JPS647491B2 - - Google Patents
Info
- Publication number
- JPS647491B2 JPS647491B2 JP9155279A JP9155279A JPS647491B2 JP S647491 B2 JPS647491 B2 JP S647491B2 JP 9155279 A JP9155279 A JP 9155279A JP 9155279 A JP9155279 A JP 9155279A JP S647491 B2 JPS647491 B2 JP S647491B2
- Authority
- JP
- Japan
- Prior art keywords
- section
- etching
- wafer
- processing
- inspection
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- 238000012545 processing Methods 0.000 claims description 38
- 235000012431 wafers Nutrition 0.000 claims description 35
- 238000005530 etching Methods 0.000 claims description 32
- 238000007689 inspection Methods 0.000 claims description 26
- 238000000034 method Methods 0.000 claims description 16
- 238000005259 measurement Methods 0.000 claims description 4
- 238000004140 cleaning Methods 0.000 description 7
- 229910021420 polycrystalline silicon Inorganic materials 0.000 description 7
- 238000012546 transfer Methods 0.000 description 7
- 238000001020 plasma etching Methods 0.000 description 3
- 230000032258 transport Effects 0.000 description 3
- 229910004298 SiO 2 Inorganic materials 0.000 description 2
- 238000000576 coating method Methods 0.000 description 2
- 239000013078 crystal Substances 0.000 description 2
- 238000001312 dry etching Methods 0.000 description 2
- 239000012535 impurity Substances 0.000 description 2
- 150000002500 ions Chemical class 0.000 description 2
- 229920002120 photoresistant polymer Polymers 0.000 description 2
- 238000007781 pre-processing Methods 0.000 description 2
- 239000004065 semiconductor Substances 0.000 description 2
- 239000000758 substrate Substances 0.000 description 2
- 238000005406 washing Methods 0.000 description 2
- 238000001039 wet etching Methods 0.000 description 2
- OAICVXFJPJFONN-UHFFFAOYSA-N Phosphorus Chemical compound [P] OAICVXFJPJFONN-UHFFFAOYSA-N 0.000 description 1
- 238000010306 acid treatment Methods 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 238000005260 corrosion Methods 0.000 description 1
- 230000007797 corrosion Effects 0.000 description 1
- 238000011161 development Methods 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000002513 implantation Methods 0.000 description 1
- 238000009434 installation Methods 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 230000003287 optical effect Effects 0.000 description 1
- 229910052698 phosphorus Inorganic materials 0.000 description 1
- 239000011574 phosphorus Substances 0.000 description 1
- 238000005070 sampling Methods 0.000 description 1
- 239000005368 silicate glass Substances 0.000 description 1
- 239000007787 solid Substances 0.000 description 1
- 238000003860 storage Methods 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
- 238000011179 visual inspection Methods 0.000 description 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
- H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
- H01L21/306—Chemical or electrical treatment, e.g. electrolytic etching
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- ing And Chemical Polishing (AREA)
- Drying Of Semiconductors (AREA)
- Weting (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP9155279A JPS5617022A (en) | 1979-07-20 | 1979-07-20 | Treating apparatus |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP9155279A JPS5617022A (en) | 1979-07-20 | 1979-07-20 | Treating apparatus |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS5617022A JPS5617022A (en) | 1981-02-18 |
| JPS647491B2 true JPS647491B2 (cg-RX-API-DMAC7.html) | 1989-02-09 |
Family
ID=14029655
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP9155279A Granted JPS5617022A (en) | 1979-07-20 | 1979-07-20 | Treating apparatus |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS5617022A (cg-RX-API-DMAC7.html) |
Families Citing this family (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS60249328A (ja) * | 1984-05-25 | 1985-12-10 | Kokusai Electric Co Ltd | 半導体ウエ−ハ用ドライエツチング・化学気相生成装置 |
| JPH0736400B2 (ja) * | 1985-12-23 | 1995-04-19 | 東洋設備工業株式会社 | ウエハのエツチング装置 |
| KR100675316B1 (ko) * | 1999-12-22 | 2007-01-26 | 엘지.필립스 엘시디 주식회사 | 세정장비 일체형 에치/스트립 장치 |
| JP3686866B2 (ja) * | 2001-12-18 | 2005-08-24 | 株式会社日立製作所 | 半導体製造装置及び製造方法 |
-
1979
- 1979-07-20 JP JP9155279A patent/JPS5617022A/ja active Granted
Also Published As
| Publication number | Publication date |
|---|---|
| JPS5617022A (en) | 1981-02-18 |
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