JPS5617022A - Treating apparatus - Google Patents
Treating apparatusInfo
- Publication number
- JPS5617022A JPS5617022A JP9155279A JP9155279A JPS5617022A JP S5617022 A JPS5617022 A JP S5617022A JP 9155279 A JP9155279 A JP 9155279A JP 9155279 A JP9155279 A JP 9155279A JP S5617022 A JPS5617022 A JP S5617022A
- Authority
- JP
- Japan
- Prior art keywords
- wafers
- unit
- size
- etching
- sampled
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 235000012431 wafers Nutrition 0.000 abstract 7
- 238000005530 etching Methods 0.000 abstract 4
- 238000005259 measurement Methods 0.000 abstract 1
- 238000001020 plasma etching Methods 0.000 abstract 1
- 239000000758 substrate Substances 0.000 abstract 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
- H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
- H01L21/306—Chemical or electrical treatment, e.g. electrolytic etching
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- ing And Chemical Polishing (AREA)
- Drying Of Semiconductors (AREA)
- Weting (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP9155279A JPS5617022A (en) | 1979-07-20 | 1979-07-20 | Treating apparatus |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP9155279A JPS5617022A (en) | 1979-07-20 | 1979-07-20 | Treating apparatus |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS5617022A true JPS5617022A (en) | 1981-02-18 |
| JPS647491B2 JPS647491B2 (cg-RX-API-DMAC7.html) | 1989-02-09 |
Family
ID=14029655
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP9155279A Granted JPS5617022A (en) | 1979-07-20 | 1979-07-20 | Treating apparatus |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS5617022A (cg-RX-API-DMAC7.html) |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS60249328A (ja) * | 1984-05-25 | 1985-12-10 | Kokusai Electric Co Ltd | 半導体ウエ−ハ用ドライエツチング・化学気相生成装置 |
| JPS62147734A (ja) * | 1985-12-23 | 1987-07-01 | Toyo Setsubi Kogyo Kk | ウエハのエツチング装置 |
| US6860964B2 (en) * | 1999-12-22 | 2005-03-01 | Lg. Philips Lcd Co., Ltd. | Etch/strip apparatus integrated with cleaning equipment |
| KR100877361B1 (ko) * | 2001-12-18 | 2009-01-07 | 가부시끼가이샤 히다치 세이사꾸쇼 | 반도체제조장치 및 제조방법 |
-
1979
- 1979-07-20 JP JP9155279A patent/JPS5617022A/ja active Granted
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS60249328A (ja) * | 1984-05-25 | 1985-12-10 | Kokusai Electric Co Ltd | 半導体ウエ−ハ用ドライエツチング・化学気相生成装置 |
| JPS62147734A (ja) * | 1985-12-23 | 1987-07-01 | Toyo Setsubi Kogyo Kk | ウエハのエツチング装置 |
| US6860964B2 (en) * | 1999-12-22 | 2005-03-01 | Lg. Philips Lcd Co., Ltd. | Etch/strip apparatus integrated with cleaning equipment |
| KR100877361B1 (ko) * | 2001-12-18 | 2009-01-07 | 가부시끼가이샤 히다치 세이사꾸쇼 | 반도체제조장치 및 제조방법 |
Also Published As
| Publication number | Publication date |
|---|---|
| JPS647491B2 (cg-RX-API-DMAC7.html) | 1989-02-09 |
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