JPS57154845A - Forming method for rear face electrode - Google Patents
Forming method for rear face electrodeInfo
- Publication number
- JPS57154845A JPS57154845A JP56041435A JP4143581A JPS57154845A JP S57154845 A JPS57154845 A JP S57154845A JP 56041435 A JP56041435 A JP 56041435A JP 4143581 A JP4143581 A JP 4143581A JP S57154845 A JPS57154845 A JP S57154845A
- Authority
- JP
- Japan
- Prior art keywords
- layer
- nickel
- nickel layer
- sputtering
- rear face
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Classifications
-
- G—PHYSICS
- G11—INFORMATION STORAGE
- G11B—INFORMATION STORAGE BASED ON RELATIVE MOVEMENT BETWEEN RECORD CARRIER AND TRANSDUCER
- G11B20/00—Signal processing not specific to the method of recording or reproducing; Circuits therefor
- G11B20/10—Digital recording or reproducing
- G11B20/18—Error detection or correction; Testing, e.g. of drop-outs
- G11B20/1806—Pulse code modulation systems for audio signals
- G11B20/1809—Pulse code modulation systems for audio signals by interleaving
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
- H10P14/00—Formation of materials, e.g. in the shape of layers or pillars
- H10P14/40—Formation of materials, e.g. in the shape of layers or pillars of conductive or resistive materials
- H10P14/42—Formation of materials, e.g. in the shape of layers or pillars of conductive or resistive materials using a gas or vapour
- H10P14/44—Physical vapour deposition [PVD]
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W72/00—Interconnections or connectors in packages
- H10W72/071—Connecting or disconnecting
- H10W72/073—Connecting or disconnecting of die-attach connectors
Landscapes
- Engineering & Computer Science (AREA)
- Multimedia (AREA)
- Signal Processing (AREA)
- Electrodes Of Semiconductors (AREA)
- Die Bonding (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP56041435A JPS57154845A (en) | 1981-03-19 | 1981-03-19 | Forming method for rear face electrode |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP56041435A JPS57154845A (en) | 1981-03-19 | 1981-03-19 | Forming method for rear face electrode |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS57154845A true JPS57154845A (en) | 1982-09-24 |
| JPS6310894B2 JPS6310894B2 (enFirst) | 1988-03-10 |
Family
ID=12608286
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP56041435A Granted JPS57154845A (en) | 1981-03-19 | 1981-03-19 | Forming method for rear face electrode |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS57154845A (enFirst) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH02163971A (ja) * | 1988-12-16 | 1990-06-25 | Nippon Telegr & Teleph Corp <Ntt> | 半導体装置およびその製造方法 |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0280435U (enFirst) * | 1988-12-12 | 1990-06-21 |
-
1981
- 1981-03-19 JP JP56041435A patent/JPS57154845A/ja active Granted
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH02163971A (ja) * | 1988-12-16 | 1990-06-25 | Nippon Telegr & Teleph Corp <Ntt> | 半導体装置およびその製造方法 |
Also Published As
| Publication number | Publication date |
|---|---|
| JPS6310894B2 (enFirst) | 1988-03-10 |
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