JPS5678154A - Manufacture of semiconductor device - Google Patents
Manufacture of semiconductor deviceInfo
- Publication number
- JPS5678154A JPS5678154A JP15460179A JP15460179A JPS5678154A JP S5678154 A JPS5678154 A JP S5678154A JP 15460179 A JP15460179 A JP 15460179A JP 15460179 A JP15460179 A JP 15460179A JP S5678154 A JPS5678154 A JP S5678154A
- Authority
- JP
- Japan
- Prior art keywords
- layer
- film
- type
- regions
- region
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 238000004519 manufacturing process Methods 0.000 title 1
- 239000004065 semiconductor Substances 0.000 title 1
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 abstract 4
- 230000004913 activation Effects 0.000 abstract 3
- 230000015572 biosynthetic process Effects 0.000 abstract 2
- 229910052681 coesite Inorganic materials 0.000 abstract 2
- 229910052906 cristobalite Inorganic materials 0.000 abstract 2
- 239000000377 silicon dioxide Substances 0.000 abstract 2
- 235000012239 silicon dioxide Nutrition 0.000 abstract 2
- 229910052682 stishovite Inorganic materials 0.000 abstract 2
- 229910052905 tridymite Inorganic materials 0.000 abstract 2
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 abstract 1
- 230000004888 barrier function Effects 0.000 abstract 1
- 229910052593 corundum Inorganic materials 0.000 abstract 1
- 238000009413 insulation Methods 0.000 abstract 1
- 239000000463 material Substances 0.000 abstract 1
- 238000000034 method Methods 0.000 abstract 1
- 239000000758 substrate Substances 0.000 abstract 1
- 229910001845 yogo sapphire Inorganic materials 0.000 abstract 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
- H01L27/02—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers
- H01L27/0203—Particular design considerations for integrated circuits
- H01L27/0214—Particular design considerations for integrated circuits for internal polarisation, e.g. I2L
Landscapes
- Engineering & Computer Science (AREA)
- Power Engineering (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Electrodes Of Semiconductors (AREA)
- Bipolar Transistors (AREA)
- Bipolar Integrated Circuits (AREA)
- Logic Circuits (AREA)
Abstract
PURPOSE:To enable to increase an action speed of a I<2>L having Schottky barrier diode, by a method wherein the insulation of a wiring material by anode formation and the electric activation of an ion pouring layer by laser irradiation are utilized. CONSTITUTION:A type N<+> submerged layer 12 is formed in a type P<-> Si substrate, and a type N layer 13 is epitaxially grown on the whole surface including the layer 12. The periphery side of the layer 13 is sorrounded with a SiO2 film 15, a SiO2 film 14 is adhered to the surface of the layer 13. The film 14 is then patterned and the remaining film 14 is masked. An ion B is pured thereinto, and type P regions 16a and 16b are formed at the bottom of the layer 13 at both sides of the film 14. Afterwards, a thermal pocess is performed in a nitogen atmosphere for activation of the regions 16a and 16b, and a Al wiring 18 is formed on the layer 13 corresponding to the region 16a. Anode formation takes place to change only the outer layer of the wiring 18 into a Al2O3 film 18a. The remaining film 14 and film 18a are then masked, and an ion is poured thereinto for forming type P<+> regions 17a and 17b at the periphery of the region 16a and on the region 16b, respectively. Said regions are irradiated with laser light for activation.
Priority Applications (4)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP15460179A JPS5678154A (en) | 1979-11-29 | 1979-11-29 | Manufacture of semiconductor device |
DE8080107315T DE3071489D1 (en) | 1979-11-29 | 1980-11-24 | Method of manufacturing a semiconductor device with a schottky junction |
EP80107315A EP0029986B1 (en) | 1979-11-29 | 1980-11-24 | Method of manufacturing a semiconductor device with a schottky junction |
US06/210,749 US4338139A (en) | 1979-11-29 | 1980-11-26 | Method of forming Schottky-I2 L devices by implantation and laser bombardment |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP15460179A JPS5678154A (en) | 1979-11-29 | 1979-11-29 | Manufacture of semiconductor device |
Publications (2)
Publication Number | Publication Date |
---|---|
JPS5678154A true JPS5678154A (en) | 1981-06-26 |
JPS639668B2 JPS639668B2 (en) | 1988-03-01 |
Family
ID=15587741
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP15460179A Granted JPS5678154A (en) | 1979-11-29 | 1979-11-29 | Manufacture of semiconductor device |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS5678154A (en) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS60240156A (en) * | 1984-05-14 | 1985-11-29 | Agency Of Ind Science & Technol | Radiation resisting semiconductor integrated circuit device |
-
1979
- 1979-11-29 JP JP15460179A patent/JPS5678154A/en active Granted
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS60240156A (en) * | 1984-05-14 | 1985-11-29 | Agency Of Ind Science & Technol | Radiation resisting semiconductor integrated circuit device |
JPH0467341B2 (en) * | 1984-05-14 | 1992-10-28 | Kogyo Gijutsuin |
Also Published As
Publication number | Publication date |
---|---|
JPS639668B2 (en) | 1988-03-01 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
JPS5636143A (en) | Manufacture of semiconductor device | |
JPS57155726A (en) | Manufacture of semiconductor device | |
JPS5555559A (en) | Method of fabricating semiconductor device | |
JPS5678154A (en) | Manufacture of semiconductor device | |
JPS5333050A (en) | Production of semiconductor element | |
JPS5745920A (en) | Forming method for semiconductor single crystal by energy beam emission | |
JPS5635434A (en) | Manufacturing of semiconductor device | |
JPS5678153A (en) | Manufacture of semiconductor device | |
JPS56126914A (en) | Manufacture of semiconductor device | |
JPS5766627A (en) | Manufacture of semiconductor device | |
JPS5723218A (en) | Manufacture of semiconductor device | |
JPS5656648A (en) | Manufacture of semiconductor device | |
JPS575327A (en) | Manufacture of semiconductor device | |
JPS54162982A (en) | Manufacture of semiconductor device | |
JPS56105663A (en) | Manufacture of ic device by complementary type field effect transistor | |
JPS5513953A (en) | Complementary integrated circuit | |
JPS56126915A (en) | Manufacture of semiconductor device | |
JPS5694671A (en) | Manufacture of mis field-effect semiconductor device | |
JPS56146231A (en) | Manufacture of semiconductor device | |
JPS55105332A (en) | Manufacture of semiconductor device | |
JPS54139486A (en) | Manufacture of semiconductor device | |
JPS56144533A (en) | Manufacture of semiconductor device | |
JPS55115364A (en) | Manufacturing method of semiconductor device | |
JPS5646522A (en) | Semiconductor device and manufacture thereof | |
JPS57113247A (en) | Manufacture of semiconductor device |