2 - - Google Patents

Info

Publication number
JPS6227737B2
JPS6227737B2 JP5280281A JP5280281A JPS6227737B2 JP S6227737 B2 JPS6227737 B2 JP S6227737B2 JP 5280281 A JP5280281 A JP 5280281A JP 5280281 A JP5280281 A JP 5280281A JP S6227737 B2 JPS6227737 B2 JP S6227737B2
Authority
JP
Japan
Prior art keywords
die
specified
wire
coordinates
angle
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
JP5280281A
Other languages
English (en)
Japanese (ja)
Other versions
JPS57167645A (en
Inventor
Takashi Endo
Takeshi Hasegawa
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Shinkawa Ltd
Original Assignee
Shinkawa Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Shinkawa Ltd filed Critical Shinkawa Ltd
Priority to JP5280281A priority Critical patent/JPS57167645A/ja
Publication of JPS57167645A publication Critical patent/JPS57167645A/ja
Publication of JPS6227737B2 publication Critical patent/JPS6227737B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H10W72/0711—
    • H10W72/075—
    • H10W72/07521—
    • H10W72/50—
    • H10W72/536—
    • H10W72/5363—
    • H10W72/5449—
    • H10W72/932—
    • H10W90/756—

Landscapes

  • Wire Bonding (AREA)
JP5280281A 1981-04-08 1981-04-08 Wire bonding method Granted JPS57167645A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP5280281A JPS57167645A (en) 1981-04-08 1981-04-08 Wire bonding method

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP5280281A JPS57167645A (en) 1981-04-08 1981-04-08 Wire bonding method

Publications (2)

Publication Number Publication Date
JPS57167645A JPS57167645A (en) 1982-10-15
JPS6227737B2 true JPS6227737B2 (enExample) 1987-06-16

Family

ID=12924969

Family Applications (1)

Application Number Title Priority Date Filing Date
JP5280281A Granted JPS57167645A (en) 1981-04-08 1981-04-08 Wire bonding method

Country Status (1)

Country Link
JP (1) JPS57167645A (enExample)

Also Published As

Publication number Publication date
JPS57167645A (en) 1982-10-15

Similar Documents

Publication Publication Date Title
US4958762A (en) Ultrasonic wire bonder
US6405357B1 (en) Method for positioning bond pads in a semiconductor die
US5292050A (en) Wire bonder
JPS6227737B2 (enExample)
JP2621420B2 (ja) 半導体装置のボンディングパッド
US5097406A (en) Lead frame lead located for wire bonder
JP2714335B2 (ja) 半導体装置
JP3258795B2 (ja) 半導体装置のボンディング点算出装置
JP2507013Y2 (ja) ワイヤ―ボンディング装置
JP3637653B2 (ja) ボンディングワイヤーの配線順序決定装置および配線順序決定方法
JPH02215139A (ja) 半導体装置の製造方法
JP2522458B2 (ja) ワイヤ―ボンディング用ランドパタ―ンデ―タの生成方法
JP2584084B2 (ja) 半導体装置用リードフレーム
JPS63232344A (ja) ワイヤボンデイング方法及び装置
JPH03169032A (ja) 半導体装置
JP2524649B2 (ja) 半導体ｉｃの自動接続方法
JPH0461249A (ja) ワイヤボンド装置
JPH0238450Y2 (enExample)
JPS6125258Y2 (enExample)
JPS59182551A (ja) 半導体装置
JPH0218956A (ja) 半導体装置用リードフレーム
JP2514007Y2 (ja) 半導体集積回路製造装置
JP2757489B2 (ja) リードフレーム用ｃａｄによる組立チェック方法
JPH01173638A (ja) Ｉ／ｏセルのパッド位置設定方法
JPS62291042A (ja) リ−ド位置認識方法