JPS57192039A - Hybrid integrated circuit - Google Patents

Hybrid integrated circuit

Info

Publication number
JPS57192039A
JPS57192039A JP56076438A JP7643881A JPS57192039A JP S57192039 A JPS57192039 A JP S57192039A JP 56076438 A JP56076438 A JP 56076438A JP 7643881 A JP7643881 A JP 7643881A JP S57192039 A JPS57192039 A JP S57192039A
Authority
JP
Japan
Prior art keywords
conductor
flame spraying
surface layer
integrated circuit
ultrasonic
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP56076438A
Other languages
Japanese (ja)
Inventor
Kenji Nagashima
Hiroshi Ohira
Masataka Tanaka
Hiroshi Matsumoto
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Toshiba Corp
Original Assignee
Toshiba Corp
Tokyo Shibaura Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Toshiba Corp, Tokyo Shibaura Electric Co Ltd filed Critical Toshiba Corp
Priority to JP56076438A priority Critical patent/JPS57192039A/en
Publication of JPS57192039A publication Critical patent/JPS57192039A/en
Pending legal-status Critical Current

Links

Classifications

    • HELECTRICITY
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    • H01L24/00Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/01Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L24/42Wire connectors; Manufacturing methods related thereto
    • H01L24/47Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L24/49Structure, shape, material or disposition of the wire connectors after the connecting process of a plurality of wire connectors
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    • H01L2224/44Structure, shape, material or disposition of the wire connectors prior to the connecting process
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    • H01L2224/45124Aluminium (Al) as principal constituent
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    • H01L2224/48491Connecting portions connected to auxiliary connecting means on the bonding areas, e.g. pre-ball, wedge-on-ball, ball-on-ball between the wire connector and the bonding area being an additional member attached to the bonding area through an adhesive or solder, e.g. buffer pad
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    • H01L2924/19107Disposition of discrete passive components off-chip wires

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  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Wire Bonding (AREA)

Abstract

PURPOSE:To eliminate the need for the precious metals such as Au paste, and to reduce cost by forming a conductor, which consists of Al and a metal, which can be soldered, and is shaped selectively through flame spraying technique, to a substrate with an insulating surface layer. CONSTITUTION:Al2O3 powder is sprayed against the surface of an Al plate 31 and the surface is changed into a coarse surface, and the alumina insulating surface layer 32 is deposited through plasma flame spraying. The copper conductors 34 are formed to the soldering section 7 of a copper block 6 for radiation of a power transistor Tr 5, the conductive epoxy resin bonding section 10 of a small Tr 9, etc. through flame spraying. An Al thick wire 11 is connected to the Al conductor 36 from the Tr 5 through ultrasonic bonding, and an Au thin wire 13 is connected to the Al conductor 36 from the Tr 9 through an ultrasonic thermocompression bonding method.
JP56076438A 1981-05-22 1981-05-22 Hybrid integrated circuit Pending JPS57192039A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP56076438A JPS57192039A (en) 1981-05-22 1981-05-22 Hybrid integrated circuit

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP56076438A JPS57192039A (en) 1981-05-22 1981-05-22 Hybrid integrated circuit

Publications (1)

Publication Number Publication Date
JPS57192039A true JPS57192039A (en) 1982-11-26

Family

ID=13605147

Family Applications (1)

Application Number Title Priority Date Filing Date
JP56076438A Pending JPS57192039A (en) 1981-05-22 1981-05-22 Hybrid integrated circuit

Country Status (1)

Country Link
JP (1) JPS57192039A (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH01501667A (en) * 1986-12-17 1989-06-08 フラベーク ゲゼルシヤフト ミツト ベシユレンクテル ハフツング TV cathode ray tube with composite front panel

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH01501667A (en) * 1986-12-17 1989-06-08 フラベーク ゲゼルシヤフト ミツト ベシユレンクテル ハフツング TV cathode ray tube with composite front panel

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