JPS57126154A - Lsi package - Google Patents

Lsi package

Info

Publication number
JPS57126154A
JPS57126154A JP56011594A JP1159481A JPS57126154A JP S57126154 A JPS57126154 A JP S57126154A JP 56011594 A JP56011594 A JP 56011594A JP 1159481 A JP1159481 A JP 1159481A JP S57126154 A JPS57126154 A JP S57126154A
Authority
JP
Japan
Prior art keywords
surface parts
wiring conductors
substrate
pads
wirings
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP56011594A
Other languages
English (en)
Japanese (ja)
Other versions
JPS6250981B2 (enrdf_load_stackoverflow
Inventor
Akihiro Dotani
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
NEC Corp
Original Assignee
NEC Corp
Nippon Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by NEC Corp, Nippon Electric Co Ltd filed Critical NEC Corp
Priority to JP56011594A priority Critical patent/JPS57126154A/ja
Publication of JPS57126154A publication Critical patent/JPS57126154A/ja
Publication of JPS6250981B2 publication Critical patent/JPS6250981B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/52—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames
    • H01L23/538—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames the interconnection structure between a plurality of semiconductor chips being formed on, or in, insulating substrates
    • H01L23/5383—Multilayer substrates
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
    • H01L2224/31—Structure, shape, material or disposition of the layer connectors after the connecting process
    • H01L2224/32—Structure, shape, material or disposition of the layer connectors after the connecting process of an individual layer connector
    • H01L2224/321—Disposition
    • H01L2224/32151—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/32221—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/32225—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48225—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
    • H01L2224/48227—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation connecting the wire to a bond pad of the item
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/484—Connecting portions
    • H01L2224/4847—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a wedge bond
    • H01L2224/48472—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a wedge bond the other connecting portion not on the bonding area also being a wedge bond, i.e. wedge-to-wedge
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
    • H01L2224/732—Location after the connecting process
    • H01L2224/73251—Location after the connecting process on different surfaces
    • H01L2224/73265—Layer and wire connectors

Landscapes

  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
  • Production Of Multi-Layered Print Wiring Board (AREA)
JP56011594A 1981-01-30 1981-01-30 Lsi package Granted JPS57126154A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP56011594A JPS57126154A (en) 1981-01-30 1981-01-30 Lsi package

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP56011594A JPS57126154A (en) 1981-01-30 1981-01-30 Lsi package

Publications (2)

Publication Number Publication Date
JPS57126154A true JPS57126154A (en) 1982-08-05
JPS6250981B2 JPS6250981B2 (enrdf_load_stackoverflow) 1987-10-28

Family

ID=11782228

Family Applications (1)

Application Number Title Priority Date Filing Date
JP56011594A Granted JPS57126154A (en) 1981-01-30 1981-01-30 Lsi package

Country Status (1)

Country Link
JP (1) JPS57126154A (enrdf_load_stackoverflow)

Cited By (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5936949A (ja) * 1982-08-25 1984-02-29 Nec Corp マルチチツプパツケ−ジ
JPS6047496A (ja) * 1983-08-26 1985-03-14 日立化成工業株式会社 セラミツク基板
FR2558643A1 (fr) * 1984-01-23 1985-07-26 Nec Corp Substrat de cablage a couches multiples
JPS61172353A (ja) * 1985-01-28 1986-08-04 Nec Corp セラミツク多層基板
EP0632499A3 (en) * 1993-05-28 1995-03-29 Sumitomo Electric Industries Semiconductor device substrate.
WO1998044557A1 (de) * 1997-03-27 1998-10-08 Ppc Electronic Ag Mehrlagige leiterplatte für hohe spannungen und hohe ströme sowie verfahren zur herstellung einer solchen
JP2016530698A (ja) * 2013-08-29 2016-09-29 クアルコム，インコーポレイテッド 基板用の超微小ピッチおよび間隔相互配線

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH01125678U (enrdf_load_stackoverflow) * 1988-02-12 1989-08-28
JPH02133374U (enrdf_load_stackoverflow) * 1989-04-12 1990-11-06

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS548976A (en) * 1977-06-22 1979-01-23 Nec Corp Lsi package

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS548976A (en) * 1977-06-22 1979-01-23 Nec Corp Lsi package

Cited By (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5936949A (ja) * 1982-08-25 1984-02-29 Nec Corp マルチチツプパツケ−ジ
JPS6047496A (ja) * 1983-08-26 1985-03-14 日立化成工業株式会社 セラミツク基板
FR2558643A1 (fr) * 1984-01-23 1985-07-26 Nec Corp Substrat de cablage a couches multiples
JPS61172353A (ja) * 1985-01-28 1986-08-04 Nec Corp セラミツク多層基板
EP0632499A3 (en) * 1993-05-28 1995-03-29 Sumitomo Electric Industries Semiconductor device substrate.
US5682063A (en) * 1993-05-28 1997-10-28 Sumitomo Electric Industries, Ltd. Substrate for semiconductor device
WO1998044557A1 (de) * 1997-03-27 1998-10-08 Ppc Electronic Ag Mehrlagige leiterplatte für hohe spannungen und hohe ströme sowie verfahren zur herstellung einer solchen
CH690806A5 (de) * 1997-03-27 2001-01-15 Ppc Electronic Ag Mehrlagiger Leiterplattenkörper für hohe Spannungen und hohe Ströme sowie Verfahren zur Herstellung eines solchen Leiterplattenkörpers.
JP2016530698A (ja) * 2013-08-29 2016-09-29 クアルコム，インコーポレイテッド 基板用の超微小ピッチおよび間隔相互配線
JP2017195403A (ja) * 2013-08-29 2017-10-26 クアルコム，インコーポレイテッド 基板用の超微小ピッチおよび間隔相互配線

Also Published As

Publication number Publication date
JPS6250981B2 (enrdf_load_stackoverflow) 1987-10-28

Similar Documents

Publication Publication Date Title
CA2061949A1 (en) Electronic circuit package
GB9711555D0 (en) High density wirebond chip inter-connect for multi-chip modules
JPS57207356A (en) Semiconductor device
MY119341A (en) Chip scale ball grid array for integrated circuit package
JPS5731166A (en) Semiconductor device
TW358230B (en) Semiconductor package
JPS641269A (en) Semiconductor device
JPS5662352A (en) Semiconductor integrated circuit device for acoustic amplification circuit
JPS57126154A (en) Lsi package
FR2557755B1 (fr) Substrat de cablage multi-couche
WO1997037374A3 (en) Method of packaging multiple integrated circuit chips in a standard semiconductor device package
JPS6419737A (en) Multilayer interconnection tape carrier
JPS57166051A (en) Semiconductor device
JPS55113351A (en) Integrated circuit module
JPS5559746A (en) Semiconductor device and its mounting circuit device
JPS55165657A (en) Multi-chip package
JPS57204154A (en) Structure of chip carrier
JPS59198739A (ja) チツプキヤリア
JPS57136352A (en) Semiconductor device of resin potted type
JPS5546572A (en) Tape carrier for mounting integrated circuit chips
JPS54131871A (en) Packaging of ic case
JPS558057A (en) Semiconductor
JPS5561045A (en) Packaging device for semiconductor integrated circuit
JPS6482656A (en) Sealing structure for hybrid integrated circuit
JPS6467947A (en) Ic package substrate