JPS5650508A - Manufacture monocrystalling semiconductor substrate and its - Google Patents
Manufacture monocrystalling semiconductor substrate and itsInfo
- Publication number
- JPS5650508A JPS5650508A JP12539579A JP12539579A JPS5650508A JP S5650508 A JPS5650508 A JP S5650508A JP 12539579 A JP12539579 A JP 12539579A JP 12539579 A JP12539579 A JP 12539579A JP S5650508 A JPS5650508 A JP S5650508A
- Authority
- JP
- Japan
- Prior art keywords
- semiconductor substrate
- manufacture
- monocrystalling
- monocrystalline semiconductor
- epitaxial growth
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/02104—Forming layers
- H01L21/02365—Forming inorganic semiconducting materials on a substrate
- H01L21/02612—Formation types
- H01L21/02617—Deposition types
- H01L21/0262—Reduction or decomposition of gaseous compounds, e.g. CVD
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/02104—Forming layers
- H01L21/02365—Forming inorganic semiconducting materials on a substrate
- H01L21/02518—Deposited layers
- H01L21/02521—Materials
- H01L21/02524—Group 14 semiconducting materials
- H01L21/02532—Silicon, silicon germanium, germanium
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
Abstract
PURPOSE:To obtain a semiconductor substrate having extremely scanty density of carbon, oxygen and having no generation of swirl defect by a method wherein a monocrystalline semiconductor substrate is formed only with an epitaxial growth layer. CONSTITUTION:An epitaxial growth layer 3 is formed on the main face of a monocrystalline semiconductor plane material 1, and the material 1 is removed to manufacture a monocrystalline semiconductor substrate 4 consisting of only the epitaxial growth layer 3. Accordingly, a monocrystalline semiconductor substrate having extremely scanty density of carbon, oxygen and having no generation of swirl defect can be obtained.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP12539579A JPS5650508A (en) | 1979-10-01 | 1979-10-01 | Manufacture monocrystalling semiconductor substrate and its |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP12539579A JPS5650508A (en) | 1979-10-01 | 1979-10-01 | Manufacture monocrystalling semiconductor substrate and its |
Publications (1)
Publication Number | Publication Date |
---|---|
JPS5650508A true JPS5650508A (en) | 1981-05-07 |
Family
ID=14909071
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP12539579A Pending JPS5650508A (en) | 1979-10-01 | 1979-10-01 | Manufacture monocrystalling semiconductor substrate and its |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS5650508A (en) |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US7732289B2 (en) * | 2005-07-05 | 2010-06-08 | Taiwan Semiconductor Manufacturing Company, Ltd. | Method of forming a MOS device with an additional layer |
JP2021019164A (en) * | 2019-07-23 | 2021-02-15 | 株式会社Sumco | Method for manufacturing epitaxial silicon wafer, epitaxial silicon wafer, method for manufacturing silicon wafer, silicon wafer, and method for manufacturing semiconductor device |
-
1979
- 1979-10-01 JP JP12539579A patent/JPS5650508A/en active Pending
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US7732289B2 (en) * | 2005-07-05 | 2010-06-08 | Taiwan Semiconductor Manufacturing Company, Ltd. | Method of forming a MOS device with an additional layer |
JP2021019164A (en) * | 2019-07-23 | 2021-02-15 | 株式会社Sumco | Method for manufacturing epitaxial silicon wafer, epitaxial silicon wafer, method for manufacturing silicon wafer, silicon wafer, and method for manufacturing semiconductor device |
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