JPS56127742A - Cu-mn alloy solder material free from generation of pinhole deficiency - Google Patents

Cu-mn alloy solder material free from generation of pinhole deficiency

Info

Publication number
JPS56127742A
JPS56127742A JP2994480A JP2994480A JPS56127742A JP S56127742 A JPS56127742 A JP S56127742A JP 2994480 A JP2994480 A JP 2994480A JP 2994480 A JP2994480 A JP 2994480A JP S56127742 A JPS56127742 A JP S56127742A
Authority
JP
Japan
Prior art keywords
solder material
alloy solder
pinhole
deficiency
generation
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP2994480A
Other languages
English (en)
Japanese (ja)
Other versions
JPS6236800B2 (enrdf_load_stackoverflow
Inventor
Masaki Morikawa
Hideaki Yoshida
Kunio Kishida
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Mitsubishi Metal Corp
Original Assignee
Mitsubishi Metal Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Mitsubishi Metal Corp filed Critical Mitsubishi Metal Corp
Priority to JP2994480A priority Critical patent/JPS56127742A/ja
Publication of JPS56127742A publication Critical patent/JPS56127742A/ja
Publication of JPS6236800B2 publication Critical patent/JPS6236800B2/ja
Granted legal-status Critical Current

Links

Classifications

    • BPERFORMING OPERATIONS; TRANSPORTING
    • B23MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23KSOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K35/00Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
    • B23K35/22Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
    • B23K35/24Selection of soldering or welding materials proper
    • B23K35/30Selection of soldering or welding materials proper with the principal constituent melting at less than 1550 degrees C
    • B23K35/302Cu as the principal constituent

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Conductive Materials (AREA)
  • Ceramic Products (AREA)
JP2994480A 1980-03-10 1980-03-10 Cu-mn alloy solder material free from generation of pinhole deficiency Granted JPS56127742A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2994480A JPS56127742A (en) 1980-03-10 1980-03-10 Cu-mn alloy solder material free from generation of pinhole deficiency

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2994480A JPS56127742A (en) 1980-03-10 1980-03-10 Cu-mn alloy solder material free from generation of pinhole deficiency

Publications (2)

Publication Number Publication Date
JPS56127742A true JPS56127742A (en) 1981-10-06
JPS6236800B2 JPS6236800B2 (enrdf_load_stackoverflow) 1987-08-08

Family

ID=12290092

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2994480A Granted JPS56127742A (en) 1980-03-10 1980-03-10 Cu-mn alloy solder material free from generation of pinhole deficiency

Country Status (1)

Country Link
JP (1) JPS56127742A (enrdf_load_stackoverflow)

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6064158A (ja) * 1983-09-19 1985-04-12 Sanyo Electric Co Ltd 太陽熱集熱器の製造方法
KR100379147B1 (ko) * 1995-02-02 2003-10-17 마츠다 가부시키가이샤 경질납땜방법
JP2012532759A (ja) * 2009-07-08 2012-12-20 ベルケンホフ ゲゼルシヤフト ミツト ベシユレンクテル ハフツング シートのろう付け補助材
CN108340092A (zh) * 2018-03-02 2018-07-31 华北水利水电大学 一种用于阳极钢爪修复的钎焊材料及其制备方法

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6064158A (ja) * 1983-09-19 1985-04-12 Sanyo Electric Co Ltd 太陽熱集熱器の製造方法
KR100379147B1 (ko) * 1995-02-02 2003-10-17 마츠다 가부시키가이샤 경질납땜방법
JP2012532759A (ja) * 2009-07-08 2012-12-20 ベルケンホフ ゲゼルシヤフト ミツト ベシユレンクテル ハフツング シートのろう付け補助材
CN108340092A (zh) * 2018-03-02 2018-07-31 华北水利水电大学 一种用于阳极钢爪修复的钎焊材料及其制备方法
CN108340092B (zh) * 2018-03-02 2020-01-10 华北水利水电大学 一种用于阳极钢爪修复的钎焊材料及其制备方法

Also Published As

Publication number Publication date
JPS6236800B2 (enrdf_load_stackoverflow) 1987-08-08

Similar Documents

Publication Publication Date Title
JPS5690942A (en) High-tensile electrically conductive copper alloy
JPS55134160A (en) Fe alloy with superior molten zinc erosion resistance
JPS56127742A (en) Cu-mn alloy solder material free from generation of pinhole deficiency
JPS56136951A (en) Brazing al material
JPS57187195A (en) Silver solder material
JPS5641096A (en) Low melting point cu-mn system soldering material having excellent wetting property and fluidity
JPS5760046A (en) Aluminum alloy for brazing
JPS5481777A (en) Lead frame structure with intermediate layer
JPS57171599A (en) Low melting point cu-ag system alloy solder with excellent wetting property
JPS5658941A (en) Solder alloy for sintered alloy
JPS5767142A (en) Low-temperature aluminum solder
JPS55152153A (en) Invar alloy having good welding property
JPS5770099A (en) Gold brazing filler metal
JPS5443151A (en) Metal solder
JPS53138954A (en) Metallic solder
JPS569095A (en) Low melting point hard solder material
JPS5326718A (en) Copper alloy for decorative purposes
JPS5319131A (en) Cu alloy for base material of composite electric contact
JPS56156736A (en) Co alloy with superior erosion resistance to molten zinc
JPS5471747A (en) Copper base brazing alloy
JPS57158349A (en) Copper alloy for resistance
JPS55100951A (en) Soldering alloy comprising aluminum and aluminum alloy
JPS53124148A (en) Metal solder
SU667365A1 (ru) Флюс дл лужени и пайки
JPS5579849A (en) Copper alloy with superior corrosion resistance and solderability