JPS56164531A - Manufacture of semiconductor - Google Patents
Manufacture of semiconductorInfo
- Publication number
- JPS56164531A JPS56164531A JP6647880A JP6647880A JPS56164531A JP S56164531 A JPS56164531 A JP S56164531A JP 6647880 A JP6647880 A JP 6647880A JP 6647880 A JP6647880 A JP 6647880A JP S56164531 A JPS56164531 A JP S56164531A
- Authority
- JP
- Japan
- Prior art keywords
- electron beam
- substrate
- resist
- emission
- coated
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000004519 manufacturing process Methods 0.000 title 1
- 239000004065 semiconductor Substances 0.000 title 1
- 238000010894 electron beam technology Methods 0.000 abstract 6
- 239000000758 substrate Substances 0.000 abstract 4
- 206010034972 Photosensitivity reaction Diseases 0.000 abstract 2
- 238000010884 ion-beam technique Methods 0.000 abstract 2
- 230000036211 photosensitivity Effects 0.000 abstract 2
Classifications
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/70—Microphotolithographic exposure; Apparatus therefor
- G03F7/70425—Imaging strategies, e.g. for increasing throughput or resolution, printing product fields larger than the image field or compensating lithography- or non-lithography errors, e.g. proximity correction, mix-and-match, stitching or double patterning
- G03F7/7045—Hybrid exposures, i.e. multiple exposures of the same area using different types of exposure apparatus, e.g. combining projection, proximity, direct write, interferometric, UV, x-ray or particle beam
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
Landscapes
- Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- General Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
- Electron Beam Exposure (AREA)
- Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
Abstract
PURPOSE:To enhance the photosensitivity of a resist by emitting an electron beam to a resist film coated on a substrate to melt the part, forming a microminiature pattern by emitting photon of ion beam, electron beam, ultraviolet ray, X-ray or the like to the overall surface before or after the emission of the beam. CONSTITUTION:An electron beam from an electron gun is emitted through a lens, a diaphragm, a deflector or the like to a substrate placed on a stage and coated with a resist as ordinarily executed. When the emitted region is then molten to form a microminiature pattern of the resist film on a substrate, the following steps are performed. That is, 3X10<-5>/cm<3> of photon such as ion beam, electron beam, ultraviolet ray, X-ray or the like is emitted to the resist film 18 coated on the substrate 19 before or after the emission of the electron beam, and the thickness of the remaining film is restricted to the degree of larger than 0.5mum. Thus, the photosensitivity of the film is enhanced, and an extreme microminiature pattern can be obtained by the emission of the electron beam.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP6647880A JPS56164531A (en) | 1980-05-21 | 1980-05-21 | Manufacture of semiconductor |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP6647880A JPS56164531A (en) | 1980-05-21 | 1980-05-21 | Manufacture of semiconductor |
Publications (1)
Publication Number | Publication Date |
---|---|
JPS56164531A true JPS56164531A (en) | 1981-12-17 |
Family
ID=13316920
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP6647880A Pending JPS56164531A (en) | 1980-05-21 | 1980-05-21 | Manufacture of semiconductor |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS56164531A (en) |
Cited By (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5766633A (en) * | 1980-10-13 | 1982-04-22 | Oki Electric Ind Co Ltd | Pattern formation of fine processing resist |
JPS60171726A (en) * | 1984-02-06 | 1985-09-05 | インタ−ナショナル ビジネス マシ−ンズ コ−ポレ−ション | Method of producing semiconductor device |
JPS61287232A (en) * | 1985-06-14 | 1986-12-17 | Sony Corp | Resist exposing method |
JPS63185022A (en) * | 1987-01-27 | 1988-07-30 | Fujitsu Ltd | Forming method for pattern |
JPS63269529A (en) * | 1987-04-28 | 1988-11-07 | Canon Inc | Charged particle beam device |
JPS63269530A (en) * | 1987-04-28 | 1988-11-07 | Canon Inc | Charged particle beam device |
CN102972099A (en) * | 2010-07-09 | 2013-03-13 | Bsr股份有限公司 | X-ray generating device |
Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS52117077A (en) * | 1976-03-29 | 1977-10-01 | Fujitsu Ltd | Electron beam-exposing method |
JPS53147465A (en) * | 1977-05-27 | 1978-12-22 | Fujitsu Ltd | Forming method of patterns for lift-off |
JPS55138232A (en) * | 1979-04-12 | 1980-10-28 | Chiyou Lsi Gijutsu Kenkyu Kumiai | Drawing device |
JPS55165631A (en) * | 1979-06-12 | 1980-12-24 | Fujitsu Ltd | Manufacture of semiconductor device |
JPS561356A (en) * | 1979-06-20 | 1981-01-09 | Anritsu Corp | Logical-signal detection circuit |
-
1980
- 1980-05-21 JP JP6647880A patent/JPS56164531A/en active Pending
Patent Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS52117077A (en) * | 1976-03-29 | 1977-10-01 | Fujitsu Ltd | Electron beam-exposing method |
JPS53147465A (en) * | 1977-05-27 | 1978-12-22 | Fujitsu Ltd | Forming method of patterns for lift-off |
JPS55138232A (en) * | 1979-04-12 | 1980-10-28 | Chiyou Lsi Gijutsu Kenkyu Kumiai | Drawing device |
JPS55165631A (en) * | 1979-06-12 | 1980-12-24 | Fujitsu Ltd | Manufacture of semiconductor device |
JPS561356A (en) * | 1979-06-20 | 1981-01-09 | Anritsu Corp | Logical-signal detection circuit |
Cited By (10)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5766633A (en) * | 1980-10-13 | 1982-04-22 | Oki Electric Ind Co Ltd | Pattern formation of fine processing resist |
JPS6160574B2 (en) * | 1980-10-13 | 1986-12-22 | Oki Electric Ind Co Ltd | |
JPS60171726A (en) * | 1984-02-06 | 1985-09-05 | インタ−ナショナル ビジネス マシ−ンズ コ−ポレ−ション | Method of producing semiconductor device |
JPH0143451B2 (en) * | 1984-02-06 | 1989-09-20 | Intaanashonaru Bijinesu Mashiinzu Corp | |
JPS61287232A (en) * | 1985-06-14 | 1986-12-17 | Sony Corp | Resist exposing method |
JPS63185022A (en) * | 1987-01-27 | 1988-07-30 | Fujitsu Ltd | Forming method for pattern |
JPH0551169B2 (en) * | 1987-01-27 | 1993-07-30 | Fujitsu Ltd | |
JPS63269529A (en) * | 1987-04-28 | 1988-11-07 | Canon Inc | Charged particle beam device |
JPS63269530A (en) * | 1987-04-28 | 1988-11-07 | Canon Inc | Charged particle beam device |
CN102972099A (en) * | 2010-07-09 | 2013-03-13 | Bsr股份有限公司 | X-ray generating device |
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