JPS57141641A - Formation of positive pattern - Google Patents
Formation of positive patternInfo
- Publication number
- JPS57141641A JPS57141641A JP56027481A JP2748181A JPS57141641A JP S57141641 A JPS57141641 A JP S57141641A JP 56027481 A JP56027481 A JP 56027481A JP 2748181 A JP2748181 A JP 2748181A JP S57141641 A JPS57141641 A JP S57141641A
- Authority
- JP
- Japan
- Prior art keywords
- layer
- resist
- etching
- worked
- pattern
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Classifications
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/004—Photosensitive materials
- G03F7/075—Silicon-containing compounds
- G03F7/0757—Macromolecular compounds containing Si-O, Si-C or Si-N bonds
Landscapes
- Physics & Mathematics (AREA)
- Spectroscopy & Molecular Physics (AREA)
- General Physics & Mathematics (AREA)
- Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
- Photosensitive Polymer And Photoresist Processing (AREA)
- Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
Abstract
PURPOSE:To easily dry etch a layer to be worked by using a resist prepared by mixing a positive type resist material with a specified polysilsesquioxane. CONSTITUTION:A substrate 1 having a formed layer 2 of SiO2 or the like to be worked is successively coated with the 1st resist layer 3 of polystyrene or the like with high etching resistance and the 2nd resist layer 4 having 0.3-0.7mum thickness and consisting of a positive type resist and a polysilsesquioxane represented by the formula ( where n is the degree of polymn; R1 is H, phenyl, 1-4C alkyl or CN; and R2 is phenyl, 1-4C alkyl or CN). The layer 4 is exposed to energy beams such as electron beams, X-rays or ion beams and developed, and the disclosed part of the layer 3 is removed by etching in oxygen plasma to form a pattern. The disclosed part of the layer 2 is then removed by etching with an etchant to form a positive pattern.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP56027481A JPS57141641A (en) | 1981-02-26 | 1981-02-26 | Formation of positive pattern |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP56027481A JPS57141641A (en) | 1981-02-26 | 1981-02-26 | Formation of positive pattern |
Publications (2)
Publication Number | Publication Date |
---|---|
JPS57141641A true JPS57141641A (en) | 1982-09-02 |
JPS6364771B2 JPS6364771B2 (en) | 1988-12-13 |
Family
ID=12222308
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP56027481A Granted JPS57141641A (en) | 1981-02-26 | 1981-02-26 | Formation of positive pattern |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS57141641A (en) |
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5965430A (en) * | 1982-10-06 | 1984-04-13 | Matsushita Electric Ind Co Ltd | Manufacture of semiconductor device |
EP0163538A2 (en) * | 1984-05-30 | 1985-12-04 | Fujitsu Limited | Pattern-forming material and its production and use |
WO1986005284A1 (en) * | 1985-03-07 | 1986-09-12 | Hughes Aircraft Company | Polysiloxane resist for ion beam and electron beam lithography |
-
1981
- 1981-02-26 JP JP56027481A patent/JPS57141641A/en active Granted
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5965430A (en) * | 1982-10-06 | 1984-04-13 | Matsushita Electric Ind Co Ltd | Manufacture of semiconductor device |
EP0163538A2 (en) * | 1984-05-30 | 1985-12-04 | Fujitsu Limited | Pattern-forming material and its production and use |
WO1986005284A1 (en) * | 1985-03-07 | 1986-09-12 | Hughes Aircraft Company | Polysiloxane resist for ion beam and electron beam lithography |
Also Published As
Publication number | Publication date |
---|---|
JPS6364771B2 (en) | 1988-12-13 |
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