JPS5687694A - Manufacture of copper foil for printed circuit - Google Patents

Manufacture of copper foil for printed circuit

Info

Publication number
JPS5687694A
JPS5687694A JP16411179A JP16411179A JPS5687694A JP S5687694 A JPS5687694 A JP S5687694A JP 16411179 A JP16411179 A JP 16411179A JP 16411179 A JP16411179 A JP 16411179A JP S5687694 A JPS5687694 A JP S5687694A
Authority
JP
Japan
Prior art keywords
copper foil
printed circuit
rust preventive
peeling strength
manufacture
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP16411179A
Other languages
English (en)
Other versions
JPS6214040B2 (ja
Inventor
Eiji Hino
Masanori Hayashi
Takashi Suzuki
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Eneos Corp
Original Assignee
Nippon Mining Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Nippon Mining Co Ltd filed Critical Nippon Mining Co Ltd
Priority to JP16411179A priority Critical patent/JPS5687694A/ja
Publication of JPS5687694A publication Critical patent/JPS5687694A/ja
Publication of JPS6214040B2 publication Critical patent/JPS6214040B2/ja
Granted legal-status Critical Current

Links

Landscapes

  • Electrochemical Coating By Surface Reaction (AREA)
  • Manufacturing Of Printed Wiring (AREA)
JP16411179A 1979-12-19 1979-12-19 Manufacture of copper foil for printed circuit Granted JPS5687694A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP16411179A JPS5687694A (en) 1979-12-19 1979-12-19 Manufacture of copper foil for printed circuit

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP16411179A JPS5687694A (en) 1979-12-19 1979-12-19 Manufacture of copper foil for printed circuit

Publications (2)

Publication Number Publication Date
JPS5687694A true JPS5687694A (en) 1981-07-16
JPS6214040B2 JPS6214040B2 (ja) 1987-03-31

Family

ID=15786955

Family Applications (1)

Application Number Title Priority Date Filing Date
JP16411179A Granted JPS5687694A (en) 1979-12-19 1979-12-19 Manufacture of copper foil for printed circuit

Country Status (1)

Country Link
JP (1) JPS5687694A (ja)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH05500136A (ja) * 1989-08-23 1993-01-14 ザイコン　コーポレーション 印刷配線基板のためのコンデンサ積層体
JP2009068042A (ja) * 2007-09-11 2009-04-02 Furukawa Circuit Foil Kk 超音波溶接性に優れた銅箔、およびその表面処理方法
JPWO2014024878A1 (ja) * 2012-08-06 2016-07-25 Ｊｘ金属株式会社 キャリア付金属箔

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6441538U (ja) * 1987-09-02 1989-03-13
JPH0386728U (ja) * 1989-12-20 1991-09-03
MY162509A (en) * 2009-06-05 2017-06-15 Jx Nippon Mining & Metals Corp Copper foil for semiconductor package substrate and substrate for semiconductor package

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5142575A (ja) * 1974-10-08 1976-04-10 Matsushita Electric Ind Co Ltd Koondosensaa
JPS5440058A (en) * 1977-09-06 1979-03-28 Toshiba Corp Maintenance monitor system

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5142575A (ja) * 1974-10-08 1976-04-10 Matsushita Electric Ind Co Ltd Koondosensaa
JPS5440058A (en) * 1977-09-06 1979-03-28 Toshiba Corp Maintenance monitor system

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH05500136A (ja) * 1989-08-23 1993-01-14 ザイコン　コーポレーション 印刷配線基板のためのコンデンサ積層体
JP2009068042A (ja) * 2007-09-11 2009-04-02 Furukawa Circuit Foil Kk 超音波溶接性に優れた銅箔、およびその表面処理方法
JPWO2014024878A1 (ja) * 2012-08-06 2016-07-25 Ｊｘ金属株式会社 キャリア付金属箔

Also Published As

Publication number Publication date
JPS6214040B2 (ja) 1987-03-31

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