JPS5638475A - Fabrication of photomask - Google Patents
Fabrication of photomaskInfo
- Publication number
- JPS5638475A JPS5638475A JP11370779A JP11370779A JPS5638475A JP S5638475 A JPS5638475 A JP S5638475A JP 11370779 A JP11370779 A JP 11370779A JP 11370779 A JP11370779 A JP 11370779A JP S5638475 A JPS5638475 A JP S5638475A
- Authority
- JP
- Japan
- Prior art keywords
- thin film
- resist film
- substrate plate
- mark
- standard
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Landscapes
- Preparing Plates And Mask In Photomechanical Process (AREA)
- Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
- Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
Abstract
PURPOSE: To obtain a photomask with high accuracy by a method wherein a metallic thin film on a predetermined place of a mask substrate plate is removed by etching to form a standard mark and electric beam is controlled by using this mark as a standard.
CONSTITUTION: By the standard mark provided on the mask substrate plate, the focusing of electric beam, the determination of an exposing position or the correction of lag are controlled. For example, the metal thin film 2 and a resist film 3 are provided on a glass substrate plate 1. A cross pattern 4 is provided to a predetermined position A, B, C, D of four corners on the resist film 3 and the metallic thin film 4 of that part is etched and removed by conventional light exposure and, thereafter, the resist film is removed by a solvent to obtain a standard mark 5A or the like. Moreover, a resist film 6 for electric beam exposure is coated. This base plate 7 of this mask is fixed to a base plate holder on a XY moving stage of an electron beam exposing apparatus and electron beam is irradiated and scanned. The position of the standard mark 5A or the like can be detected by the differential of electron irradiation coefficient of the glass substrate plate 1 and the etallic thin film 4 and various correcting controls can be carried out.
COPYRIGHT: (C)1981,JPO&Japio
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP11370779A JPS5638475A (en) | 1979-09-05 | 1979-09-05 | Fabrication of photomask |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP11370779A JPS5638475A (en) | 1979-09-05 | 1979-09-05 | Fabrication of photomask |
Publications (2)
Publication Number | Publication Date |
---|---|
JPS5638475A true JPS5638475A (en) | 1981-04-13 |
JPS636862B2 JPS636862B2 (en) | 1988-02-12 |
Family
ID=14619119
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP11370779A Granted JPS5638475A (en) | 1979-09-05 | 1979-09-05 | Fabrication of photomask |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS5638475A (en) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US6548213B2 (en) | 1988-11-22 | 2003-04-15 | Hitachi, Ltd. | Mask for manufacturing semiconductor device and method of manufacture thereof |
Families Citing this family (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP6482395B2 (en) | 2015-06-15 | 2019-03-13 | 株式会社ブリヂストン | Pneumatic tire |
Citations (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5251874A (en) * | 1975-10-22 | 1977-04-26 | Jeol Ltd | Electron beam exposure device |
-
1979
- 1979-09-05 JP JP11370779A patent/JPS5638475A/en active Granted
Patent Citations (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5251874A (en) * | 1975-10-22 | 1977-04-26 | Jeol Ltd | Electron beam exposure device |
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US6548213B2 (en) | 1988-11-22 | 2003-04-15 | Hitachi, Ltd. | Mask for manufacturing semiconductor device and method of manufacture thereof |
US6733933B2 (en) | 1988-11-22 | 2004-05-11 | Renesas Technology Corporation | Mask for manufacturing semiconductor device and method of manufacture thereof |
US7008736B2 (en) | 1988-11-22 | 2006-03-07 | Renesas Technology Corp. | Semiconductor integrated circuit device fabrication method using a mask having a phase shifting film covering region and an opening region |
Also Published As
Publication number | Publication date |
---|---|
JPS636862B2 (en) | 1988-02-12 |
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