JPS5617022A - Treating apparatus - Google Patents

Treating apparatus

Info

Publication number
JPS5617022A
JPS5617022A JP9155279A JP9155279A JPS5617022A JP S5617022 A JPS5617022 A JP S5617022A JP 9155279 A JP9155279 A JP 9155279A JP 9155279 A JP9155279 A JP 9155279A JP S5617022 A JPS5617022 A JP S5617022A
Authority
JP
Japan
Prior art keywords
wafers
unit
size
etching
sampled
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP9155279A
Other languages
English (en)
Japanese (ja)
Other versions
JPS647491B2 (cg-RX-API-DMAC7.html
Inventor
Hiroshi Maejima
Susumu Nanko
Atsushi Fujisawa
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hitachi Ltd
Original Assignee
Hitachi Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Ltd filed Critical Hitachi Ltd
Priority to JP9155279A priority Critical patent/JPS5617022A/ja
Publication of JPS5617022A publication Critical patent/JPS5617022A/ja
Publication of JPS647491B2 publication Critical patent/JPS647491B2/ja
Granted legal-status Critical Current

Links

Classifications

    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/18Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/30Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
    • H01L21/302Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
    • H01L21/306Chemical or electrical treatment, e.g. electrolytic etching

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • ing And Chemical Polishing (AREA)
  • Drying Of Semiconductors (AREA)
  • Weting (AREA)
JP9155279A 1979-07-20 1979-07-20 Treating apparatus Granted JPS5617022A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP9155279A JPS5617022A (en) 1979-07-20 1979-07-20 Treating apparatus

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP9155279A JPS5617022A (en) 1979-07-20 1979-07-20 Treating apparatus

Publications (2)

Publication Number Publication Date
JPS5617022A true JPS5617022A (en) 1981-02-18
JPS647491B2 JPS647491B2 (cg-RX-API-DMAC7.html) 1989-02-09

Family

ID=14029655

Family Applications (1)

Application Number Title Priority Date Filing Date
JP9155279A Granted JPS5617022A (en) 1979-07-20 1979-07-20 Treating apparatus

Country Status (1)

Country Link
JP (1) JPS5617022A (cg-RX-API-DMAC7.html)

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS60249328A (ja) * 1984-05-25 1985-12-10 Kokusai Electric Co Ltd 半導体ウエ−ハ用ドライエツチング・化学気相生成装置
JPS62147734A (ja) * 1985-12-23 1987-07-01 Toyo Setsubi Kogyo Kk ウエハのエツチング装置
US6860964B2 (en) * 1999-12-22 2005-03-01 Lg. Philips Lcd Co., Ltd. Etch/strip apparatus integrated with cleaning equipment
KR100877361B1 (ko) * 2001-12-18 2009-01-07 가부시끼가이샤 히다치 세이사꾸쇼 반도체제조장치 및 제조방법

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS60249328A (ja) * 1984-05-25 1985-12-10 Kokusai Electric Co Ltd 半導体ウエ−ハ用ドライエツチング・化学気相生成装置
JPS62147734A (ja) * 1985-12-23 1987-07-01 Toyo Setsubi Kogyo Kk ウエハのエツチング装置
US6860964B2 (en) * 1999-12-22 2005-03-01 Lg. Philips Lcd Co., Ltd. Etch/strip apparatus integrated with cleaning equipment
KR100877361B1 (ko) * 2001-12-18 2009-01-07 가부시끼가이샤 히다치 세이사꾸쇼 반도체제조장치 및 제조방법

Also Published As

Publication number Publication date
JPS647491B2 (cg-RX-API-DMAC7.html) 1989-02-09

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