JPS556404A - Forming method for pattern - Google Patents
Forming method for patternInfo
- Publication number
- JPS556404A JPS556404A JP7638478A JP7638478A JPS556404A JP S556404 A JPS556404 A JP S556404A JP 7638478 A JP7638478 A JP 7638478A JP 7638478 A JP7638478 A JP 7638478A JP S556404 A JPS556404 A JP S556404A
- Authority
- JP
- Japan
- Prior art keywords
- pattern
- etching
- heat resisting
- layer
- gold
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Abstract
PURPOSE: To form the excellent fine pattern, by forming the metallic layer and the heat resisting organic layer as the primary layer of the resist, and by applying the side etching to the heat resisting organic layer using the gas plasma, etc.
CONSTITUTION: The heat resisting organic film 2 is applied to the substrate 1, and the gold (Au) 3 is vacuum evaporated on this film 2, and the electron rays, X-rays resisting high resist 4 is applied to the gold layer. Next, the exposure resisting pattern 4a is formed by the electron rays, etc. Next, the etching of the gold 3 is executed through the resisting pattern 4a by means of the ion etching; hereby, the golden pattern 3a is formed. Next, the etching of the heat resisting organic film is executed by the oxygen gas plasma, for baring the pattern to be formed on the substrate 1. Then, the aim metallic material 5 (FeNi, etc., for instance) is vacuum evaporated over the entire surface, and further, the wet etching is applied to the heat resisting organic film 2a; hereby, the desired pattern 5a is obtained.
COPYRIGHT: (C)1980,JPO&Japio
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP7638478A JPS556404A (en) | 1978-06-26 | 1978-06-26 | Forming method for pattern |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP7638478A JPS556404A (en) | 1978-06-26 | 1978-06-26 | Forming method for pattern |
Publications (1)
Publication Number | Publication Date |
---|---|
JPS556404A true JPS556404A (en) | 1980-01-17 |
Family
ID=13603833
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP7638478A Pending JPS556404A (en) | 1978-06-26 | 1978-06-26 | Forming method for pattern |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS556404A (en) |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5943029A (en) * | 1982-08-02 | 1984-03-09 | フエアチアイルド・カメラ・アンド・インストルメント・コ−ポレ−シヨン | Lift-off wafer treatment |
JPS6071309U (en) * | 1983-10-19 | 1985-05-20 | 西川計測株式会社 | Gas-liquid separator |
Citations (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS52123871A (en) * | 1976-04-12 | 1977-10-18 | Hitachi Ltd | Thin film forming method |
-
1978
- 1978-06-26 JP JP7638478A patent/JPS556404A/en active Pending
Patent Citations (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS52123871A (en) * | 1976-04-12 | 1977-10-18 | Hitachi Ltd | Thin film forming method |
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5943029A (en) * | 1982-08-02 | 1984-03-09 | フエアチアイルド・カメラ・アンド・インストルメント・コ−ポレ−シヨン | Lift-off wafer treatment |
JPS6071309U (en) * | 1983-10-19 | 1985-05-20 | 西川計測株式会社 | Gas-liquid separator |
JPH0230001Y2 (en) * | 1983-10-19 | 1990-08-13 |
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