JPS5660038A - Semiconductor device - Google Patents
Semiconductor deviceInfo
- Publication number
- JPS5660038A JPS5660038A JP14665680A JP14665680A JPS5660038A JP S5660038 A JPS5660038 A JP S5660038A JP 14665680 A JP14665680 A JP 14665680A JP 14665680 A JP14665680 A JP 14665680A JP S5660038 A JPS5660038 A JP S5660038A
- Authority
- JP
- Japan
- Prior art keywords
- solder
- layer
- semiconductor device
- integration
- covering
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/02—Containers; Seals
- H01L23/04—Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls
- H01L23/053—Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls the container being a hollow construction and having an insulating or insulated base as a mounting for the semiconductor body
- H01L23/057—Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls the container being a hollow construction and having an insulating or insulated base as a mounting for the semiconductor body the leads being parallel to the base
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
Landscapes
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Lead Frames For Integrated Circuits (AREA)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP14665680A JPS5660038A (en) | 1980-10-20 | 1980-10-20 | Semiconductor device |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP14665680A JPS5660038A (en) | 1980-10-20 | 1980-10-20 | Semiconductor device |
Related Parent Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP6296972A Division JPS553821B2 (ja) | 1972-06-22 | 1972-06-22 |
Publications (2)
Publication Number | Publication Date |
---|---|
JPS5660038A true JPS5660038A (en) | 1981-05-23 |
JPS6236393B2 JPS6236393B2 (ja) | 1987-08-06 |
Family
ID=15412649
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP14665680A Granted JPS5660038A (en) | 1980-10-20 | 1980-10-20 | Semiconductor device |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS5660038A (ja) |
Cited By (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5822741U (ja) * | 1981-08-07 | 1983-02-12 | 京セラ株式会社 | 半導体パツケ−ジ |
JPS5961155A (ja) * | 1982-09-30 | 1984-04-07 | Fujitsu Ltd | 半導体装置 |
JPS62128552A (ja) * | 1985-11-29 | 1987-06-10 | Kyocera Corp | 電子部品における外部リ−ド端子の表面加工法 |
JPH0246753A (ja) * | 1988-08-09 | 1990-02-16 | Ibiden Co Ltd | リードフレームを有する電子部品搭載用基板 |
Families Citing this family (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
EP2776071B1 (en) | 2011-11-09 | 2018-08-08 | Cedars-Sinai Medical Center | Transcription factor-based generation of pacemaker cells and methods of using same |
Citations (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS4827683A (ja) * | 1971-08-13 | 1973-04-12 |
-
1980
- 1980-10-20 JP JP14665680A patent/JPS5660038A/ja active Granted
Patent Citations (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS4827683A (ja) * | 1971-08-13 | 1973-04-12 |
Cited By (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5822741U (ja) * | 1981-08-07 | 1983-02-12 | 京セラ株式会社 | 半導体パツケ−ジ |
JPS635238Y2 (ja) * | 1981-08-07 | 1988-02-12 | ||
JPS5961155A (ja) * | 1982-09-30 | 1984-04-07 | Fujitsu Ltd | 半導体装置 |
JPS62128552A (ja) * | 1985-11-29 | 1987-06-10 | Kyocera Corp | 電子部品における外部リ−ド端子の表面加工法 |
JPH0246753A (ja) * | 1988-08-09 | 1990-02-16 | Ibiden Co Ltd | リードフレームを有する電子部品搭載用基板 |
Also Published As
Publication number | Publication date |
---|---|
JPS6236393B2 (ja) | 1987-08-06 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
US5377079A (en) | Electronic device and its production method | |
US6204555B1 (en) | Microwave-frequency hybrid integrated circuit | |
JPS55111151A (en) | Integrated circuit device | |
JPS5660038A (en) | Semiconductor device | |
US5482735A (en) | Method for making multi-layer ceramic packages | |
US5935719A (en) | Lead-free, nickel-free and cyanide-free plating finish for semiconductor leadframes | |
JPS57130443A (en) | Substrate for hybrid integrated circuit | |
US8159826B2 (en) | Surface treatments for contact pads used in semiconductor chip packagages and methods of providing such surface treatments | |
JPS56137659A (en) | Semiconductor device and its manufacture | |
JPS647542A (en) | Formation of bump | |
JPS57192039A (en) | Hybrid integrated circuit | |
JPS6464298A (en) | Hybrid integrated circuit | |
JPS56142659A (en) | Semiconductor device | |
JPS6417491A (en) | Formation of conductor of ceramic wiring board | |
JPS575341A (en) | Semiconductor device | |
SU1083858A1 (ru) | Интегральна схема | |
JPS57132332A (en) | Semiconductor device | |
JPH03206691A (ja) | 混成集積回路 | |
JPS58107656A (ja) | 金の層を有する電子部品 | |
JPS54113255A (en) | Partial plating method of lead frame for semiconductor device | |
JPS5632748A (en) | Ic with bump and manufacture thereof | |
JPS6158259A (ja) | チツプキヤリア | |
JPS6417450A (en) | Formation of bump | |
JPS57169253A (en) | Circuit substrate | |
JPS57121239A (en) | Semiconductor device |