JPS57128943A - Insulation isolated semiconductor integrated device and manufacture thereof - Google Patents
Insulation isolated semiconductor integrated device and manufacture thereofInfo
- Publication number
- JPS57128943A JPS57128943A JP56014094A JP1409481A JPS57128943A JP S57128943 A JPS57128943 A JP S57128943A JP 56014094 A JP56014094 A JP 56014094A JP 1409481 A JP1409481 A JP 1409481A JP S57128943 A JPS57128943 A JP S57128943A
- Authority
- JP
- Japan
- Prior art keywords
- layer
- region
- pattern
- substrate
- single crystal
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/70—Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof
- H01L21/71—Manufacture of specific parts of devices defined in group H01L21/70
- H01L21/76—Making of isolation regions between components
- H01L21/762—Dielectric regions, e.g. EPIC dielectric isolation, LOCOS; Trench refilling techniques, SOI technology, use of channel stoppers
- H01L21/7624—Dielectric regions, e.g. EPIC dielectric isolation, LOCOS; Trench refilling techniques, SOI technology, use of channel stoppers using semiconductor on insulator [SOI] technology
- H01L21/76264—SOI together with lateral isolation, e.g. using local oxidation of silicon, or dielectric or polycristalline material refilled trench or air gap isolation regions, e.g. completely isolated semiconductor islands
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/70—Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof
- H01L21/71—Manufacture of specific parts of devices defined in group H01L21/70
- H01L21/76—Making of isolation regions between components
- H01L21/762—Dielectric regions, e.g. EPIC dielectric isolation, LOCOS; Trench refilling techniques, SOI technology, use of channel stoppers
- H01L21/7624—Dielectric regions, e.g. EPIC dielectric isolation, LOCOS; Trench refilling techniques, SOI technology, use of channel stoppers using semiconductor on insulator [SOI] technology
- H01L21/76264—SOI together with lateral isolation, e.g. using local oxidation of silicon, or dielectric or polycristalline material refilled trench or air gap isolation regions, e.g. completely isolated semiconductor islands
- H01L21/7627—Vertical isolation by full isolation by porous oxide silicon, i.e. FIPOS techniques
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/70—Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof
- H01L21/71—Manufacture of specific parts of devices defined in group H01L21/70
- H01L21/76—Making of isolation regions between components
- H01L21/762—Dielectric regions, e.g. EPIC dielectric isolation, LOCOS; Trench refilling techniques, SOI technology, use of channel stoppers
- H01L21/7624—Dielectric regions, e.g. EPIC dielectric isolation, LOCOS; Trench refilling techniques, SOI technology, use of channel stoppers using semiconductor on insulator [SOI] technology
- H01L21/76264—SOI together with lateral isolation, e.g. using local oxidation of silicon, or dielectric or polycristalline material refilled trench or air gap isolation regions, e.g. completely isolated semiconductor islands
- H01L21/76281—Lateral isolation by selective oxidation of silicon
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Local Oxidation Of Silicon (AREA)
- Bipolar Transistors (AREA)
- Element Separation (AREA)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP56014094A JPS57128943A (en) | 1981-02-02 | 1981-02-02 | Insulation isolated semiconductor integrated device and manufacture thereof |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP56014094A JPS57128943A (en) | 1981-02-02 | 1981-02-02 | Insulation isolated semiconductor integrated device and manufacture thereof |
Publications (2)
Publication Number | Publication Date |
---|---|
JPS57128943A true JPS57128943A (en) | 1982-08-10 |
JPS6155253B2 JPS6155253B2 (enrdf_load_stackoverflow) | 1986-11-27 |
Family
ID=11851515
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP56014094A Granted JPS57128943A (en) | 1981-02-02 | 1981-02-02 | Insulation isolated semiconductor integrated device and manufacture thereof |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS57128943A (enrdf_load_stackoverflow) |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS59175744A (ja) * | 1983-03-25 | 1984-10-04 | Fujitsu Ltd | 半導体装置及びその製造方法 |
JPH05166919A (ja) * | 1991-12-18 | 1993-07-02 | Mitsubishi Electric Corp | 半導体装置及びその製造方法 |
Families Citing this family (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
USRE40362E1 (en) | 1987-04-23 | 2008-06-10 | Polymer Group, Inc. | Apparatus and method for hydroenhancing fabric |
US12020830B2 (en) | 2018-09-28 | 2024-06-25 | Furukawa Electric Co., Ltd. | Insulation-coated compound superconducting wire and rewinding method thereof |
-
1981
- 1981-02-02 JP JP56014094A patent/JPS57128943A/ja active Granted
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS59175744A (ja) * | 1983-03-25 | 1984-10-04 | Fujitsu Ltd | 半導体装置及びその製造方法 |
JPH05166919A (ja) * | 1991-12-18 | 1993-07-02 | Mitsubishi Electric Corp | 半導体装置及びその製造方法 |
Also Published As
Publication number | Publication date |
---|---|
JPS6155253B2 (enrdf_load_stackoverflow) | 1986-11-27 |
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