JPS57133649A - Manufacture of semiconductor device - Google Patents
Manufacture of semiconductor deviceInfo
- Publication number
- JPS57133649A JPS57133649A JP2072181A JP2072181A JPS57133649A JP S57133649 A JPS57133649 A JP S57133649A JP 2072181 A JP2072181 A JP 2072181A JP 2072181 A JP2072181 A JP 2072181A JP S57133649 A JPS57133649 A JP S57133649A
- Authority
- JP
- Japan
- Prior art keywords
- film
- crystal
- insulating film
- mustache
- wiring
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Landscapes
- Electrodes Of Semiconductors (AREA)
- Internal Circuitry In Semiconductor Integrated Circuit Devices (AREA)
Abstract
PURPOSE:To obtain a reliable connection between metals by a method wherein, in the manufacture of a semiconductor device having multilayer interconnected constitution, when the internal metals are connected with upper electrode wiring metal making use of a grown up mustache type crystal of lower electrode wiring metal, a metal accelerating the growth of said mustache type crystal is provided as a pad under the lower metal. CONSTITUTION:The first insulating film 2 is expanded on the substrate 1 whereon internal or surface processing has been performed and Ti.W film 13 is formed on the said insulating film 2 but the film 13 is entirely removed with the exception of the part for internal connection by means of photoengraving process and the like. Then, the first insulating film 2 is entirely covered with Al layer 3 to be the first layer wiring and the wiring pattern 4 is partially formed including the said film 13 by means of etching to be further entirely covered with the second insulating film 5. Later, a mustache type crystal 9 is grown up out of the Al pattern 4 on the film 13 by means of the heattreatment at 300-400 deg.C. At this time, the crystal growing speed is approximate 5 times faster than the speed in the case without the film 13 as a pad making the crystal 9 project above the surface of the said film 5. After performing said procedures, Al wiring 8 of the second layer is connected to said crystal 9.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2072181A JPS57133649A (en) | 1981-02-12 | 1981-02-12 | Manufacture of semiconductor device |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2072181A JPS57133649A (en) | 1981-02-12 | 1981-02-12 | Manufacture of semiconductor device |
Publications (2)
Publication Number | Publication Date |
---|---|
JPS57133649A true JPS57133649A (en) | 1982-08-18 |
JPS6248897B2 JPS6248897B2 (en) | 1987-10-16 |
Family
ID=12035028
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2072181A Granted JPS57133649A (en) | 1981-02-12 | 1981-02-12 | Manufacture of semiconductor device |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS57133649A (en) |
-
1981
- 1981-02-12 JP JP2072181A patent/JPS57133649A/en active Granted
Also Published As
Publication number | Publication date |
---|---|
JPS6248897B2 (en) | 1987-10-16 |
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