JPS57121266A - Manufacture of hybrid integrated circuit - Google Patents
Manufacture of hybrid integrated circuitInfo
- Publication number
- JPS57121266A JPS57121266A JP56006673A JP667381A JPS57121266A JP S57121266 A JPS57121266 A JP S57121266A JP 56006673 A JP56006673 A JP 56006673A JP 667381 A JP667381 A JP 667381A JP S57121266 A JPS57121266 A JP S57121266A
- Authority
- JP
- Japan
- Prior art keywords
- lead
- piece
- soldered
- integrated circuit
- hybrid integrated
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Classifications
-
- H10W90/00—
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/03—Use of materials for the substrate
- H05K1/0306—Inorganic insulating substrates, e.g. ceramic, glass
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/328—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by welding
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
- H05K3/3405—Edge mounted components, e.g. terminals
Landscapes
- Electric Connection Of Electric Components To Printed Circuits (AREA)
- Lead Frames For Integrated Circuits (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP56006673A JPS57121266A (en) | 1981-01-20 | 1981-01-20 | Manufacture of hybrid integrated circuit |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP56006673A JPS57121266A (en) | 1981-01-20 | 1981-01-20 | Manufacture of hybrid integrated circuit |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS57121266A true JPS57121266A (en) | 1982-07-28 |
| JPS6259461B2 JPS6259461B2 (cg-RX-API-DMAC10.html) | 1987-12-11 |
Family
ID=11644883
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP56006673A Granted JPS57121266A (en) | 1981-01-20 | 1981-01-20 | Manufacture of hybrid integrated circuit |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS57121266A (cg-RX-API-DMAC10.html) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS59114849A (ja) * | 1982-12-22 | 1984-07-03 | Toshiba Corp | 混成集積回路の製造方法 |
| JPS63115234U (cg-RX-API-DMAC10.html) * | 1987-01-21 | 1988-07-25 |
-
1981
- 1981-01-20 JP JP56006673A patent/JPS57121266A/ja active Granted
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS59114849A (ja) * | 1982-12-22 | 1984-07-03 | Toshiba Corp | 混成集積回路の製造方法 |
| JPS63115234U (cg-RX-API-DMAC10.html) * | 1987-01-21 | 1988-07-25 |
Also Published As
| Publication number | Publication date |
|---|---|
| JPS6259461B2 (cg-RX-API-DMAC10.html) | 1987-12-11 |
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