JPS57106056A - Electrode structural body of semiconductor device - Google Patents

Electrode structural body of semiconductor device

Info

Publication number
JPS57106056A
JPS57106056A JP55183103A JP18310380A JPS57106056A JP S57106056 A JPS57106056 A JP S57106056A JP 55183103 A JP55183103 A JP 55183103A JP 18310380 A JP18310380 A JP 18310380A JP S57106056 A JPS57106056 A JP S57106056A
Authority
JP
Japan
Prior art keywords
layer
solder
ground
electrode
metal layer
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP55183103A
Other languages
English (en)
Japanese (ja)
Other versions
JPS6114666B2 (enExample
Inventor
Keiji Inoue
Yasuo Kamiya
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Mitsubishi Electric Corp
Original Assignee
Mitsubishi Electric Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Mitsubishi Electric Corp filed Critical Mitsubishi Electric Corp
Priority to JP55183103A priority Critical patent/JPS57106056A/ja
Publication of JPS57106056A publication Critical patent/JPS57106056A/ja
Publication of JPS6114666B2 publication Critical patent/JPS6114666B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/90—Bond pads, in general
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/01—Manufacture or treatment
    • H10W72/012—Manufacture or treatment of bump connectors, dummy bumps or thermal bumps
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/20—Bump connectors, e.g. solder bumps or copper pillars; Dummy bumps; Thermal bumps
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/20—Bump connectors, e.g. solder bumps or copper pillars; Dummy bumps; Thermal bumps
    • H10W72/221—Structures or relative sizes
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/20—Bump connectors, e.g. solder bumps or copper pillars; Dummy bumps; Thermal bumps
    • H10W72/221—Structures or relative sizes
    • H10W72/224—Bumps having multiple side-by-side cores
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/20—Bump connectors, e.g. solder bumps or copper pillars; Dummy bumps; Thermal bumps
    • H10W72/241—Dispositions, e.g. layouts
    • H10W72/244—Dispositions, e.g. layouts relative to underlying supporting features, e.g. bond pads, RDLs or vias
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/20—Bump connectors, e.g. solder bumps or copper pillars; Dummy bumps; Thermal bumps
    • H10W72/251—Materials
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/20—Bump connectors, e.g. solder bumps or copper pillars; Dummy bumps; Thermal bumps
    • H10W72/251—Materials
    • H10W72/252—Materials comprising solid metals or solid metalloids, e.g. PbSn, Ag or Cu
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/20—Bump connectors, e.g. solder bumps or copper pillars; Dummy bumps; Thermal bumps
    • H10W72/29—Bond pads specially adapted therefor
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/90—Bond pads, in general
    • H10W72/921—Structures or relative sizes of bond pads
    • H10W72/923—Bond pads having multiple stacked layers
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/90—Bond pads, in general
    • H10W72/931—Shapes of bond pads
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/90—Bond pads, in general
    • H10W72/931—Shapes of bond pads
    • H10W72/932—Plan-view shape, i.e. in top view
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/90—Bond pads, in general
    • H10W72/941—Dispositions of bond pads
    • H10W72/942—Dispositions of bond pads relative to underlying supporting features, e.g. bond pads, RDLs or vias

Landscapes

  • Electrodes Of Semiconductors (AREA)
  • Die Bonding (AREA)
JP55183103A 1980-12-23 1980-12-23 Electrode structural body of semiconductor device Granted JPS57106056A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP55183103A JPS57106056A (en) 1980-12-23 1980-12-23 Electrode structural body of semiconductor device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP55183103A JPS57106056A (en) 1980-12-23 1980-12-23 Electrode structural body of semiconductor device

Publications (2)

Publication Number Publication Date
JPS57106056A true JPS57106056A (en) 1982-07-01
JPS6114666B2 JPS6114666B2 (enExample) 1986-04-19

Family

ID=16129816

Family Applications (1)

Application Number Title Priority Date Filing Date
JP55183103A Granted JPS57106056A (en) 1980-12-23 1980-12-23 Electrode structural body of semiconductor device

Country Status (1)

Country Link
JP (1) JPS57106056A (enExample)

Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS607758A (ja) * 1983-06-27 1985-01-16 Nec Corp 半導体装置
US4642672A (en) * 1982-09-14 1987-02-10 Nec Corporation Semiconductor device having registration mark for electron beam exposure
US5477086A (en) * 1993-04-30 1995-12-19 Lsi Logic Corporation Shaped, self-aligning micro-bump structures
US5767580A (en) * 1993-04-30 1998-06-16 Lsi Logic Corporation Systems having shaped, self-aligning micro-bump structures
WO2002001637A3 (en) * 2000-06-28 2002-09-26 Intel Corp Layout and process for a device with segmented ball limited metallurgy for the inputs and outputs
US7180195B2 (en) 2003-12-17 2007-02-20 Intel Corporation Method and apparatus for improved power routing

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6374481U (enExample) * 1986-10-31 1988-05-18

Cited By (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4642672A (en) * 1982-09-14 1987-02-10 Nec Corporation Semiconductor device having registration mark for electron beam exposure
JPS607758A (ja) * 1983-06-27 1985-01-16 Nec Corp 半導体装置
US5477086A (en) * 1993-04-30 1995-12-19 Lsi Logic Corporation Shaped, self-aligning micro-bump structures
US5558271A (en) * 1993-04-30 1996-09-24 Lsi Logic Corporation Shaped, self-aligning micro-bump structures
US5767580A (en) * 1993-04-30 1998-06-16 Lsi Logic Corporation Systems having shaped, self-aligning micro-bump structures
WO2002001637A3 (en) * 2000-06-28 2002-09-26 Intel Corp Layout and process for a device with segmented ball limited metallurgy for the inputs and outputs
US7033923B2 (en) 2000-06-28 2006-04-25 Intel Corporation Method of forming segmented ball limiting metallurgy
US7034402B1 (en) 2000-06-28 2006-04-25 Intel Corporation Device with segmented ball limiting metallurgy
US7180195B2 (en) 2003-12-17 2007-02-20 Intel Corporation Method and apparatus for improved power routing
US7208402B2 (en) 2003-12-17 2007-04-24 Intel Corporation Method and apparatus for improved power routing

Also Published As

Publication number Publication date
JPS6114666B2 (enExample) 1986-04-19

Similar Documents

Publication Publication Date Title
JPS57106056A (en) Electrode structural body of semiconductor device
JPS54589A (en) Burying method of insulator
JPS5513904A (en) Semiconductor device and its manufacturing method
JPS5512735A (en) Semiconductor device
GB2160360A (en) Method of fabricating solar cells
JPS5768005A (en) Inductance for josephson integrated circuit
JPS5376A (en) Manufacture of semiconductor device
JPS5379382A (en) Forming method of passivation film
JPS56135970A (en) Semiconductor device
JPS5575281A (en) Manufacturing method of semiconductor device
JPS5718354A (en) Semiconductor integrated circuit
JPS5512773A (en) Manufacturing method of semiconductor device
JPS54143081A (en) Manufacture of semiconductor integrated circuit
JPS538058A (en) Production of semiconductor device
JPS54113247A (en) Semiconductor device
JPS5227362A (en) Formation method of passivation film
JPS57152146A (en) Manufacture of semiconductor device
JPS5667933A (en) Scribe method of semiconductor wafer
JPS5527644A (en) Multi-layer wiring type semiconductor device
JPS57117280A (en) Semiconductor device and manufacture thereof
JPS5496984A (en) Semiconductor laser device
JPS51122386A (en) Manufacturing method of semiconductor device
JPS5612769A (en) Semiconductor device
JPS5730390A (en) Josephson junction element
JPS53119669A (en) Production of semiconductor device