JPS565831A - Phenolic resin molding material - Google Patents

Phenolic resin molding material

Info

Publication number
JPS565831A
JPS565831A JP8208079A JP8208079A JPS565831A JP S565831 A JPS565831 A JP S565831A JP 8208079 A JP8208079 A JP 8208079A JP 8208079 A JP8208079 A JP 8208079A JP S565831 A JPS565831 A JP S565831A
Authority
JP
Japan
Prior art keywords
liquid
phenolic resin
molding material
phenol
free
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP8208079A
Other languages
Japanese (ja)
Inventor
Hirohiko Kagawa
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Panasonic Electric Works Co Ltd
Original Assignee
Matsushita Electric Works Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Matsushita Electric Works Ltd filed Critical Matsushita Electric Works Ltd
Priority to JP8208079A priority Critical patent/JPS565831A/en
Publication of JPS565831A publication Critical patent/JPS565831A/en
Pending legal-status Critical Current

Links

Landscapes

  • Processes Of Treating Macromolecular Substances (AREA)
  • Phenolic Resins Or Amino Resins (AREA)

Abstract

PURPOSE: To prevent mold contamination in processing and the corrosion occurrence of metallic parts in an airtightly closed device, by adding a low-boiling liquid miscible with phenol to a phenolic resin molding material, followed by evaporating free phenol content together with the liquid.
CONSTITUTION: Preferably 3W15wt.% of a liquid (e.g., water, methanol, etc.) having the boiling point not higher than 110°C, miscible with phenol is added in a blending or kneading process of a novolak type or resol type phenolic resin. The free phenol-containing liquid is evaporated by drying, etc. and the free phenol content is reduced to not more than 1wt.% to give the desired molding material.
EFFECT: When used as a microswitch, circuit-breaker, etc., the material does not evolve ammonia free from metal corrosion and stain occurrence.
COPYRIGHT: (C)1981,JPO&Japio
JP8208079A 1979-06-28 1979-06-28 Phenolic resin molding material Pending JPS565831A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP8208079A JPS565831A (en) 1979-06-28 1979-06-28 Phenolic resin molding material

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP8208079A JPS565831A (en) 1979-06-28 1979-06-28 Phenolic resin molding material

Publications (1)

Publication Number Publication Date
JPS565831A true JPS565831A (en) 1981-01-21

Family

ID=13764470

Family Applications (1)

Application Number Title Priority Date Filing Date
JP8208079A Pending JPS565831A (en) 1979-06-28 1979-06-28 Phenolic resin molding material

Country Status (1)

Country Link
JP (1) JPS565831A (en)

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