JPS5683033A - Manufacture of semiconductor device - Google Patents
Manufacture of semiconductor deviceInfo
- Publication number
- JPS5683033A JPS5683033A JP5206880A JP5206880A JPS5683033A JP S5683033 A JPS5683033 A JP S5683033A JP 5206880 A JP5206880 A JP 5206880A JP 5206880 A JP5206880 A JP 5206880A JP S5683033 A JPS5683033 A JP S5683033A
- Authority
- JP
- Japan
- Prior art keywords
- plasma processing
- gas
- semiconductor
- uniformalized
- volume
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000004065 semiconductor Substances 0.000 title abstract 6
- 238000004519 manufacturing process Methods 0.000 title 1
- 239000007789 gas Substances 0.000 abstract 4
- 238000005530 etching Methods 0.000 abstract 1
- 238000010438 heat treatment Methods 0.000 abstract 1
- 238000000034 method Methods 0.000 abstract 1
- 239000012495 reaction gas Substances 0.000 abstract 1
- 239000000758 substrate Substances 0.000 abstract 1
- 239000010409 thin film Substances 0.000 abstract 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Drying Of Semiconductors (AREA)
Abstract
PURPOSE:To uniformalize both the volume of the plasma processing and the characteristics of the semiconductor device by a method wherein the feeding quantity of reaction gas from a gas feeder arranged facing to a semiconductor wafer is changed according to the position of a semiconductor thin plate. CONSTITUTION:Using the plasma processing device of paralleled-flat-plate type structure wherein the substrate supporting member 2 containing a heating apparatus and the gas feeder 3 are arranged facing each other in a vacuum deaeratable container 1, the feeding quantity of gas is changed by varying the interval between the gas feeding small holes 5', provided facing to the semiconductor wafer 4 and the plasma processing is performed. Hence, the volume of the plasma processing is uniformalized, the variation of the thickness of the deposited thin film and the quantity of etching are eliminated, the characteristics of the semiconductor are uniformalized and the yield rate can be improved as well.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP5206880A JPS5683033A (en) | 1980-04-18 | 1980-04-18 | Manufacture of semiconductor device |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP5206880A JPS5683033A (en) | 1980-04-18 | 1980-04-18 | Manufacture of semiconductor device |
Related Parent Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP16064979A Division JPS6053751B2 (en) | 1979-12-10 | 1979-12-10 | plasma processing equipment |
Publications (1)
Publication Number | Publication Date |
---|---|
JPS5683033A true JPS5683033A (en) | 1981-07-07 |
Family
ID=12904490
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP5206880A Pending JPS5683033A (en) | 1980-04-18 | 1980-04-18 | Manufacture of semiconductor device |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS5683033A (en) |
Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5046074A (en) * | 1973-08-28 | 1975-04-24 | ||
JPS5458361A (en) * | 1977-10-19 | 1979-05-11 | Hitachi Ltd | Plasma gas phase processor |
JPS5530827A (en) * | 1978-08-24 | 1980-03-04 | Nec Kyushu Ltd | Plasmaetching device |
JPS55166926A (en) * | 1979-06-15 | 1980-12-26 | Pioneer Electronic Corp | Dry etching apparatus |
-
1980
- 1980-04-18 JP JP5206880A patent/JPS5683033A/en active Pending
Patent Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5046074A (en) * | 1973-08-28 | 1975-04-24 | ||
JPS5458361A (en) * | 1977-10-19 | 1979-05-11 | Hitachi Ltd | Plasma gas phase processor |
JPS5530827A (en) * | 1978-08-24 | 1980-03-04 | Nec Kyushu Ltd | Plasmaetching device |
JPS55166926A (en) * | 1979-06-15 | 1980-12-26 | Pioneer Electronic Corp | Dry etching apparatus |
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