JPS5696835A - Manufacture of semiconductor device - Google Patents
Manufacture of semiconductor deviceInfo
- Publication number
- JPS5696835A JPS5696835A JP17118379A JP17118379A JPS5696835A JP S5696835 A JPS5696835 A JP S5696835A JP 17118379 A JP17118379 A JP 17118379A JP 17118379 A JP17118379 A JP 17118379A JP S5696835 A JPS5696835 A JP S5696835A
- Authority
- JP
- Japan
- Prior art keywords
- mask
- laser beam
- chips
- semiconductor device
- annealed
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/26—Bombardment with radiation
- H01L21/263—Bombardment with radiation with high-energy radiation
- H01L21/268—Bombardment with radiation with high-energy radiation using electromagnetic radiation, e.g. laser radiation
Landscapes
- Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- High Energy & Nuclear Physics (AREA)
- Optics & Photonics (AREA)
- Health & Medical Sciences (AREA)
- Toxicology (AREA)
- Electromagnetism (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Recrystallisation Techniques (AREA)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP17118379A JPS5696835A (en) | 1979-12-29 | 1979-12-29 | Manufacture of semiconductor device |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP17118379A JPS5696835A (en) | 1979-12-29 | 1979-12-29 | Manufacture of semiconductor device |
Publications (2)
Publication Number | Publication Date |
---|---|
JPS5696835A true JPS5696835A (en) | 1981-08-05 |
JPS6234131B2 JPS6234131B2 (enrdf_load_stackoverflow) | 1987-07-24 |
Family
ID=15918535
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP17118379A Granted JPS5696835A (en) | 1979-12-29 | 1979-12-29 | Manufacture of semiconductor device |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS5696835A (enrdf_load_stackoverflow) |
Cited By (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2009529245A (ja) * | 2006-03-08 | 2009-08-13 | アプライド マテリアルズ インコーポレイテッド | 基板に形成された熱処理構造用の方法および装置 |
JP2009200480A (ja) * | 2008-01-24 | 2009-09-03 | Semiconductor Energy Lab Co Ltd | 半導体基板の製造方法 |
US7772090B2 (en) * | 2003-09-30 | 2010-08-10 | Intel Corporation | Methods for laser scribing wafers |
JP2010245316A (ja) * | 2009-04-07 | 2010-10-28 | Sumco Corp | エピタキシャルウェーハの製造方法 |
JP2013232639A (ja) * | 2012-04-27 | 2013-11-14 | Ultratech Inc | アニーリングの非均一性を低減したレーザーアニーリング走査方法 |
JP2014060423A (ja) * | 2006-03-08 | 2014-04-03 | Applied Materials Inc | 基板に形成された熱処理構造用の方法および装置 |
CN106098599A (zh) * | 2016-08-17 | 2016-11-09 | 京东方科技集团股份有限公司 | 一种激光退火装置及其控制方法 |
Families Citing this family (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR101868378B1 (ko) * | 2008-09-17 | 2018-06-18 | 어플라이드 머티어리얼스, 인코포레이티드 | 기판의 어닐링시 열량 관리 |
-
1979
- 1979-12-29 JP JP17118379A patent/JPS5696835A/ja active Granted
Cited By (10)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US7772090B2 (en) * | 2003-09-30 | 2010-08-10 | Intel Corporation | Methods for laser scribing wafers |
US8364304B2 (en) | 2003-09-30 | 2013-01-29 | Intel Corporation | Methods and apparatus for laser scribing wafers |
JP2009529245A (ja) * | 2006-03-08 | 2009-08-13 | アプライド マテリアルズ インコーポレイテッド | 基板に形成された熱処理構造用の方法および装置 |
JP2014060423A (ja) * | 2006-03-08 | 2014-04-03 | Applied Materials Inc | 基板に形成された熱処理構造用の方法および装置 |
US10141191B2 (en) | 2006-03-08 | 2018-11-27 | Applied Materials, Inc. | Method of thermal processing structures formed on a substrate |
US10840100B2 (en) | 2006-03-08 | 2020-11-17 | Applied Materials, Inc. | Method of thermal processing structures formed on a substrate |
JP2009200480A (ja) * | 2008-01-24 | 2009-09-03 | Semiconductor Energy Lab Co Ltd | 半導体基板の製造方法 |
JP2010245316A (ja) * | 2009-04-07 | 2010-10-28 | Sumco Corp | エピタキシャルウェーハの製造方法 |
JP2013232639A (ja) * | 2012-04-27 | 2013-11-14 | Ultratech Inc | アニーリングの非均一性を低減したレーザーアニーリング走査方法 |
CN106098599A (zh) * | 2016-08-17 | 2016-11-09 | 京东方科技集团股份有限公司 | 一种激光退火装置及其控制方法 |
Also Published As
Publication number | Publication date |
---|---|
JPS6234131B2 (enrdf_load_stackoverflow) | 1987-07-24 |
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