JPS5642346A - Manufacture of semiconductor device - Google Patents
Manufacture of semiconductor deviceInfo
- Publication number
- JPS5642346A JPS5642346A JP11845679A JP11845679A JPS5642346A JP S5642346 A JPS5642346 A JP S5642346A JP 11845679 A JP11845679 A JP 11845679A JP 11845679 A JP11845679 A JP 11845679A JP S5642346 A JPS5642346 A JP S5642346A
- Authority
- JP
- Japan
- Prior art keywords
- film
- etched
- semiconductor device
- sio2
- manufacture
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic System or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
- H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
- H01L21/306—Chemical or electrical treatment, e.g. electrolytic etching
Abstract
PURPOSE:To obtain a microminiature pattern in the semiconductor device by introducing large quantity of B atoms into an SiO2 and then etching it. CONSTITUTION:A resist mask 4 is covered on the SiO2 film 2 on an Si substrate 1, and B, BF2, BCl2 or the like 5 are injected therto in a high density. When the mask 4 is removed and the film is plasma etched or etched with a solution containing an HF, the film 2 containing no B is selectively removed, but the layer 6 containing large amount of B is not etched at all. Accordingly, no side etching occurs, and the microminiature pattern can consequently be obtained.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP11845679A JPS5642346A (en) | 1979-09-14 | 1979-09-14 | Manufacture of semiconductor device |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP11845679A JPS5642346A (en) | 1979-09-14 | 1979-09-14 | Manufacture of semiconductor device |
Publications (1)
Publication Number | Publication Date |
---|---|
JPS5642346A true JPS5642346A (en) | 1981-04-20 |
Family
ID=14737086
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP11845679A Pending JPS5642346A (en) | 1979-09-14 | 1979-09-14 | Manufacture of semiconductor device |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS5642346A (en) |
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS59119872A (en) * | 1982-12-27 | 1984-07-11 | Fujikura Ltd | Forming method of diaphragm of semiconductor pressure sensor |
US5286340A (en) * | 1991-09-13 | 1994-02-15 | University Of Pittsburgh Of The Commonwealth System Of Higher Education | Process for controlling silicon etching by atomic hydrogen |
JP2007111831A (en) * | 2005-10-21 | 2007-05-10 | Seiko Epson Corp | Method for manufacturing mems element, and mems element |
-
1979
- 1979-09-14 JP JP11845679A patent/JPS5642346A/en active Pending
Cited By (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS59119872A (en) * | 1982-12-27 | 1984-07-11 | Fujikura Ltd | Forming method of diaphragm of semiconductor pressure sensor |
JPH0368544B2 (en) * | 1982-12-27 | 1991-10-28 | Fujikura Ltd | |
US5286340A (en) * | 1991-09-13 | 1994-02-15 | University Of Pittsburgh Of The Commonwealth System Of Higher Education | Process for controlling silicon etching by atomic hydrogen |
JP2007111831A (en) * | 2005-10-21 | 2007-05-10 | Seiko Epson Corp | Method for manufacturing mems element, and mems element |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
JPS5642346A (en) | Manufacture of semiconductor device | |
JPS52136590A (en) | Production of semiconductor device | |
JPS57130431A (en) | Manufacture of semiconductor device | |
JPS6468932A (en) | Dry etching | |
JPS55113343A (en) | Manufacture of semiconductor device | |
JPS57154855A (en) | Manufacture of semiconductor device | |
JPS57174466A (en) | Dry etching method | |
JPS51136289A (en) | Semi-conductor producing | |
JPS57141642A (en) | Formation of pattern | |
JPS5723239A (en) | Manufacture of semiconductor device | |
JPS57202535A (en) | Formation of negative resist pattern | |
JPS5772346A (en) | Manufacture of semiconductor device | |
JPS5496363A (en) | Electrode forming method for semiconductor device | |
JPS6420624A (en) | Manufacture of semiconductor device | |
JPS5548933A (en) | Forming of mesa groove | |
JPS5513964A (en) | Method of manufacturing semiconductor device | |
JPS6455826A (en) | Manufacture of semiconductor device | |
JPS5455378A (en) | Production of semiconductor device | |
JPS54150936A (en) | Manufacture of magnetic bubble element | |
JPS5548950A (en) | Manufacturing of semiconductor device | |
JPS5496370A (en) | Mask forming method | |
JPS5568625A (en) | Preparing insb thin film pattern | |
JPS5534447A (en) | Preparation of semicinductor device | |
JPS6439029A (en) | Manufacture of semiconductor device | |
JPS56162838A (en) | Manufacture of semiconductor device |