JPS57153022A - Resin-sealed semiconductor device - Google Patents

Resin-sealed semiconductor device

Info

Publication number
JPS57153022A
JPS57153022A JP3783081A JP3783081A JPS57153022A JP S57153022 A JPS57153022 A JP S57153022A JP 3783081 A JP3783081 A JP 3783081A JP 3783081 A JP3783081 A JP 3783081A JP S57153022 A JPS57153022 A JP S57153022A
Authority
JP
Japan
Prior art keywords
epoxy
phenol resin
component
epoxy resin
novolak
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP3783081A
Other languages
English (en)
Other versions
JPS6137788B2 (ja
Inventor
Hirotoshi Iketani
Akiko Hatanaka
Shiyuichi Suzuki
Moriyasu Wada
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Toshiba Corp
Original Assignee
Toshiba Corp
Tokyo Shibaura Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Toshiba Corp, Tokyo Shibaura Electric Co Ltd filed Critical Toshiba Corp
Priority to JP3783081A priority Critical patent/JPS57153022A/ja
Priority to DE8181104126T priority patent/DE3163054D1/de
Priority to EP19810104126 priority patent/EP0041662B1/en
Publication of JPS57153022A publication Critical patent/JPS57153022A/ja
Publication of JPS6137788B2 publication Critical patent/JPS6137788B2/ja
Granted legal-status Critical Current

Links

Landscapes

  • Compositions Of Macromolecular Compounds (AREA)
  • Epoxy Resins (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
JP3783081A 1980-06-05 1981-03-18 Resin-sealed semiconductor device Granted JPS57153022A (en)

Priority Applications (3)

Application Number Priority Date Filing Date Title
JP3783081A JPS57153022A (en) 1981-03-18 1981-03-18 Resin-sealed semiconductor device
DE8181104126T DE3163054D1 (en) 1980-06-05 1981-05-29 Resin encapsulation type semiconductor device
EP19810104126 EP0041662B1 (en) 1980-06-05 1981-05-29 Resin encapsulation type semiconductor device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP3783081A JPS57153022A (en) 1981-03-18 1981-03-18 Resin-sealed semiconductor device

Publications (2)

Publication Number Publication Date
JPS57153022A true JPS57153022A (en) 1982-09-21
JPS6137788B2 JPS6137788B2 (ja) 1986-08-26

Family

ID=12508439

Family Applications (1)

Application Number Title Priority Date Filing Date
JP3783081A Granted JPS57153022A (en) 1980-06-05 1981-03-18 Resin-sealed semiconductor device

Country Status (1)

Country Link
JP (1) JPS57153022A (ja)

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5967660A (ja) * 1982-10-12 1984-04-17 Toshiba Corp 封止用エポキシ樹脂組成物及びこれを用いた樹脂封止型半導体装置
JPS63130621A (ja) * 1986-11-21 1988-06-02 Toshiba Corp 半導体装置封止用エポキシ樹脂組成物
JP2001288338A (ja) * 2000-04-10 2001-10-16 Sumitomo Bakelite Co Ltd エポキシ樹脂組成物及び半導体装置
JP2003003044A (ja) * 2001-06-26 2003-01-08 Matsushita Electric Works Ltd 半導体封止用樹脂組成物及び半導体装置
JP2014129475A (ja) * 2012-12-28 2014-07-10 Kyoritsu Kagaku Sangyo Kk 熱カチオン重合性組成物

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS61203366A (ja) * 1984-08-28 1986-09-09 株式会社　セブン−イレブン・ジヤパン おにぎり包装材
JPS6150591U (ja) * 1984-09-08 1986-04-04
JPH0340155Y2 (ja) * 1985-06-25 1991-08-23
JPH0263381U (ja) * 1988-11-01 1990-05-11

Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5967660A (ja) * 1982-10-12 1984-04-17 Toshiba Corp 封止用エポキシ樹脂組成物及びこれを用いた樹脂封止型半導体装置
JPH0379370B2 (ja) * 1982-10-12 1991-12-18 Tokyo Shibaura Electric Co
JPS63130621A (ja) * 1986-11-21 1988-06-02 Toshiba Corp 半導体装置封止用エポキシ樹脂組成物
JP2001288338A (ja) * 2000-04-10 2001-10-16 Sumitomo Bakelite Co Ltd エポキシ樹脂組成物及び半導体装置
JP2003003044A (ja) * 2001-06-26 2003-01-08 Matsushita Electric Works Ltd 半導体封止用樹脂組成物及び半導体装置
JP2014129475A (ja) * 2012-12-28 2014-07-10 Kyoritsu Kagaku Sangyo Kk 熱カチオン重合性組成物

Also Published As

Publication number Publication date
JPS6137788B2 (ja) 1986-08-26

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