JPS54138083A - Metal clad laminate for printed circuit board, and its manufacturing - Google Patents
Metal clad laminate for printed circuit board, and its manufacturingInfo
- Publication number
- JPS54138083A JPS54138083A JP4701678A JP4701678A JPS54138083A JP S54138083 A JPS54138083 A JP S54138083A JP 4701678 A JP4701678 A JP 4701678A JP 4701678 A JP4701678 A JP 4701678A JP S54138083 A JPS54138083 A JP S54138083A
- Authority
- JP
- Japan
- Prior art keywords
- resin composition
- resin
- circuit board
- printed circuit
- foil
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/03—Use of materials for the substrate
- H05K1/0313—Organic insulating material
- H05K1/0353—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement
- H05K1/036—Multilayers with layers of different types
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/38—Improvement of the adhesion between the insulating substrate and the metal
- H05K3/386—Improvement of the adhesion between the insulating substrate and the metal by the use of an organic polymeric bonding layer, e.g. adhesive
Landscapes
- Laminated Bodies (AREA)
Abstract
PURPOSE: To manufacture a metal clad laminate having excellent electrcal property, peeling strength of the metal foil, and heat resistance, and useful as a flexible printed circuit board, by coating a metal foil with a resin composition containing an unsaturated polyester resin and an isocyanate compound, laminating the foil to a substrate, and curing the resin composition.
CONSTITUTION: A metal foil is coated with a resin composition comprising (A) a resin mixture composed of 100 parts by weight of an unsaturated polyester resin and ≥ 3 parts of a vinylphenol resin, an OH-terminated diene polymer, or an OH- terminated polyolefin, and (B) an isocyanae compound such as toluene diisocyanate, polymethylene polyphenyl isocyanate, etc. The coated foil is laminated to a substrate, and the resin composition is cured to obtain the objective laminate.
COPYRIGHT: (C)1979,JPO&Japio
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP53047016A JPS5824268B2 (en) | 1978-04-19 | 1978-04-19 | Metal foil cladding for printed wiring and its manufacturing method |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP53047016A JPS5824268B2 (en) | 1978-04-19 | 1978-04-19 | Metal foil cladding for printed wiring and its manufacturing method |
Publications (2)
Publication Number | Publication Date |
---|---|
JPS54138083A true JPS54138083A (en) | 1979-10-26 |
JPS5824268B2 JPS5824268B2 (en) | 1983-05-20 |
Family
ID=12763368
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP53047016A Expired JPS5824268B2 (en) | 1978-04-19 | 1978-04-19 | Metal foil cladding for printed wiring and its manufacturing method |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS5824268B2 (en) |
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS56144151A (en) * | 1980-04-11 | 1981-11-10 | Kanegafuchi Chemical Ind | Continuous manufacture of laminated board |
EP0202488A2 (en) * | 1985-04-23 | 1986-11-26 | Hitachi, Ltd. | Thermosetting resin composition and laminate and process for the production thereof |
JPH03158231A (en) * | 1989-11-15 | 1991-07-08 | Matsushita Electric Works Ltd | Manufacture of laminate |
Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US3393117A (en) * | 1964-02-13 | 1968-07-16 | Cincinnati Milling Machine Co | Copper-clad glass reinforced thermoset resin panel |
JPS4922439A (en) * | 1972-06-23 | 1974-02-27 | ||
JPS4966792A (en) * | 1972-10-30 | 1974-06-28 |
-
1978
- 1978-04-19 JP JP53047016A patent/JPS5824268B2/en not_active Expired
Patent Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US3393117A (en) * | 1964-02-13 | 1968-07-16 | Cincinnati Milling Machine Co | Copper-clad glass reinforced thermoset resin panel |
JPS4922439A (en) * | 1972-06-23 | 1974-02-27 | ||
JPS4966792A (en) * | 1972-10-30 | 1974-06-28 |
Cited By (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS56144151A (en) * | 1980-04-11 | 1981-11-10 | Kanegafuchi Chemical Ind | Continuous manufacture of laminated board |
JPS6058031B2 (en) * | 1980-04-11 | 1985-12-18 | 鐘淵化学工業株式会社 | Continuous manufacturing method for laminates |
EP0202488A2 (en) * | 1985-04-23 | 1986-11-26 | Hitachi, Ltd. | Thermosetting resin composition and laminate and process for the production thereof |
JPH03158231A (en) * | 1989-11-15 | 1991-07-08 | Matsushita Electric Works Ltd | Manufacture of laminate |
Also Published As
Publication number | Publication date |
---|---|
JPS5824268B2 (en) | 1983-05-20 |
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