JPS57153454A - Resin molded type semiconductor device - Google Patents

Resin molded type semiconductor device

Info

Publication number
JPS57153454A
JPS57153454A JP56037831A JP3783181A JPS57153454A JP S57153454 A JPS57153454 A JP S57153454A JP 56037831 A JP56037831 A JP 56037831A JP 3783181 A JP3783181 A JP 3783181A JP S57153454 A JPS57153454 A JP S57153454A
Authority
JP
Japan
Prior art keywords
resin
hardener
epoxy
novolac type
added
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP56037831A
Other languages
English (en)
Japanese (ja)
Other versions
JPS6137789B2 (en:Method
Inventor
Hirotoshi Iketani
Akiko Hatanaka
Shiyuichi Suzuki
Moriyasu Wada
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Toshiba Corp
Original Assignee
Toshiba Corp
Tokyo Shibaura Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Toshiba Corp, Tokyo Shibaura Electric Co Ltd filed Critical Toshiba Corp
Priority to JP56037831A priority Critical patent/JPS57153454A/ja
Priority to DE8181104126T priority patent/DE3163054D1/de
Priority to EP81104126A priority patent/EP0041662B1/en
Publication of JPS57153454A publication Critical patent/JPS57153454A/ja
Publication of JPS6137789B2 publication Critical patent/JPS6137789B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H10W74/47—
    • H10W74/473—

Landscapes

  • Compositions Of Macromolecular Compounds (AREA)
  • Epoxy Resins (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
JP56037831A 1980-06-05 1981-03-18 Resin molded type semiconductor device Granted JPS57153454A (en)

Priority Applications (3)

Application Number Priority Date Filing Date Title
JP56037831A JPS57153454A (en) 1981-03-18 1981-03-18 Resin molded type semiconductor device
DE8181104126T DE3163054D1 (en) 1980-06-05 1981-05-29 Resin encapsulation type semiconductor device
EP81104126A EP0041662B1 (en) 1980-06-05 1981-05-29 Resin encapsulation type semiconductor device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP56037831A JPS57153454A (en) 1981-03-18 1981-03-18 Resin molded type semiconductor device

Publications (2)

Publication Number Publication Date
JPS57153454A true JPS57153454A (en) 1982-09-22
JPS6137789B2 JPS6137789B2 (en:Method) 1986-08-26

Family

ID=12508467

Family Applications (1)

Application Number Title Priority Date Filing Date
JP56037831A Granted JPS57153454A (en) 1980-06-05 1981-03-18 Resin molded type semiconductor device

Country Status (1)

Country Link
JP (1) JPS57153454A (en:Method)

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5876455A (ja) * 1981-11-02 1983-05-09 Matsushita Electric Works Ltd 封止用熱硬化性樹脂成形材料及びこれを用いて成形された電子部品
JPS5967660A (ja) * 1982-10-12 1984-04-17 Toshiba Corp 封止用エポキシ樹脂組成物及びこれを用いた樹脂封止型半導体装置
JP2001288338A (ja) * 2000-04-10 2001-10-16 Sumitomo Bakelite Co Ltd エポキシ樹脂組成物及び半導体装置
JP2003003044A (ja) * 2001-06-26 2003-01-08 Matsushita Electric Works Ltd 半導体封止用樹脂組成物及び半導体装置
JP2016183309A (ja) * 2015-03-27 2016-10-20 アイカＳｄｋフェノール株式会社 エポキシ樹脂および熱硬化性樹脂組成物

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5876455A (ja) * 1981-11-02 1983-05-09 Matsushita Electric Works Ltd 封止用熱硬化性樹脂成形材料及びこれを用いて成形された電子部品
JPS5967660A (ja) * 1982-10-12 1984-04-17 Toshiba Corp 封止用エポキシ樹脂組成物及びこれを用いた樹脂封止型半導体装置
JP2001288338A (ja) * 2000-04-10 2001-10-16 Sumitomo Bakelite Co Ltd エポキシ樹脂組成物及び半導体装置
JP2003003044A (ja) * 2001-06-26 2003-01-08 Matsushita Electric Works Ltd 半導体封止用樹脂組成物及び半導体装置
JP2016183309A (ja) * 2015-03-27 2016-10-20 アイカＳｄｋフェノール株式会社 エポキシ樹脂および熱硬化性樹脂組成物

Also Published As

Publication number Publication date
JPS6137789B2 (en:Method) 1986-08-26

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